摘要:
An adjustment pattern, which is composed of a reference pattern made of plural independent liquid droplets and a pattern to be measured made of plural independent liquid droplets ejected under an ejection condition different from the reference pattern, is formed on a water-repellent conveying belt. Then, light is applied to the adjustment pattern to receive the regular reflection light from the adjustment pattern, so that the adjustment pattern is scanned. The distance between the respective patterns is measured based on the measured result. Finally, liquid droplet ejection timing of the recording head is corrected based on the result thus measured.
摘要:
A method for manufacturing an IC-embedded substrate comprises a first step for encapsulating at least an IC chip having a pad electrode in an insulating layer, a second step for forming a metal layer having at least a first aperture in a location directly above the pad electrode of the IC chip and a second aperture in a location above an area other than the area in which the IC chip is mounted, and a third step for selectively removing the insulating layer by a blasting treatment in which the metal layer is used as a mask, whereby forming a first via hole that corresponds to the first aperture and a second via hole that corresponds to the second aperture.
摘要:
A hard disk drive is provided with a platter, a spindle motor for driving the platter, an arm with a magnetic head attached to a distal end thereof, a voice coil motor for driving the arm, a first circuit substrate, and a drive casing for accommodating and electrically shielding the platter, spindle motor, arm, voice coil motor, and first circuit substrate. The first circuit substrate has a multilayer substrate, a plurality of digital ICs that is embedded as bare chips in the multilayer substrate, and a bus line for connecting the digital ICs. The digital ICs are disposed in a mutually horizontal configuration.
摘要:
A semiconductor device in which input terminals for external interrupts can be set as desired. A plurality of external input terminals can be specified as interrupt terminals which output an input signal to an external interrupt circuit via an interrupt terminal selector. A selection control circuit specifies whether a plurality of external input terminals are used as interrupt terminals. According to the selection control circuit, the interrupt terminal selector outputs to the external interrupt circuit an input signal entered from an external input terminal which is specified as an interrupt terminal out of the plurality of external input terminals.
摘要:
A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric, ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
摘要:
A composite dielectric material comprising a resin resulting from a polyvinylbenzyl ether compound and a dielectric ceramic powder dispersed therein is useful in the high-frequency region. A composite magnetic material comprising a polyvinylbenzyl ether compound and a magnetic powder is also provided as well as a flame retardant material comprising a polyvinylbenzyl ether compound and a flame retardant. These materials may be used in the fabrication of substrates, prepreg sheets, coated metal foils, molded items, and metal foil-clad substrates.
摘要:
The composite dielectric of the present invention contains an aromatic liquid crystal polyester and a dielectric ceramic powder arranged in the aromatic liquid crystal polyester, wherein the dielectric ceramic powder exhibits a Q value greater than 650 at a frequency of 1 GHz by perturbation. A wiring board comprising a composite dielectric sheet made of a composite dielectric having such a characteristic exhibits a high dielectric constant and a low dielectric dissipation factor, thereby yielding less transmission loss, and thus can favorably be used in electronic instruments driven in high-frequency regions.
摘要:
A sheet transport device and an image forming apparatus using the sheet transport device are disclosed. The sheet transport device includes a transport belt rotating around rollers that transports a sheet by attaching the sheet to the transport belt by an electrostatic force, and charging unit that is unitized by including a charging member for charging the transport belt. The charging unit includes a unit case containing springs for pushing the charging member onto the transport belt. An Ac bias voltage is applied to the transport belt via the charging member.
摘要:
Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.
摘要:
The present invention provides a printed wiring board which can prevent a plating failure in a connection hole such as a via to be formed in the printed wiring board, thereby can enhance the connection reliability and a manufacturing method therefor. The printed wiring board 100 includes a thermosetting resin sheet 16 (insulation layer) having a via hole 20 (through hole) constituted by inner wall parts having different taper angles from each other, a copper foil 17 (conductor layer) provided on the thermosetting resin sheet 16, and a wiring pattern 13 (wiring layer) which is provided so as to be exposed from the via hole 20 and is electrically connected with the copper foil 17 through the via hole 20.