Method for electroless plating a contact pad
    108.
    发明授权
    Method for electroless plating a contact pad 有权
    化学镀接触焊盘的方法

    公开(公告)号:US06630400B2

    公开(公告)日:2003-10-07

    申请号:US09854292

    申请日:2001-05-09

    Applicant: Tongbi Jiang Li Li

    Inventor: Tongbi Jiang Li Li

    Abstract: A method and apparatus is disclosed for sequential processing of integrated circuits, particularly for conductively passivating a contact pad with a material which resists formation of resistive oxides. In particular, a tank is divided into three compartments, each holding a different solution: a lower compartment and two upper compartments divided by a barrier, which extends across and partway down the tank. The solutions have different densities and therefore separate into different layers. In the illustrated embodiment, integrated circuits with patterned contact pads are passed through one of the upper compartments, in which oxide is removed from the contact pads. Continuing downward into the lower compartment and laterally beneath the barrier, a protective layer is selectively formed on the insulating layer surrounding the contact pads. As the integrated circuits are moved upwardly into the second upper compartment, a conducting monomer selectively forms on the contact pads prior to any exposure to air. The integrated circuits can then be transferred to an ozone chamber where polymerization results in a conductive passivation layer on the contact pad.

    Abstract translation: 公开了用于集成电路的顺序处理的方法和装置,特别是用抵抗形成电阻氧化物的材料导电地钝化接触焊盘。 特别地,罐被分成三个隔室,每个隔间都有一个不同的解决方案:一个下隔室和两个隔离隔间的隔离隔板,两个隔间延伸横跨槽和一半的槽。 溶液具有不同的密度,因此分离成不同的层。 在所示实施例中,具有图案化接触焊盘的集成电路通过上隔室之一,其中氧化物从接触焊盘移除。 继续向下进入下隔室并在屏障下方横向放置,在围绕接触垫的绝缘层上选择性地形成保护层。 当集成电路向上移动到第二上隔室中时,在任何暴露于空气之前,在接触焊盘上选择性地形成导电单体。 然后可以将集成电路转移到臭氧室,其中聚合导致接触焊盘上的导电钝化层。

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