公开(公告)号：US20120306043A1

公开(公告)日：2012-12-06

申请号：US13534854

申请日：2012-06-27

申请人： Ji Pan ,  Anup Bhalla

发明人： Ji Pan ,  Anup Bhalla

IPC分类号： H01L29/47

CPC分类号： H01L29/66727 ,  H01L29/0623 ,  H01L29/1095 ,  H01L29/407 ,  H01L29/66734 ,  H01L29/7811 ,  H01L29/782

摘要： A Schottky diode includes a Schottky barrier and a plurality of dopant regions disposed near the Schottky barrier as floating islands to function as PN junctions for preventing a leakage current generated from a reverse voltage. At least a trench opened in a semiconductor substrate with a Schottky barrier material disposed therein constitutes the Schottky barrier. The Schottky barrier material may also be disposed on sidewalls of the trench for constituting the Schottky barrier. The trench may be filled with the Schottky barrier material composed of Ti/TiN or a tungsten metal disposed therein for constituting the Schottky barrier. The trench is opened in a N-type semiconductor substrate and the dopant regions includes P-doped regions disposed under the trench constitute the floating islands. The P-doped floating islands may be formed as vertical arrays under the bottom of the trench.

摘要翻译： 肖特基二极管包括肖特基势垒和设置在肖特基势垒附近的多个掺杂区，作为浮岛，用作用于防止从反向电压产生的漏电流的PN结。 在其中设置有肖特基势垒材料的半导体衬底中开放的至少一个沟槽构成肖特基势垒。 肖特基势垒材料也可以设置在用于构成肖特基势垒的沟槽的侧壁上。 沟槽可以填充由设置在其中的用于构成肖特基势垒的Ti / TiN或其中的钨金属组成的肖特基势垒材料。 沟槽在N型半导体衬底中打开，并且掺杂区包括设置在沟槽下方的P掺杂区构成浮岛。 P掺杂的浮岛可以在沟槽底部形成为垂直阵列。

公开(公告)号：US08264084B2

公开(公告)日：2012-09-11

申请号：US11932845

申请日：2007-10-31

申请人： François Hébert ,  Anup Bhalla ,  Kai Liu ,  Ming Sun

发明人： François Hébert ,  Anup Bhalla ,  Kai Liu ,  Ming Sun

IPC分类号： H01L21/60 ,  H01L23/488

CPC分类号： H01L24/40 ,  H01L23/4952 ,  H01L23/49562 ,  H01L23/64 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/05624 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/37099

摘要： A solder-top enhanced semiconductor device is proposed for packaging. The solder-top device includes a device die with a top metal layer patterned into contact zones and contact enhancement zones. At least one contact zone is electrically connected to at least one contact enhancement zone. Atop each contact enhancement zone is a solder layer for an increased composite thickness thus lowered parasitic impedance. Where the top metal material can not form a uniform good electrical bond with the solder material, the device die further includes an intermediary layer sandwiched between and forming a uniform electrical bond with the top metal layer and the solder layer. A method for making the solder-top device includes: a) Lithographically patterning the top metal layer into the contact zones and the contact enhancement zones. b) Forming a solder layer atop each of the contact enhancement zones using a stencil process for an increased composite thickness.

摘要翻译： 提出了一种焊顶增强型半导体器件进行封装。 焊料顶部器件包括具有图案化为接触区域和接触增强区域的顶部金属层的器件裸片。 至少一个接触区域电连接到至少一个接触增强区域。 每个接触增强区顶部都是一个焊料层，用于增加复合材料厚度，从而降低寄生阻抗。 在顶部金属材料不能与焊料材料形成均匀的良好电接合的情况下，器件裸片还包括夹在中间层之间并与顶部金属层和焊料层形成均匀的电接合的中间层。 用于制造焊料顶部器件的方法包括：a）将顶部金属层的光刻图案化成接触区域和接触增强区域。 b）使用用于增加复合材料厚度的模版工艺在每个接触增强区的顶部上形成焊料层。

公开(公告)号：US20120161304A1

公开(公告)日：2012-06-28

申请号：US13411990

申请日：2012-03-05

申请人： Kai Liu ,  Lei Shi ,  Jun Lu ,  Anup Bhalla

发明人： Kai Liu ,  Lei Shi ,  Jun Lu ,  Anup Bhalla

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49589 ,  H01L24/29 ,  H01L24/32 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/24247 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/92246 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/37099

摘要： A dual-leadframe multi-chip package comprises a first leadframe with a first die pad, and a second leadframe with a second die pad; a first chip mounted on the first die pad functioning as a high-side MOSFET and second chip mounted on the second die pad functioning as a low-side MOSFET. The package may further comprises a bypass capacity configured as a third chip mounted on the first die pad or integrated with the first chip. The package may further comprise a three-dimensional connecting plate formed as an integrated structure as the second die pad for electrically connecting a top contact area of the first chip to a bottom contact area of the second chip. A top connecting plate connects a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe.

摘要翻译： 双引线框多芯片封装包括具有第一管芯焊盘的第一引线框架和具有第二管芯焊盘的第二引线框架; 安装在用作高边MOSFET的第一芯片焊盘上的第一芯片和安装在用作低端MOSFET的第二芯片焊盘上的第二芯片。 封装还可以包括配置为安装在第一裸片焊盘上或与第一芯片集成的第三芯片的旁路容量。 封装还可以包括形成为一体结构的三维连接板作为第二芯片焊盘，用于将第一芯片的顶部接触区域电连接到第二芯片的底部接触区域。 顶部连接板将第二芯片的顶部接触区域和第三芯片的顶部接触区域连接到第一引线框架的外部引脚。

公开(公告)号：US20120104555A1

公开(公告)日：2012-05-03

申请号：US12925869

申请日：2010-10-31

申请人： Madhur Bobde ,  Anup Bhalla

发明人： Madhur Bobde ,  Anup Bhalla

IPC分类号： H01L29/739 ,  H01L21/331

CPC分类号： H01L29/7397 ,  H01L29/0696 ,  H01L29/402 ,  H01L29/66348

摘要： This invention discloses an insulated gate bipolar transistor (IGBT) device formed in a semiconductor substrate. The IGBT device has a split-shielded trench gate that includes an upper gate segment and a lower shield segment. The IGBT device may further include a dummy trench filled with a dielectric layer disposed at a distance away from the split-shielded trench gate. The IGBT device further includes a body region extended between the split-shielded trench gate and the dummy trench encompassing a source region surrounding the split-shielded trench gate near a top surface of the semiconductor substrate. The IGBT device further includes a heavily doped N region disposed below the body region and above a source-dopant drift region above a bottom body-dopant collector region at a bottom surface of the semiconductor substrate. In an alternative embodiment, the IGBT may include a planar gate with a trench shield electrode.

摘要翻译： 本发明公开了一种形成在半导体衬底中的绝缘栅双极晶体管（IGBT）器件。 IGBT器件具有分裂屏蔽沟槽栅极，其包括上栅极段和下屏蔽段。 IGBT器件还可以包括填充有离开分屏蔽沟槽栅极一定距离设置的电介质层的虚拟沟槽。 IGBT器件还包括在分屏蔽沟槽栅极和虚拟沟槽之间延伸的体区，其围绕半导体衬底的顶表面附近的分离屏蔽沟槽栅极的源极区域。 所述IGBT器件还包括设置在所述体区域的下方且位于所述半导体衬底的底表面的底体 - 掺杂剂集电极区域上方的源 - 掺杂剂漂移区上方的重掺杂N区域。 在替代实施例中，IGBT可以包括具有沟槽屏蔽电极的平面栅极。

公开(公告)号：US08110869B2

公开(公告)日：2012-02-07

申请号：US11906476

申请日：2007-10-01

申请人： Anup Bhalla

发明人： Anup Bhalla

IPC分类号： H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC分类号： H01L29/7811 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/4236 ,  H01L29/456 ,  H01L29/47 ,  H01L29/66734 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725

摘要： A semiconductor power device supported on a semiconductor substrate of a first conductivity type with a bottom layer functioning as a bottom electrode and an epitaxial layer overlying the bottom layer with a same conductivity type as the bottom layer. The semiconductor power device includes a plurality of FET cells and each cell further includes a body region of a second conductivity type extending from a top surface into the epitaxial layer. The body region encompasses a heavy body dopant region of second conductivity type. An insulated gate is disposed on the top surface of the epitaxial layer, overlapping a first portion of the body region. A barrier control layer is disposed on the top surface of the epitaxial layer next to the body region away from the insulated gate. A conductive layer overlies the top surface of the epitaxial layer covering a second portion of the body region and the heavy body dopant region extending over the barrier control layer forming a Schottky junction diode.

摘要翻译： 一种半导体功率器件，其被支撑在第一导电类型的半导体衬底上，底层用作底部电极，外延层覆盖在与底层相同的导电类型的底层上。 半导体功率器件包括多个FET单元，并且每个单元还包括从顶表面延伸到外延层中的第二导电类型的体区。 身体区域包括第二导电类型的重体掺杂区域。 绝缘栅极设置在外延层的顶表面上，与身体区域的第一部分重叠。 屏障控制层设置在远离绝缘栅极的身体区域旁边的外延层的顶表面上。 覆盖覆盖主体区域的第二部分的外延层的顶表面上的导电层和在形成肖特基结二极管的势垒控制层上延伸的重体掺杂区域。

公开(公告)号：US20110233666A1

公开(公告)日：2011-09-29

申请号：US12731112

申请日：2010-03-24

申请人： Sik Lui ,  Anup Bhalla

发明人： Sik Lui ,  Anup Bhalla

IPC分类号： H01L27/105 ,  H01L21/336

CPC分类号： H01L29/7813 ,  H01L21/3081 ,  H01L21/31 ,  H01L21/32133 ,  H01L21/76224 ,  H01L27/088 ,  H01L29/0638 ,  H01L29/0649 ,  H01L29/0653 ,  H01L29/0661 ,  H01L29/0878 ,  H01L29/407 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/4238 ,  H01L29/456 ,  H01L29/66666 ,  H01L29/66734 ,  H01L29/7811 ,  H01L29/7827

摘要： An oxide termination semiconductor device may comprise a plurality of gate trenches, a gate runner, and an insulator termination trench. The gate trenches are located in an active region. Each gate trench includes a conductive gate electrode. The insulator termination trench is located in a termination region that surrounds the active region. The insulator termination trench is filled with an insulator material to form an insulator termination for the semiconductor device. The device can be made using a three-mask or four-mask process.

摘要翻译： 氧化物终端半导体器件可以包括多个栅极沟槽，栅极流道和绝缘体端接沟槽。 栅极沟槽位于有源区域中。 每个栅极沟槽包括导电栅电极。 绝缘体端接沟槽位于围绕有源区域的端接区域中。 绝缘体端接沟槽填充有绝缘体材料以形成用于半导体器件的绝缘子端子。 该装置可以使用三掩模或四掩模工艺制成。

公开(公告)号：US20110204440A1

公开(公告)日：2011-08-25

申请号：US13066947

申请日：2011-04-28

申请人： Anup Bhalla ,  Sik K. Lui

发明人： Anup Bhalla ,  Sik K. Lui

IPC分类号： H01L27/088

CPC分类号： H01L29/7813 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66734 ,  H01L29/7811

摘要： This invention discloses a semiconductor power device that includes a plurality of power transistor cells surrounded by a trench opened in a semiconductor substrate. At least one of the cells constituting an active cell has a source region disposed next to a trenched gate electrically connecting to a gate pad and surrounding the cell. The trenched gate further has a bottom-shielding electrode filled with a gate material disposed below and insulated from the trenched gate. At least one of the cells constituting a source-contacting cell surrounded by the trench with a portion functioning as a source connecting trench is filled with the gate material for electrically connecting between the bottom-shielding electrode and a source metal disposed directly on top of the source connecting trench. The semiconductor power device further includes an insulation protective layer disposed on top of the semiconductor power device having a plurality of source openings on top of the source region and the source connecting trench provided for electrically connecting to the source metal and at least a gate opening provided for electrically connecting the gate pad to the trenched gate.

摘要翻译： 本发明公开了一种半导体功率器件，其包括由在半导体衬底中开口的沟槽围绕的多个功率晶体管单元。 构成活性单元的单元中的至少一个具有与沟槽栅极相邻设置的源极区域，该沟槽栅极电连接到栅极焊盘并围绕电池。 沟槽栅极还具有填充有栅极材料的底部屏蔽电极，栅极材料设置在沟槽栅极下方并与沟槽栅极绝缘。 构成由沟槽围绕的源极接触单元中的至少一个具有用作源极连接沟槽的部分的单元填充有栅极材料，用于电连接底部屏蔽电极和直接设置在源极连接沟槽顶部的源极金属 源连接沟槽。 半导体功率器件还包括设置在半导体功率器件的顶部上的绝缘保护层，其具有在源极区域的顶部上的多个源极开口和设置用于电连接到源极金属的源极连接沟槽和至少提供的栅极开口 用于将栅极焊盘电连接到沟槽栅极。

公开(公告)号：US07952144B2

公开(公告)日：2011-05-31

申请号：US12860777

申请日：2010-08-20

申请人： Yi Su ,  Anup Bhalla ,  Daniel Ng

发明人： Yi Su ,  Anup Bhalla ,  Daniel Ng

IPC分类号： H01L29/66

CPC分类号： H01L29/7813 ,  H01L21/8234 ,  H01L27/088 ,  H01L29/0646 ,  H01L29/0653 ,  H01L29/0696 ,  H01L29/66734 ,  H01L29/7815 ,  H01L2224/0603 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor device includes a main field effect transistor (FET) and one or more sense FETs, and a common gate pad. The main FET and the one or more sense FETs are formed in a common substrate. The main FET and each of the sense FETs include a source terminal, a gate terminal and a drain terminal. The common gate pad connects the gate terminals of the main FET and the one or more sense FETs. An electrical isolation is disposed between the gate terminals of the main FET and the one or more sense FETs. Embodiments of this invention may be applied to both N-channel and P-channel MOSFET devices.

摘要翻译： 半导体器件包括主场效应晶体管（FET）和一个或多个感测FET以及公共栅极焊盘。 主FET和一个或多个感测FET形成在公共衬底中。 主FET和每个感测FET包括源极端子，栅极端子和漏极端子。 公共栅极焊盘连接主FET和一个或多个感测FET的栅极端子。 在主FET和一个或多个感测FET的栅极端子之间设置电隔离。 本发明的实施例可以应用于N沟道和P沟道MOSFET器件。

公开(公告)号：US20110103148A1

公开(公告)日：2011-05-05

申请号：US12589945

申请日：2009-10-30

申请人： Anup Bhalla ,  Tinggang Zhu

发明人： Anup Bhalla ,  Tinggang Zhu

IPC分类号： G11C16/04 ,  H01L31/00 ,  H01L21/337

CPC分类号： H01L29/7787 ,  H01L29/1029 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/41725 ,  H01L29/66462 ,  H01L29/785

摘要： A heterostructure field effect transistor (HFET) gallium nitride (GaN) semiconductor power device comprises a hetero-junction structure comprises a first semiconductor layer interfacing a second semiconductor layer of two different band gaps thus generating an interface layer as a two-dimensional electron gas (2DEG) layer. The power device further comprises a source electrode and a drain electrode disposed on two opposite sides of a gate electrode disposed on top of the hetero-junction structure for controlling a current flow between the source and drain electrodes in the 2DEG layer. The power device further includes a floating gate located between the gate electrode and hetero-junction structure, wherein the gate electrode is insulated from the floating gate with an insulation layer and wherein the floating gate is disposed above and padded with a thin insulation layer from the hetero-junction structure and wherein the floating gate is charged for continuously applying a voltage to the 2DEG layer to pinch off the current flowing in the 2DEG layer between the source and drain electrodes whereby the HFET semiconductor power device is a normally off device.

摘要翻译： 异质结场效应晶体管（HFET）氮化镓（GaN）半导体功率器件包括异质结结构，其包括与两个不同带隙的第二半导体层接口的第一半导体层，从而产生作为二维电子气的界面层 2DEG）层。 功率器件还包括设置在异质结结构的顶部上的栅电极的两个相对侧上的源电极和漏电极，用于控制2DEG层中的源电极和漏电极之间的电流。 功率器件还包括位于栅电极和异质结结构之间的浮动栅极，其中栅电极与浮栅绝缘，并具有绝缘层，并且其中浮置栅极位于上方并且填充有薄绝缘层 异质结结构，并且其中浮置栅极被充电以连续地向2DEG层施加电压以夹紧在源极和漏极之间的2DEG层中流动的电流，由此HFET半导体功率器件是常闭装置。

公开(公告)号：US20110042742A1

公开(公告)日：2011-02-24

申请号：US12917378

申请日：2010-11-01

申请人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

发明人： Anup Bhalla ,  Dorman Pitzer ,  Jacek Korec ,  Xiaorong Shi ,  Sik Lui

IPC分类号： H01L29/78

CPC分类号： H01L29/7813 ,  H01L21/823487 ,  H01L27/088 ,  H01L29/0661 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/66734 ,  H01L29/7803 ,  H01L29/7804 ,  H01L29/7806 ,  H01L29/7811 ,  H01L29/8725 ,  H01L2924/0002 ,  Y10S257/905 ,  H01L2924/00

摘要： In a trench-gated MIS device contact is made to the gate within the trench, thereby eliminating the need to have the gate material, typically polysilicon, extend outside of the trench. This avoids the problem of stress at the upper corners of the trench. Contact between the gate metal and the polysilicon is normally made in a gate metal region that is outside the active region of the device. Various configurations for making the contact between the gate metal and the polysilicon are described, including embodiments wherein the trench is widened in the area of contact. Since the polysilicon is etched back below the top surface of the silicon throughout the device, there is normally no need for a polysilicon mask, thereby saving fabrication costs.

摘要翻译： 在沟槽栅极MIS器件中，沟槽内的栅极接触，从而不需要使栅极材料（通常为多晶硅）延伸到沟槽外部。 这避免了沟槽上角处的应力问题。 栅极金属和多晶硅之间的接触通常在位于器件的有源区域之外的栅极金属区域中形成。 描述了用于形成栅极金属和多晶硅之间的接触的各种构造，包括其中沟槽在接触区域中变宽的实施例。 由于在整个器件中多晶硅被回蚀到硅的顶表面之下，通常不需要多晶硅掩模，从而节省制造成本。