公开(公告)号：US20080164609A1

公开(公告)日：2008-07-10

申请号：US11620900

申请日：2007-01-08

申请人： Peter A. Gruber ,  Barry A. Hochlowski ,  David T. Naugle

发明人： Peter A. Gruber ,  Barry A. Hochlowski ,  David T. Naugle

IPC分类号： H01L21/768 ,  H01L23/492

CPC分类号： H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05026 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/181 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0338 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/05099 ,  H01L2924/013

摘要： Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

摘要翻译： 公开了可用于凸起半导体晶片的制造焊球的方法。 还公开了用焊球冲击半导体晶片的方法。 焊球可以使用注射成型焊接（IMS）工艺制成。

公开(公告)号：US07332424B2

公开(公告)日：2008-02-19

申请号：US11048578

申请日：2005-02-01

申请人： Luc Bélanger ,  Peter A. Gruber ,  Valérie Oberson ,  Christopher L. Tessler

发明人： Luc Bélanger ,  Peter A. Gruber ,  Valérie Oberson ,  Christopher L. Tessler

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3468 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/087 ,  H05K2203/1157 ,  H05K2203/128 ,  H01L2924/0105 ,  H01L2224/11 ,  H01L2224/05099

摘要： Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.

摘要翻译： 公开了一种允许从注射成型焊料（IMS）产生的焊料特征从模板向焊料接收衬底的转移和回流而不使用焊剂的新方法。 几种实施方式分别产生焊料转移和回流，或者在一起并且在氮气中使用甲酸蒸气或部分浓度的氢作为氧化物还原气氛。 最终实施例通过在焊料填充的模具板和焊料接收衬底之间使用超声波振动，仅在氮气中产生无磁通转移和回流。

公开(公告)号：US20080023526A1

公开(公告)日：2008-01-31

申请号：US11495966

申请日：2006-07-28

申请人： Glen N. Biggs ,  John J. Garant ,  Peter A. Gruber ,  Bouwe W. Leenstra ,  Christopher L. Tessler ,  Thomas Weiss

发明人： Glen N. Biggs ,  John J. Garant ,  Peter A. Gruber ,  Bouwe W. Leenstra ,  Christopher L. Tessler ,  Thomas Weiss

IPC分类号： B23K1/00 ,  B22D18/04

CPC分类号： B23K3/0638

摘要： A new pressure-only molten metal valving apparatus and method is provided. This novel approach to controlling the flow of liquids eliminates the need for active, moving valve components. Using the natural surface tension properties of liquids, the gas pressure either activates liquid flow when a threshold is overcome or retains the liquid in a head, even when lifted.

公开(公告)号：US5244143A

公开(公告)日：1993-09-14

申请号：US869676

申请日：1992-04-16

申请人： Thomas G. Ference ,  Peter A. Gruber ,  Bernardo Hernandez ,  Michael J. Palmer ,  Arthur R. Zingher

发明人： Thomas G. Ference ,  Peter A. Gruber ,  Bernardo Hernandez ,  Michael J. Palmer ,  Arthur R. Zingher

IPC分类号： B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34

CPC分类号： B23K3/0607 ,  B23K1/20 ,  H05K3/3468 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/111 ,  H05K2201/10734 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128

摘要： An apparatus and method are described for injection molding solder mounds onto electronic devices. The apparatus has a reservoir for molten solder which is disposed over a cavity in an injection plate. The injection plate is disposed over a mold having an array of cavities therein into which solder in injection molded. The mold is disposed over a workpiece, such as a semiconductor chip or a semiconductor chip packaging substrate. The cavities in the mold are aligned with electrical contact locations on the chip or substrate. The workpiece is heated and the molten solder is forced under gas pressure into the cavity in the injection plate disposed above the array of cavities in the mold. The molten solder is forced into the array of cavities in the mold. The injection plate is advanced to slide over the mold to wipe away the excess solder above the mold at a plurality of wiping apertures in the injection plate. The injection plate is further advanced to a location having a nonsolder wettable surface at which location the injection plate is removed. The mold is then removed to leave solder mounds disposed on the workpiece. The workpiece can be a semiconductor chip, a semiconductor chip packaging substrate or a dummy substrate onto which the injected molded solder adheres such as a polymer layer to form a carrier substrate for a solder mound array which can be subsequently transferred to a substrate such as a semiconductor chip or a semiconductor chip packaging substrate. The apparatus and methods of the present invention can be integrated into an automated manufacturing system for depositing an array of solder mounds onto a substrates.

公开(公告)号：US5198189A

公开(公告)日：1993-03-30

申请号：US870152

申请日：1992-04-13

申请人： Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

发明人： Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

IPC分类号： B22F1/02 ,  B23K35/14 ,  C22C1/02 ,  H01L23/373

CPC分类号： C22C1/02 ,  B22F1/025 ,  H01L23/3733 ,  H01L2924/0002

摘要： A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

摘要翻译： 液态金属基体热膏包括在低熔点液体金属基体中的非反应导热颗粒的分散体。 颗粒优选是硅，钼，钨或其它在低于约100℃的温度下不与镓反应的材料。优选的液态金属是镓和铟共晶，镓和锡共晶以及镓，铟和锡三元共晶。 颗粒可以用贵金属涂覆以最小化表面氧化并增强颗粒的润湿性。 液体金属基质热膏用作高导热浆料，以与传统的流体冷却系统一起冷却高功率耗散部件。

公开(公告)号：US5173256A

公开(公告)日：1992-12-22

申请号：US790904

申请日：1991-11-08

申请人： Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

发明人： Richard B. Booth ,  Gary W. Grube ,  Peter A. Gruber ,  Igor Y. Khandros ,  Arthur R. Zingher

IPC分类号： B22F1/02 ,  C22C1/02 ,  H01L23/373

CPC分类号： B22F1/025 ,  C22C1/02 ,  H01L23/3733 ,  H01L2924/0002

摘要： A liquid metal matrix thermal paste comprises a dispersion of non-reacting thermally conductive particles in a low melting temperature liquid metal matrix. The particles preferably are silicon, molybdenum, tungsten or other materials which do not react with gallium at temperatures below approximately 100.degree. C. The preferred liquid metals are gallium and indium eutectic, gallium and tin eutectic and gallium, indium and tin ternary eutectic. The particles may be coated with a noble metal to minimize surface oxidation and enhance wettability of the particles. The liquid metal matrix thermal paste is used as a high thermally conducting paste in cooling high power dissipation components in conjunction with a conventional fluid cooling system.

摘要翻译： 液态金属基体热膏包括在低熔点液体金属基体中的非反应导热颗粒的分散体。 颗粒优选是硅，钼，钨或其它在低于约100℃的温度下不与镓反应的材料。优选的液态金属是镓和铟共晶，镓和锡共晶以及镓，铟和锡三元共晶。 颗粒可以用贵金属涂覆以最小化表面氧化并增强颗粒的润湿性。 液体金属基质热膏用作高导热浆料，以与传统的流体冷却系统一起冷却高功率耗散部件。

公开(公告)号：US5022462A

公开(公告)日：1991-06-11

申请号：US492601

申请日：1990-03-12

申请人： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

发明人： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

IPC分类号： H01L23/433 ,  H01L23/467

CPC分类号： H01L23/4338 ,  H01L23/467 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/15312 ,  H01L2924/3025

摘要： A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.

摘要翻译： 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。

公开(公告)号：US4549407A

公开(公告)日：1985-10-29

申请号：US597306

申请日：1984-04-06

申请人： Peter A. Gruber

发明人： Peter A. Gruber

IPC分类号： H05K7/20 ,  F25D7/00 ,  F28C3/08 ,  F28D5/00 ,  F28F13/00 ,  H01L23/427 ,  H01L23/473

CPC分类号： F28F13/00 ,  F28D5/00 ,  H01L23/427 ,  F28F13/003 ,  H01L2924/0002 ,  Y10S165/907 ,  Y10S165/911

摘要： Evaporative cooling particularly useful for semiconductor integrated circuits is more efficient when a liquid is completely evaporated at the heat radiating surface. The liquid is converted to droplets and mixed with the gas at the heat radiating surface.

摘要翻译： 当液体在散热表面完全蒸发时，对半导体集成电路特别有用的蒸发冷却效果更好。 将液体转化成液滴并与散热表面的气体混合。

公开(公告)号：US08272120B2

公开(公告)日：2012-09-25

申请号：US13186815

申请日：2011-07-20

申请人： Peter A. Gruber ,  Jae-woong Nah

发明人： Peter A. Gruber ,  Jae-woong Nah

IPC分类号： B23P19/00

CPC分类号： H01L24/29 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/27 ,  H01L24/32 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05557 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2732 ,  H01L2224/29006 ,  H01L2224/29015 ,  H01L2224/29076 ,  H01L2224/29083 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/3207 ,  H01L2224/73204 ,  H01L2224/743 ,  H01L2224/83101 ,  H01L2224/83203 ,  H01L2224/83345 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/41 ,  Y10T29/5313 ,  Y10T29/53178 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199

摘要： An apparatus for applying solder to semiconductor chips is provided that employs a plurality of apertured decals to define areas for engaging solder on a semiconductor chip. Each of the plurality of decals includes an upper, center and bottom layer having apertures present therethrough. The apparatus fills the apertures with solder. The upper and bottom layers of the apertured decals are removed to provide solder portions projecting from the center layer. The apparatus provides a station for applying an adhesive layer to the exposed surfaces of the center layer having the solder portions projecting therefrom. The apparatus includes a station for contacting the solder and adhesive to the semiconductor chip. The apparatus also includes a separating structure for detaching the portion of the center layer that is in contacting to the semiconductor chip through the solder.

摘要翻译： 提供了一种用于向半导体芯片施加焊料的装置，其采用多个有孔贴花来限定用于接合半导体芯片上的焊料的区域。 多个贴花中的每一个包括具有穿过其中的孔的上部，中心和底部层。 该装置用焊料填充孔。 去除多孔贴花的上层和底层以提供从中心层突出的焊接部分。 该装置提供了一种用于将粘合剂层施加到具有从其突出的焊料部分的中心层的暴露表面的工位。 该装置包括用于将焊料和粘合剂接触到半导体芯片的工位。 该装置还包括分离结构，用于通过焊料分离与半导体芯片接触的部分中心层。

公开(公告)号：US08268719B2

公开(公告)日：2012-09-18

申请号：US12983292

申请日：2011-01-01

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L21/44

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/14 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus for performing this process.

摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。