公开(公告)号：US20240260192A1

公开(公告)日：2024-08-01

申请号：US18517388

申请日：2023-11-22

Applicant: Samsung Display Co., LTD.

Inventor： KYUNG-MOK LEE ,  YOUNGMIN CHO ,  DONG-YOUB LEE

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10537

Abstract: A display device includes a display panel and a circuit board. The display panel includes a display region and a bonding region. A plurality of pixels is disposed in the display region. The bonding region is spaced apart from the display region in a first direction. A plurality of pad electrodes is disposed in the bonding region. The circuit board is disposed on the display panel. The circuit board includes a first portion overlapping the display panel between the display region and the bonding region in a plan view. Accordingly, a dead space of the display device may be reduced, and a region in which a battery or the like is disposed in the display device may be secured by reducing an area in which the circuit board is disposed after the display panel is bent.

公开(公告)号：US12033996B2

公开(公告)日：2024-07-09

申请号：US17026740

申请日：2020-09-21

Applicant: D-Wave Systems Inc.

Inventor： Kelly T. R. Boothby

IPC: H01L25/18 ,  H01L23/00 ,  H01L25/00 ,  H05K1/18

CPC classification number: H01L25/18 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H05K1/181 ,  H05K1/182 ,  H01L2224/16145 ,  H01L2224/16238 ,  H01L2224/17155 ,  H01L2224/17505 ,  H01L2224/81815 ,  H05K2201/09072 ,  H05K2201/1053 ,  H05K2201/10537

Abstract: This disclosure generally relates to processor systems comprising printed circuit boards, I/O chips and processor chips with mated contacts. Contacts are formed on an upper surface of a printed circuit board having a through-hole and on a processor chip inside the through-hole. The processor chip may be a superconducting quantum processor chip comprising qubits, couplers, Digital to Analog converters, QFP shift registers and analog lines. Contacts are formed on an upper surface on an I/O chip and mated with the contacts on the printed circuit board and the processor chip. Contacts may be Indium bump bonds or superconducting solder bonds. The processor chip and the I/O chip may include a shield layer, a substrate layer and a thermally conductive layer.

公开(公告)号：US20240222252A1

公开(公告)日：2024-07-04

申请号：US18464259

申请日：2023-09-10

Applicant: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Inventor： Yuhua YANG

IPC: H01L23/498 ,  H01L23/13 ,  H01L23/544 ,  H05K1/18

CPC classification number: H01L23/49838 ,  H01L23/13 ,  H01L23/49833 ,  H01L23/544 ,  H05K1/18 ,  H01L2223/54426 ,  H05K2201/10128 ,  H05K2201/10378 ,  H05K2201/1053 ,  H05K2201/10537

Abstract: Display modules and chip on films are provided. The chip on film includes a body part and a first reinforcing part. The body part includes a first bonding portion, a second bonding portion, and a connecting portion connected between the first and second bonding portions. The first reinforcing part is connected to the first bonding portion and includes a first extending portion extending from at least one end of the first bonding portion in a direction away from the first bonding portion. The first bonding portion is provided with first bonding terminals arranged at intervals, the second bonding portion is provided with second bonding terminals arranged at intervals, the first extending portion is provided with at least one third bonding terminal, each first bonding terminal is electrically connected to a corresponding second bonding terminal, and the third bonding terminal is insulated from the second bonding terminals.

公开(公告)号：US20230254978A1

公开(公告)日：2023-08-10

申请号：US18134376

申请日：2023-04-13

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shuang ZHANG ,  Xiaoxia HUANG ,  Jiangsheng WANG ,  Jianjun WU ,  Xuerui GONG ,  Bing JI

IPC: H05K1/18 ,  G06F3/041 ,  H01L25/18 ,  H05K1/02 ,  H10K50/87

CPC classification number: H05K1/189 ,  G06F3/0412 ,  H01L25/18 ,  H05K1/0281 ,  H10K50/87 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10537 ,  H05K2201/2009 ,  H10K2102/311

Abstract: A display device is provided. The display device includes: a display substrate having a non-display side, a first driver being provided at the non-display side of the display substrate; a touch module comprising a touch layer and a touch flexible circuit board connected with the touch layer, the touch flexible circuit board comprising a flat portion located at a side of the second portion away from the first portion and a second bent portion for connecting the touch layer and the flat portion; and a supporting wall between the flat portion of the touch flexible circuit board and the second portion of the display substrate, and the supporting wall is located on at least one side of the first driver in a direction parallel to the flat portion of the touch flexible circuit board.

公开(公告)号：US09577169B2

公开(公告)日：2017-02-21

申请号：US14075122

申请日：2013-11-08

Applicant: Richard Speer

Inventor： Richard Speer

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/00 ,  H01L33/60 ,  H05K3/20 ,  H05K3/28 ,  H05K3/30 ,  H05K1/18

CPC classification number: H01L33/62 ,  H01L27/15 ,  H01L33/005 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/202 ,  H05K3/281 ,  H05K3/303 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/1053 ,  H05K2201/10537 ,  H05K2203/063 ,  Y02P70/613 ,  H01L2924/00

Abstract: Techniques are disclosed for integrating the LED lead frame into the LED circuit fabrication process. The LED packages within the lead frame may be spaced according to the final spacing of the LED packages on the finished circuit board, such that multiple LED packages may be attached to a circuit board at a time by applying the lead frame to circuit board and then removing portions of the lead frame, leaving the LED packages attached to the board. The LED packages may be attached using solder or conductive epoxy, in some embodiments. Alternatively, part of the lead frame may include conductive wires forming one or more strings of LED packages. An entire string of LED packages may then be removed from the lead frame in a single motion and placement may be performed for a string of LED packages all at once rather than for individual LED packages.

Abstract translation: 公开了将LED引线框架集成到LED电路制造工艺中的技术。 引线框架内的LED封装可以根据成品电路板上的LED封装件的最终间距间隔开，以便通过将引线框架施加到电路板上而将多个LED封装件一次连接到电路板，然后 去除引线框架的部分，留下附接到板的LED封装。 在一些实施例中，LED封装可以使用焊料或导电环氧树脂附着。 或者，引线框架的一部分可以包括形成一个或多个LED封装串的导线。 然后可以以单个运动从引线框架中移除整串LED封装，并且可以一次性地对一串LED封装执行放置，而不是针对各个LED封装。

公开(公告)号：US09451701B2

公开(公告)日：2016-09-20

申请号：US14594083

申请日：2015-01-10

Applicant: CYNTEC CO., LTD.

Inventor： Da-Jung Chen ,  Chun-Tiao Liu ,  Bau-Ru Lu

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01F27/02 ,  H05K3/34 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00

CPC classification number: H05K1/181 ,  H01F27/022 ,  H01F27/027 ,  H01F27/24 ,  H01F27/29 ,  H01F27/40 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.

公开(公告)号：US20150268738A1

公开(公告)日：2015-09-24

申请号：US14640313

申请日：2015-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyunghoon SONG ,  Jungje BANG ,  Kicheol BAE ,  Kwangsub LEE ,  Seyoung JANG

IPC: G06F3/02

CPC classification number: G06F3/0202 ,  H01H13/48 ,  H01H2215/004 ,  H01H2215/036 ,  H01H2221/05 ,  H01R13/703 ,  H01R24/62 ,  H05K1/184 ,  H05K2201/09163 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10537

Abstract: An input device may include: (a) a connector that recognizes a connection of an external device; (b) a switch located at an upper end portion of the connector and that connects an electrical signal when a physical input of a threshold pressure or more is pressed; (c) a substrate connected to a connection terminal of the switch and mounted at a surface in which the switch is not located; and/or (d) a key base that presses the switch.

Abstract translation: 输入设备可以包括：（a）识别外部设备的连接的连接器; （b）位于所述连接器的上端部的开关，当按压阈值压力以上的物理输入时，连接电信号; （c）连接到开关的连接端子并安装在开关不位于其中的表面的基板; 和/或（d）按压开关的键座。

公开(公告)号：US09084365B2

公开(公告)日：2015-07-14

申请号：US14562794

申请日：2014-12-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shigeru Tago

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/185 ,  H05K7/02 ,  H05K2201/10537

Abstract: An electronic module includes a substrate, a built-in electronic component and a surface mount electronic component. A suckable region is provided on a front surface of the substrate. When viewed in a see-through manner in a direction perpendicular or substantially perpendicular to the front surface of the substrate, the suckable region is inside of a region in which one built-in electronic component is built in and a center of gravity of the electronic module is located inside of the suckable region. A protective layer is not provided on the front surface of the substrate on which the surface mount electronic component is mounted.

公开(公告)号：US20150098189A1

公开(公告)日：2015-04-09

申请号：US14572348

申请日：2014-12-16

Applicant: Coilcraft, Incorporated

Inventor： Stephen Michael Sedio

IPC: H05K1/18 ,  H05K7/20

CPC classification number: H05K1/183 ,  H01F5/04 ,  H05K1/181 ,  H05K3/341 ,  H05K5/0095 ,  H05K7/005 ,  H05K7/20127 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49105 ,  Y10T29/4913

Abstract: An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

Abstract translation: 一种集成电子组件，包括限定插座的第一电子部件和至少第二电子部件，其中第二电子部件的至少一部分设置在第一电子部件的插座中，以及用于节省电路中的空间的方法或 通过集成多个电子部件，使得多个电子部件在多个电子部件未集成的情况下，在多个电子部件上共同地占用比基板多的空间的印刷电路板。

公开(公告)号：US08837168B2

公开(公告)日：2014-09-16

申请号：US13754910

申请日：2013-01-31

Applicant: Cyntec Co., Ltd.

Inventor： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC: H05K7/18 ,  H05K3/30 ,  H05K1/18 ,  H01L23/64 ,  H01L25/16 ,  H01F27/29 ,  H05K9/00 ,  H01L23/24 ,  H01L23/31 ,  H01L23/552 ,  H01F27/02 ,  H05K3/34

CPC classification number: H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.