公开(公告)号：US20240234623A9

公开(公告)日：2024-07-11

申请号：US18279579

申请日：2022-02-16

Applicant: SHIN-ETSU HANDOTAI CO., LTD.

Inventor： Keitaro TSUCHIYA ,  Masato YAMADA

IPC: H01L33/00 ,  H01L33/06 ,  H01L33/32

CPC classification number: H01L33/0075 ,  H01L33/0093 ,  H01L33/06 ,  H01L33/32

Abstract: The present invention is a method for manufacturing an epitaxial wafer for an ultraviolet ray emission device, the method including steps of: preparing a supporting substrate having at least one surface composed of gallium nitride; forming a bonding layer on the surface composed of the gallium nitride of the supporting substrate; forming a laminated substrate having a seed crystal layer by laminating a seed crystal composed of an AlxGa1-xN (0.5

公开(公告)号：US12033887B2

公开(公告)日：2024-07-09

申请号：US18349032

申请日：2023-07-07

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Yingdong Luo ,  Mingwei Zhu ,  Hou T. Ng ,  Sivapackia Ganapathiappan ,  Nag B. Patibandla

IPC: H01L21/70 ,  H01L21/02 ,  H01L21/027 ,  H01L25/075 ,  H01L27/15 ,  H01L33/00 ,  H01L33/44 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L21/70 ,  H01L21/02104 ,  H01L21/027 ,  H01L21/707 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/00 ,  H01L33/0093 ,  H01L33/44 ,  H01L33/505 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A multi-color display includes a backplane having backplane circuitry, an array of micro-LEDs electrically integrated with backplane circuitry of the backplane, a color conversion layer over each of a plurality of light emitting diodes, and a plurality of isolation walls separating adjacent micro-LEDs of the array.

公开(公告)号：US20240204130A1

公开(公告)日：2024-06-20

申请号：US18537470

申请日：2023-12-12

Applicant: Commissariat à I'Énergie Atomique et aux Énergies Alternatives

Inventor： Ludovic Dupre ,  Carole Pernel

IPC: H01L33/00

CPC classification number: H01L33/0093 ,  H01L33/0062 ,  H01L2933/0016

Abstract: A method of manufacturing an electronic device comprising the following successive steps: a) forming a structure comprising a diode stack disposed on a first substrate, and a sacrificial layer of semiconductor material interposed between the first substrate and the diode stack; b) transferring the structure to a second substrate; and c) removing the first substrate by electropolishing the sacrificial layer by applying a bias voltage to the sacrificial layer via the diode stack.

公开(公告)号：US20240194828A1

公开(公告)日：2024-06-13

申请号：US18243021

申请日：2023-09-06

Applicant: Samsung Display Co., LTD.

Inventor： Young Seok SEO ,  Kyung Ho KIM ,  Hye Won JANG ,  Jin Woo CHOI

IPC: H01L33/24 ,  H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L33/24 ,  H01L25/0753 ,  H01L33/0093 ,  H01L33/505 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0041

Abstract: A includes a substrate including a display area in which a plurality of emission areas configured to emit light for displaying an image are arranged; a plurality of light emitting units located on the substrate and respectively corresponds to the plurality of emission areas; and a partition wall on the substrate, corresponding to a non-emission area which is a boundary between the plurality of emission areas, and having a variable width in at least one direction. The partition wall includes a plate corresponding to the non-emission area; and a pillar protruding from at least a portion of the plate to each of the plurality of emission areas and having a greater width than the plate.

公开(公告)号：US20240186300A1

公开(公告)日：2024-06-06

申请号：US18436942

申请日：2024-02-08

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seong Gyu JANG ,  Ho Joon LEE ,  Jong Hyeon CHAE ,  Chung Hoon LEE

IPC: H01L25/13 ,  H01L25/075 ,  H01L33/00 ,  H01L33/20 ,  H01L33/38 ,  H01L33/40 ,  H01L33/50 ,  H01L33/62

CPC classification number: H01L25/13 ,  H01L25/0756 ,  H01L33/38 ,  H01L33/405 ,  H01L33/505 ,  H01L33/0093 ,  H01L33/20 ,  H01L33/62

Abstract: A light emitting diode pixel for a display includes a first subpixel including a first LED sub-unit, a second subpixel including a second LED sub-unit, a third subpixel including a third LED sub-unit, and a bonding layer overlapping the first, second, and third subpixels, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, each of the first, second, and third LED sub-units is disposed on a different plane, and light generated from the second subpixel is configured to be emitted to an outside of the light emitting diode pixel by passing through a lesser number of LED sub-units than light generated from the first subpixel and emitted to the outside.

公开(公告)号：US20240186298A1

公开(公告)日：2024-06-06

申请号：US18439441

申请日：2024-02-12

Applicant: Micron Technology, Inc.

Inventor： Scott D. Schellhammer ,  Vladimir Odnoblyudov ,  Jeremy S. Frei

IPC: H01L25/075 ,  H01L21/18 ,  H01L21/20 ,  H01L21/447 ,  H01L23/00 ,  H01L23/495 ,  H01L33/00 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/447 ,  H01L23/49513 ,  H01L24/04 ,  H01L24/06 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L33/0066 ,  H01L33/0093 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/62 ,  H01L24/32 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83001 ,  H01L2224/83005 ,  H01L2224/83121 ,  H01L2224/8314 ,  H01L2224/83193 ,  H01L2924/12041 ,  H01L2924/12042

Abstract: Discontinuous bonds for semiconductor devices are disclosed herein. A device in accordance with a particular embodiment includes a first substrate and a second substrate, with at least one of the first substrate and the second substrate having a plurality of solid-state transducers. The second substrate can include a plurality of projections and a plurality of intermediate regions and can be bonded to the first substrate with a discontinuous bond. Individual solid-state transducers can be disposed at least partially within corresponding intermediate regions and the discontinuous bond can include bonding material bonding the individual solid-state transducers to blind ends of corresponding intermediate regions. Associated methods and systems of discontinuous bonds for semiconductor devices are disclosed herein.

公开(公告)号：US12002915B2

公开(公告)日：2024-06-04

申请号：US17579856

申请日：2022-01-20

Applicant: CREELED, INC.

Inventor： Thomas Place ,  Kevin Ward Haberern

IPC: H01L33/08 ,  H01L27/15 ,  H01L33/62 ,  H01L23/00 ,  H01L33/00 ,  H01L33/64

CPC classification number: H01L33/62 ,  H01L27/153 ,  H01L33/08 ,  H01L24/05 ,  H01L24/06 ,  H01L33/0093 ,  H01L33/0095 ,  H01L33/64 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/04042 ,  H01L2224/05569 ,  H01L2224/0603 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/12041

Abstract: LED chips comprising pluralities of active regions on the same submount are provided. These active regions are individually addressable, such that beams output from the LEDs can be controlled simply by selectively activating the desired active region in the plurality without requiring advanced optics and reflectors comprising complex moving parts. In some embodiments, one or more active regions can surround one or more other active regions. In some embodiments, the various active regions are individually addressable by virtue of each active region comprising its own anode and sharing a common cathode. In some embodiments, the various active regions are individually addressable by virtue of each active region comprising its own cathode and sharing a common anode. In some embodiments, each active region comprises its own anode and its own cathode.

公开(公告)号：US20240177639A1

公开(公告)日：2024-05-30

申请号：US18210359

申请日：2023-06-15

Applicant: LG Display Co., Ltd.

Inventor： SeungHan Paek ,  SangPyo Hong ,  HyunJin An ,  Kyungjae Yoon ,  Jeonphill Han

IPC: G09G3/00 ,  H01L33/00

CPC classification number: G09G3/006 ,  H01L33/0093

Abstract: A display device includes a substrate including an active area and a non-active area; an organic insulating layer disposed on the substrate and having a portion thereof protruding outward from the substrate; a plurality of alignment patterns disposed between the substrate and the organic insulating layer in the non-active area; and a plurality of alignment grooves disposed in a lower surface of the portion of the organic insulating layer, protruding outward from the substrate, thus easily detecting a position of an edge of the substrate from the plurality of alignment patterns disposed adjacent to the edge of the substrate.

公开(公告)号：US20240162373A1

公开(公告)日：2024-05-16

申请号：US18362414

申请日：2023-07-31

Applicant: Samsung Display Co., LTD.

Inventor： Kwan Jae LEE ,  Bong Chun PARK ,  Dong Eon LEE ,  So Young LEE ,  Seung A LEE

IPC: H01L33/06 ,  H01L27/15 ,  H01L33/00 ,  H01L33/24 ,  H01L33/32 ,  H01L33/44

CPC classification number: H01L33/06 ,  H01L27/156 ,  H01L33/007 ,  H01L33/0093 ,  H01L33/24 ,  H01L33/32 ,  H01L33/44 ,  H01L2933/0025

Abstract: A light emitting element includes: a first semiconductor layer; an active layer provided on the first semiconductor layer; a second semiconductor layer provided on the active layer; and an insulative film around at least a portion of the first semiconductor layer, the active layer, and the second semiconductor layer, which are sequentially provided in a first direction. The active layer may include a first barrier layer, a first well layer, and a second barrier layer, which are sequentially provided in the first direction, and the first well layer may include first holes penetrating the first well layer.

公开(公告)号：US11984544B2

公开(公告)日：2024-05-14

申请号：US17446170

申请日：2021-08-27

Applicant: Lextar Electronics Corporation

Inventor： Jih-Kang Chen ,  Shiou-Yi Kuo

IPC: H01L33/54 ,  H01L25/075 ,  H01L25/16 ,  H01L27/15 ,  H01L33/22 ,  H01L33/44 ,  H01L33/00

CPC classification number: H01L33/54 ,  H01L25/0753 ,  H01L25/167 ,  H01L33/0093 ,  H01L33/0095 ,  H01L2933/005

Abstract: A light-emitting element includes light-emitting diode (LED) chip with a first and second surface opposite to each other, and sidewalls connecting the first and second surface. The light-emitting element further includes a first insulation layer disposed on and covering the first surface and one part of the sidewalls. The light-emitting element further includes multiple connection pads physically contact the first surface and protruding from the first insulation layer, as well as a second insulation layer disposed on and covering the second surface and the other part of the sidewalls. The second insulation layer includes a cover portion and protrusion portions. The cover portion covers the whole second surface and the other part of the sidewalls. The protrusion portions are disposed on the sidewalls, protrude from the cover portion and extend laterally.