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1.发明授权公开(公告)号：US08531014B2
公开(公告)日：2013-09-10
申请号：US12890722
申请日：2010-09-27
IPC分类号： H01L23/495 , H01L23/34 , H01L29/40
CPC分类号： H01L23/142 , H01L21/4871 , H01L2224/83191 , H01L2924/12044 , H01L2924/1305 , H01L2924/13055 , H01L2924/1461 , H01L2924/00
摘要： A method and a system for minimizing carrier stress of a semiconductor device are provided. In one embodiment, a semiconductor device is provided comprising a carrier comprising a mesh coated with a metallic material, and a semiconductor chip disposed over the carrier.
摘要翻译： 提供了一种用于最小化半导体器件的载流子应力的方法和系统。 在一个实施例中，提供了包括载体的半导体器件，该载体包括涂覆有金属材料的网格，以及设置在载体上的半导体芯片。
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公开(公告)号：US09318473B2
公开(公告)日：2016-04-19
申请号：US13451930
申请日：2012-04-20
IPC分类号： H01L23/34 , H01L23/48 , H01L23/52 , H01L29/40 , H01L25/16 , H01L23/498 , H01L21/56 , H01L23/538 , H01L23/29 , H01L25/00 , H01L23/00
CPC分类号： H01L25/16 , H01L21/561 , H01L23/295 , H01L23/49805 , H01L23/5389 , H01L23/562 , H01L24/24 , H01L24/27 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/743 , H01L24/82 , H01L24/83 , H01L24/92 , H01L24/97 , H01L25/50 , H01L2224/24011 , H01L2224/2402 , H01L2224/24137 , H01L2224/245 , H01L2224/27312 , H01L2224/27318 , H01L2224/2732 , H01L2224/27416 , H01L2224/27422 , H01L2224/27438 , H01L2224/2784 , H01L2224/27848 , H01L2224/29076 , H01L2224/29078 , H01L2224/2919 , H01L2224/2929 , H01L2224/29387 , H01L2224/2939 , H01L2224/30505 , H01L2224/3201 , H01L2224/32225 , H01L2224/32245 , H01L2224/33505 , H01L2224/48091 , H01L2224/48137 , H01L2224/4814 , H01L2224/48151 , H01L2224/73265 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82105 , H01L2224/82106 , H01L2224/83192 , H01L2224/83801 , H01L2224/83825 , H01L2224/83856 , H01L2224/83862 , H01L2224/83951 , H01L2224/92244 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13062 , H01L2924/13091 , H01L2924/15787 , H01L2924/181 , H01L2224/82 , H01L2924/00012 , H01L2224/83 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： In a method of manufacturing a semiconductor device, a first semiconductor element is mounted on a carrier. A b-stage curable polymer is deposited on the carrier. A second semiconductor element is affixed on the polymer.
摘要翻译： 在制造半导体器件的方法中，第一半导体元件安装在载体上。 在载体上沉积b级可固化聚合物。 第二个半导体元件固定在聚合物上。
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公开(公告)号：US08947886B2
公开(公告)日：2015-02-03
申请号：US13186112
申请日：2011-07-19
CPC分类号： H01L24/83 , H01L24/00 , H01L24/24 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L2224/04026 , H01L2224/056 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/24226 , H01L2224/24246 , H01L2224/245 , H01L2224/2499 , H01L2224/26165 , H01L2224/27462 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/32245 , H01L2224/73217 , H01L2224/82002 , H01L2224/82101 , H01L2224/82345 , H01L2224/82385 , H01L2224/82986 , H01L2224/831 , H01L2224/83851 , H01L2224/92144 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01028 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047
摘要： An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
摘要翻译： 电子部件包括导电载体。 导电载体包括载体表面，半导体芯片包括芯片表面。 载体表面和芯片表面中的一个或两个包括非平面结构。 芯片附着到载体上，其芯片表面面向载体表面，使得由于载体表面和第一芯片表面中的一个或两个的非平面结构，在芯片表面和载体表面之间提供间隙 。 电子部件还包括位于间隙中的第一电沉积金属层。
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4.发明授权Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module 有权用于将金属表面附着到载体的方法，将芯片附接到芯片载体的方法，芯片封装模块和封装模块公开(公告)号：US08912450B2
公开(公告)日：2014-12-16
申请号：US13169219
申请日：2011-06-27
IPC分类号： H05K1/02 , H01L23/00 , H05K1/03 , H05K1/09 , H05K1/16 , H05K1/11 , H05K1/00 , H05K1/18 , H05K7/00
CPC分类号： H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/83193 , H01L2924/181 , Y10T156/10 , Y10T428/31536 , H01L2924/00
摘要： A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
摘要翻译： 提供了一种将金属表面附着到载体上的方法，该方法包括：在金属表面上形成第一聚合物层; 在所述载体的表面上形成第二聚合物层; 并且使第一聚合物层与第二聚合物层物理接触，使得在第一聚合物层和第二聚合物层之间形成互穿聚合物结构和互扩散聚合物结构中的至少一个。
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公开(公告)号：US08884434B2
公开(公告)日：2014-11-11
申请号：US12890721
申请日：2010-09-27
申请人： Manfred Mengel , Joachim Mahler , Khalil Hosseini
发明人： Manfred Mengel , Joachim Mahler , Khalil Hosseini
IPC分类号： H01L23/48 , H01L23/00 , H01L25/065
CPC分类号： H01L24/33 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/13 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/83 , H01L25/0657 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05618 , H01L2224/05647 , H01L2224/13 , H01L2224/13099 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2225/06568 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01327 , H01L2924/014 , H01L2924/0665 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/1461 , H01L2924/3656 , H01L2924/00 , H01L2924/00015 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/37099
摘要： A method and a system for improving reliability of a semiconductor device are provided. In one embodiment, a semiconductor device is provided comprising a semiconductor chip, a metallization layer comprising a metallic material disposed over a surface of the semiconductor chip, and an alloy layer comprising the metallic material disposed over the metallization layer.
摘要翻译： 提供了一种用于提高半导体器件的可靠性的方法和系统。 在一个实施例中，提供了包括半导体芯片的半导体器件，包括设置在半导体芯片的表面上的金属材料的金属化层以及包含设置在金属化层上的金属材料的合金层。
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公开(公告)号：US20130021766A1
公开(公告)日：2013-01-24
申请号：US13186112
申请日：2011-07-19
CPC分类号： H01L24/83 , H01L24/00 , H01L24/24 , H01L24/27 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L2224/04026 , H01L2224/056 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/06181 , H01L2224/24226 , H01L2224/24246 , H01L2224/245 , H01L2224/2499 , H01L2224/26165 , H01L2224/27462 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/32245 , H01L2224/73217 , H01L2224/82002 , H01L2224/82101 , H01L2224/82345 , H01L2224/82385 , H01L2224/82986 , H01L2224/831 , H01L2224/83851 , H01L2224/92144 , H01L2924/01327 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1461 , Y10T29/4913 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01028 , H01L2924/00012 , H01L2924/01029 , H01L2924/01047
摘要： An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
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7.发明申请METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE 有权用于将金属表面连接到载体的方法，用于将芯片连接到芯片载体的方法，芯片包装模块和包装模块公开(公告)号：US20120327614A1
公开(公告)日：2012-12-27
申请号：US13169219
申请日：2011-06-27
CPC分类号： H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/2919 , H01L2224/32225 , H01L2224/83193 , H01L2924/181 , Y10T156/10 , Y10T428/31536 , H01L2924/00
摘要： A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
摘要翻译： 提供了一种将金属表面附着到载体上的方法，该方法包括：在金属表面上形成第一聚合物层; 在所述载体的表面上形成第二聚合物层; 并且使第一聚合物层与第二聚合物层物理接触，使得在第一聚合物层和第二聚合物层之间形成互穿聚合物结构和互扩散聚合物结构中的至少一个。
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8.发明授权公开(公告)号：US09313897B2
公开(公告)日：2016-04-12
申请号：US13620202
申请日：2012-09-14
CPC分类号： H01L23/293 , C25D13/06 , C25D13/12 , H01L21/4825 , H01L21/56 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/4952 , H01L23/49562 , H01L23/49582 , H01L23/49586 , H01L23/573 , H01L24/37 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/84 , H01L24/85 , H01L2224/2919 , H01L2224/32245 , H01L2224/37124 , H01L2224/37139 , H01L2224/37144 , H01L2224/37147 , H01L2224/40245 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73263 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83801 , H01L2224/8492 , H01L2224/8592 , H01L2224/92246 , H01L2224/92247 , H01L2924/01322 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H05K3/284 , H05K2203/135 , Y10T29/49144 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.
摘要翻译： 公开了封装组件和制造封装组件的方法。 在一个实施例中，封装部件包括具有部件载体接触件和设置在部件载体上的部件的部件载体，该部件具有部件接触。 封装部件还包括将部件载体接触件与部件接触件连接的导电连接元件，直接设置在部件或导电连接元件的顶表面中的至少一个上的绝缘膜，以及封装部件载体的密封剂， 组件和封闭的导电连接元件。
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公开(公告)号：US09093416B2
公开(公告)日：2015-07-28
申请号：US13304795
申请日：2011-11-28
申请人： Manfred Mengel , Thomas Wowra , Joachim Mahler , Khalil Hosseini
发明人： Manfred Mengel , Thomas Wowra , Joachim Mahler , Khalil Hosseini
IPC分类号： H01L23/495 , H01L23/02 , H01L23/28 , H01L23/29 , H01L23/48 , H01L23/52 , H01L29/40 , H01L23/367 , H01L23/00
CPC分类号： H01L23/3677 , H01L24/19 , H01L24/20 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/32245 , H01L2224/73267 , H01L2224/82005 , H01L2224/82039 , H01L2224/82101 , H01L2224/96 , H01L2924/12032 , H01L2924/12042 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/18162 , H01L2924/00 , H01L2224/82 , H01L2924/00014
摘要： A chip-package includes a chip-carrier configured to carry a chip, the chip arranged over a chip-carrier side, wherein the chip-carrier side is configured in electrical connection with a chip back side; an insulation material including: a first insulation portion formed over a first chip lateral side; a second insulation portion formed over a second chip lateral side, wherein the first chip lateral side and the second chip lateral side each abuts opposite edges of the chip back side; and a third insulation portion formed over at least part of a chip front side, the chip front side including one or more electrical contacts formed within the chip front side; wherein at least part of the first insulation portion is arranged over the chip-carrier side and wherein the first insulation portion is configured to extend in a direction perpendicular to the first chip lateral side further than the chip-carrier.
摘要翻译： 芯片组包括芯片载体，芯片载体被配置为承载芯片，芯片布置在芯片载体侧上，其中芯片载体侧被配置为与芯片背面电连接; 绝缘材料，包括：形成在第一芯片侧面上的第一绝缘部分; 形成在第二芯片侧面上的第二绝缘部，其中所述第一芯片侧面和所述第二芯片侧面各自邻接所述芯片背面的相对边缘; 以及第三绝缘部分，形成在芯片前侧的至少一部分上，所述芯片前侧包括形成在所述芯片前侧内的一个或多个电触头; 其中所述第一绝缘部分的至少一部分布置在所述芯片载体侧上，并且其中所述第一绝缘部分被配置为在垂直于所述第一芯片横向侧的方向上比所述芯片载体更远。
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公开(公告)号：US09021887B2
公开(公告)日：2015-05-05
申请号：US13329618
申请日：2011-12-19
申请人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
发明人： Franz-Peter Kalz , Horst Theuss , Bernhard Winkler , Khalil Hosseini , Joachim Mahler , Manfred Mengel
CPC分类号： B81B7/02 , B81B3/0021 , B81B3/0072 , B81B2201/0235 , B81B2201/0264 , B81C2203/0154 , G01L1/18 , G01L9/0072 , G01L19/0092 , G01L19/02
摘要： Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
摘要翻译： 微机械半导体感测装置包括被配置为产生电感测信号的微机械感测结构和设置在微机械感测结构中的压阻感测装置，所述压阻感测装置被布置成感测扰动电感测信号的机械应力，并被配置为 基于感测到的电感测信号的机械应力产生电干扰信号。
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