公开(公告)号：US20170019996A1

公开(公告)日：2017-01-19

申请号：US15124499

申请日：2015-02-27

Applicant: SONY CORPORATION

Inventor： Toshihiko WATANABE

IPC: H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/116 ,  H01L21/486 ,  H01L23/49827 ,  H01L33/48 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/1531 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/112 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3489 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/09154 ,  H05K2201/0959 ,  H05K2201/09863 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1383 ,  H05K2203/1394 ,  Y02P70/613

Abstract: A mounting substrate includes a through-hole 13 formed in a substrate 10, a first land part 21, a second land part 31, a first component attaching part 22, a second component attaching part 32, a conductive layer 14, and a filling member 15 filled into a part of the through-hole 13. A shortest distance allowable value L0 from the center of the first land part 21 to a component 51 is determined on the basis of the volume Vh of a part of the through-hole 15 positioned above a top surface of the filling member 15 on the side of the first land part 21, the length L1 of the component 51 to be mounted to the first component attaching part 22, and the maximum allowable value of the inclination of the component 51 to be mounted to the first component attaching part 22 relative to the first surface 11 of the substrate 10.

Abstract translation: 安装基板包括形成在基板10中的通孔13，第一接地部21，第二接地部31，第一部件安装部22，第二部件安装部32，导电层14和填充部件 15被填充到通孔13的一部分中。从第一陆部21的中心到部件51的最短距离允许值L0基于定位的通孔15的一部分的体积Vh来确定 在第一接地部21侧的填充部件15的上表面上，要安装到第一部件安装部22的部件51的长度L1和部件51的倾斜度的最大允许值为 相对于基板10的第一表面11安装到第一部件安装部22。

公开(公告)号：US20170015435A1

公开(公告)日：2017-01-19

申请号：US15209895

申请日：2016-07-14

Applicant: Goodrich Lighting Systems GmbH

Inventor： Anil Kumar Jha ,  Norbert Menne ,  Elmar Schrewe ,  Robert Trinschek ,  Andre Hessling-von Heimendahl

IPC: B64D47/02 ,  F21V23/04 ,  H05K1/18

CPC classification number: B64D47/02 ,  F21V23/04 ,  H05K1/053 ,  H05K1/056 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10106 ,  H05K2201/10484 ,  Y02P70/611

Abstract: An aircraft LED light unit comprises at least one printed circuit board which comprises at least one metal core layer and at least one dielectric layer, and at least one LED disposed on the printed circuit board and which comprises an anode and a cathode for electrically coupling to a power source. One of the anode and cathode of the at least one LED is connected to an electrical conductor which is disposed on the dielectric layer and is coupled to a first terminal of the power source, wherein the dielectric layer electrically isolates the electrical conductor from the metal core layer, and the other one of the anode and cathode of the at least one LED is connected to the metal core layer of the at least one printed circuit board, wherein the metal core layer is coupled to a second terminal of the power source.

Abstract translation: 飞机LED灯单元包括至少一个包括至少一个金属芯层和至少一个介电层的印刷电路板，以及布置在印刷电路板上的至少一个LED，并且包括用于电耦合到 电源。 至少一个LED的阳极和阴极之一连接到电导体，电导体设置在电介质层上并且耦合到电源的第一端子，其中电介质层将电导体与金属芯电隔离 层，并且所述至少一个LED的阳极和阴极中的另一个连接到所述至少一个印刷电路板的金属芯层，其中所述金属芯层耦合到所述电源的第二端子。

公开(公告)号：US20160282291A1

公开(公告)日：2016-09-29

申请号：US15074499

申请日：2016-03-18

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuu YAMAYOSE ,  Tetsuya KUGIMIYA

IPC: G01N27/20 ,  G01N27/04 ,  G01N25/72

CPC classification number: G01N27/20 ,  G01N27/045 ,  H05K1/0268 ,  H05K3/30 ,  H05K3/34 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.

Abstract translation: 根据一个实施例，电子设备包括电路板，电气部件和测量单元。 电路板有第一面。 电气部件包括通过接合材料电连接到第一面的第二面，沿着第二面的沿第一方向的第一端和第二端。 第二端与第一方向的第一端相反。 测量单元被配置为测量根据接合材料的导电性而变化的特性。 第一面和第一端之间的第一距离比第一面和第二端之间的第二距离短。 测量单元包括被配置为测量接合材料的一部分的特性的第一测量单元。 该部分与第一端相邻。

公开(公告)号：US09297971B2

公开(公告)日：2016-03-29

申请号：US14047978

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Ashok V. Krishnamoorthy ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Ronald Ho ,  Ivan Shubin ,  John E. Cunningham

IPC: G02B6/42 ,  H01L25/065 ,  H01L23/00 ,  H01L23/498 ,  H05K3/36

CPC classification number: G02B6/4274 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are proximate to each other in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a top surface of an interposer, and this top surface is in turn electrically coupled to a front surface of an input/output (I/O) integrated circuit that faces the top surface. Furthermore, the front surface of the I/O integrated circuit is electrically coupled to a top surface of the optical integrated circuit, where the top surface of the optical integrated circuit faces the front surface of the I/O integrated circuit.

Abstract translation: 芯片封装包括在芯片封装中彼此靠近的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面电耦合到插入件的顶表面，并且该顶表面又电耦合到面向顶表面的输入/输出（I / O）集成电路的前表面 。 此外，I / O集成电路的前表面电耦合到光集成电路的顶表面，其中光集成电路的顶表面面向I / O集成电路的前表面。

公开(公告)号：US09078361B2

公开(公告)日：2015-07-07

申请号：US13575036

申请日：2011-01-31

Applicant: Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

Inventor： Gerardus Titus Van Heck ,  Margaretha Maria De Kok ,  Jeroen Van Den Brand

IPC: H05K1/02 ,  H01L27/32 ,  H01L51/52 ,  H01R4/70 ,  H05K3/36 ,  H05B33/08 ,  H05B33/10 ,  H05K13/04 ,  H01L31/0392 ,  H01L31/042 ,  G09F9/00 ,  G09F19/22 ,  H01R4/04 ,  H01R12/70 ,  H05K1/03 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly is provided of an electro-physical transducer (10) on a flexible foil (20) with a carrier (40). The flexible foil (20) has a first main surface (22) provided with at least a first electrically conductive track (24) connected to the electro-physical transducer and opposite said first main surface a second main surface (23) facing towards the carrier. At least a first incision (25a) extends through the flexible foil alongside said at least a first electrically conductive track, therewith defining a strip shaped portion (27) of the flexible foil that carries a portion of the at least a first electrically conductive track. The at least a first electrically conductive track is electrically connected to an electrical conductor (421) of the carrier, and the flexible foil is attached to the carrier with its strip shaped portion.

Abstract translation: 在具有载体（40）的柔性箔（20）上提供由电 - 物理传感器（10）组成的组件。 柔性箔（20）具有第一主表面（22），第一主表面（22）设置有至少第一导电轨道（24），第一导电轨道（24）连接到电物理换能器并与所述第一主表面相对，第二主表面（23）面向载体 。 至少第一切口（25a）沿着所述至少第一导电轨道延伸穿过柔性箔片，从而限定柔性箔片的带状部分（27），其承载至少第一导电轨道的一部分。 至少第一导电轨道电连接到载体的电导体（421），并且柔性箔片与其带状部分连接到载体上。

公开(公告)号：US20140321803A1

公开(公告)日：2014-10-30

申请号：US14047910

申请日：2013-10-07

Applicant: Oracle International Corporation

Inventor： Hiren D. Thacker ,  Frankie Y. Liu ,  Robert David Hopkins, II ,  Jon Lexau ,  Xuezhe Zheng ,  Guoliang Li ,  Ivan Shubin ,  Ronald Ho ,  John E. Cunningham ,  Ashok V. Krishnamoorthy

IPC: G02B6/12

CPC classification number: G02B6/4274 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/72 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/0401 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/72 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06534 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/37001 ,  H05K3/36 ,  H05K2201/10484 ,  H01L2924/00

Abstract: A chip package includes an optical integrated circuit (such as a hybrid integrated circuit) and an integrated circuit that are adjacent to each in the chip package. The integrated circuit includes electrical circuits, such as memory or a processor, and the optical integrated circuit communicates optical signals with very high bandwidth. Moreover, a front surface of the integrated circuit is electrically coupled to a front surface of the optical integrated circuit by a top surface of the interposer, where the top surface faces the front surface of the integrated circuit and the front surface of the optical integrated circuit. Furthermore, the integrated circuit and the optical integrated circuit may be on a same side of the interposer. By integrating the optical integrated circuit and the integrated circuit in close proximity, the chip package may facilitate improved performance compared to chip packages with electrical interconnects.

Abstract translation: 芯片封装包括与芯片封装中的每一个相邻的光学集成电路（例如混合集成电路）和集成电路。 集成电路包括诸如存储器或处理器的电路，并且光学集成电路传送具有非常高带宽的光信号。 此外，集成电路的前表面通过插入件的顶表面电耦合到光集成电路的前表面，其中顶表面面向集成电路的前表面和光集成电路的前表面 。 此外，集成电路和光集成电路可以在插入器的同一侧上。 通过将光集成电路和集成电路集成在一起，与具有电互连的芯片封装相比，芯片封装可以有助于提高性能。

公开(公告)号：US20130201636A1

公开(公告)日：2013-08-08

申请号：US13574630

申请日：2011-01-31

Applicant: Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

Inventor： Jeroen Van Den Brand ,  Gerardus Titus Van Heck ,  Margaretha Maria De Kok

IPC: H05K1/02 ,  H05K13/04

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: An assembly of a plurality of tiles (1) with a carrier (40). The tiles (1) comprise a foil (20) with an electro-physical transducer (10) and electrical connectors (24, 28) to said transducer. The tiles are mechanically and electrically coupled to the carrier in a connection portion (1c) of said tiles.

Abstract translation: 具有载体（40）的多个瓦片（1）的组件。 瓦片（1）包括具有电物理换能器（10）的箔（20）和到所述换能器的电连接器（24,28）。 所述瓦片在所述瓦片的连接部分（1c）中机械地和电耦合到所述载体。

公开(公告)号：US08425083B2

公开(公告)日：2013-04-23

申请号：US12599040

申请日：2007-11-19

Applicant: Zhiyong Liu

Inventor： Zhiyong Liu

IPC: F21V21/00

CPC classification number: F21S8/086 ,  F21K9/00 ,  F21S8/085 ,  F21S9/03 ,  F21V19/001 ,  F21V29/507 ,  F21W2131/103 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  Y02B20/72

Abstract: A LED directional illumination energy-saving luminaire and a manufacturing method thereof. The luminaire comprises: a circuit board with an X direction and a Y direction defined; and illumination units including a first illumination unit arranged at the center of the circuit board, and two second illumination units arranged at both sides of the first illumination unit. Each illumination unit includes LEDs mounted to said circuit board in a tilted state with said LED bodies positioned at a predetermined height from the circuit board, and said LEDs are arranged at intervals in an array along said X direction and Y direction and distributed with respect to the center of said array. Each LED deviates from both X and Y directions at a predeterminative angle, so that the illumination units can form predeterminative project angles in the X direction and the Y direction respectively.

Abstract translation: 一种LED定向照明节能灯及其制造方法。 灯具包括：具有X方向和Y方向限定的电路板; 以及包括布置在电路板的中心的第一照明单元的照明单元和布置在第一照明单元两侧的两个第二照明单元。 每个照明单元包括以倾斜状态安装到所述电路板的LED，其中所述LED主体位于距电路板的预定高度处，并且所述LED沿着所述X方向和Y方向以间隔排列布置，并且相对于 该阵列的中心。 每个LED以预定角度偏离X和Y方向，使得照明单元可以分别在X方向和Y方向上形成预定的投影角。

公开(公告)号：US08398214B2

公开(公告)日：2013-03-19

申请号：US12392270

申请日：2009-02-25

Applicant: Katsuhiro Okubo

Inventor： Katsuhiro Okubo

IPC: B41J2/045

CPC classification number: B41J2/14233 ,  B41J2002/14491 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10484

Abstract: There is provided a liquid ejecting head including a channel forming member in which a pressure generating chamber is provided, a piezoelectric element that is provided at one surface side of the channel forming member, a terminal portion electrically connected to the piezoelectric element; the terminal portion being provided at the one surface side of the channel forming member, a wiring substrate which has a wiring layer, and an adhesive layer for electrically connecting the wiring layer and the terminal portion and for combing the wiring substrate and the channel forming member, the adhesive layer being formed by an anisotropic conductive material. A gap layer that is electrically discontinuous with the terminal portion and the wiring layer is provided on at least one surface of the channel forming member and the wiring substrate in an area in which the adhesive layer is provided.

Abstract translation: 提供了一种液体喷射头，其包括设置有压力发生室的通道形成构件，设置在通道形成构件的一个表面侧的压电元件，电连接到压电元件的端子部分; 所述端子部分设置在所述沟道形成构件的一个表面侧，具有布线层的布线基板和用于电连接所述布线层和所述端子部分并用于梳理所述布线基板和所述沟道形成构件的粘合剂层 ，粘合剂层由各向异性导电材料形成。 在设置有粘合剂层的区域中，在沟道形成构件和布线基板的至少一个表面上设置与端子部和布线层不连续的间隙层。

公开(公告)号：US08177577B2

公开(公告)日：2012-05-15

申请号：US12453718

申请日：2009-05-20

Applicant: Michimasa Takahashi

Inventor： Michimasa Takahashi

IPC: H05K1/11

CPC classification number: H05K1/183 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/141 ,  H05K1/142 ,  H05K1/185 ,  H05K3/4602 ,  H05K3/4694 ,  H05K2201/10484 ,  H05K2203/049 ,  Y10T29/49126 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.

Abstract translation: 印刷布线板包括具有凹部和多个导体的第一基板，具有多个导体的第二基板，并插入在第一基板的凹部中，使得第一基板具有暴露出第一基板的表面的至少一部分的表面 第二基板。 第一衬底中的多个导体电连接到第二衬底中的多个导体，并且第二衬底具有比第一衬底的导体的密度高的导体的密度。