利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

19 条记录 (耗时 0.036 秒)

    Solder alloy and soldered bond
    1.
    发明授权
    Solder alloy and soldered bond 有权
    焊接合金和焊接焊接

    公开(公告)号：US06893512B2

    公开(公告)日：2005-05-17

    申请号：US10356546

    申请日：2003-02-03

    申请人： Masayuki Kitajima ,  Tadaaki Shono ,  Masakazu Takesue ,  Yutaka Noda

    发明人： Masayuki Kitajima ,  Tadaaki Shono ,  Masakazu Takesue ,  Yutaka Noda

    IPC分类号： B23K35/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

    CPC分类号： B23K35/262 ,  B23K35/025 ,  B23K2101/36 ,  H05K3/3463

    摘要： A solder alloy having a solderability comparable to that of a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and a soldered bond using the same. A solder alloy consisting of Zn: 4.0-10.0 wt %, In: 1.0 to 15.0 wt %, Al: 0.0020 to 0.0100 wt %, and the balance of Sn and unavoidable impurities. A soldered bond of an electric or electronic device composed of the above solder alloy.

    摘要翻译： 具有与常规Pb-Sn焊料合金相当的可焊性的焊料合金，而不会对环境产生不利影响，并且使用焊料合金。 由Zn：4.0〜10.0重量％，In：1.0〜15.0重量％，Al：0.0020〜0.0100重量％，Sn和不可避免的杂质构成的焊料合金。 由上述焊料合金构成的电气或电子设备的焊接结合体。

    Solder alloy and soldered bond
    2.
    发明授权
    Solder alloy and soldered bond 有权
    焊接合金和焊接焊接

    公开(公告)号：US06361626B1

    公开(公告)日：2002-03-26

    申请号：US09839371

    申请日：2001-04-23

    申请人： Masayuki Kitajima ,  Hitoshi Homma ,  Masakazu Takesue ,  Tadaaki Shono ,  Yutaka Noda

    发明人： Masayuki Kitajima ,  Hitoshi Homma ,  Masakazu Takesue ,  Tadaaki Shono ,  Yutaka Noda

    IPC分类号： C22C1300

    CPC分类号： C22C13/00 ,  B23K35/262 ,  C22C13/02

    摘要： A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.

    摘要翻译： 无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。 本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。 本发明的焊接键由本发明的焊料合金中的任一种组成。

    Soldering method and soldered joint
    4.
    发明授权
    Soldering method and soldered joint 有权

    公开(公告)号：US06428911B2

    公开(公告)日：2002-08-06

    申请号：US09930245

    申请日：2001-08-16

    申请人： Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono ,  Motoko Fujioka

    发明人： Masayuki Kitajima ,  Masakazu Takesue ,  Tadaaki Shono ,  Motoko Fujioka

    IPC分类号： B23K120

    CPC分类号： B23K35/262 ,  B23K1/002 ,  B23K1/20 ,  H05K3/282 ,  H05K3/3463 ,  Y10T428/12903

    摘要： The present invention provides a soldering method and a soldered joint securing a strength of joint equivalent to soldering using a conventional Pb—Sn solder alloy without having a detrimental effect on the environment and without causing a rise in cost. A soldering method comprising a step of covering Cu electrodes of electronic equipment by a rust-proofing coating consisting of an organic compound including N and a step of forming soldered joints on the covered Cu electrodes, by using a solder material consisting of at least 2.0 wt % and less than 3 wt % of Ag, 0.5 to 0.8 wt % of Cu, and a balance of Sn and unavoidable impurities. The solder material used in the present invention further contains not more than 3 wt % in total of at least one element selected from the group consisting of Sb, In, Au, Zn, Bi, and Al.

    Method of assembling micro-actuator
    6.
    发明授权
    Method of assembling micro-actuator 失效
    组合微致动器的方法

    公开(公告)号：US06467141B2

    公开(公告)日：2002-10-22

    申请号：US09820553

    申请日：2001-03-29

    申请人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

    发明人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

    IPC分类号： H04R1710

    CPC分类号： G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

    摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

    摘要翻译： 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。