公开(公告)号：US20170199227A1

公开(公告)日：2017-07-13

申请号：US15469497

申请日：2017-03-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Jae-Woong Nah ,  Robert E. Trzcinski ,  Cornelia Kang-I Tsang

IPC: G01R3/00 ,  G01R1/067 ,  H01L21/66 ,  G01R1/04

CPC classification number: G01R1/0408 ,  G01R1/06761 ,  G01R3/00 ,  H01L22/30 ,  H01L22/34 ,  H01L23/49838 ,  H01L2224/0401 ,  H01L2224/32145 ,  H01L2224/73265 ,  H01L2924/014

Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.

公开(公告)号：US20170125268A1

公开(公告)日：2017-05-04

申请号：US15403937

申请日：2017-01-11

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: H01L21/67 ,  H01L21/683 ,  B23K26/36

CPC classification number: H01L21/67132 ,  B23K26/36 ,  B23K26/57 ,  H01L21/67092 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1158 ,  Y10T156/1917

Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation

公开(公告)号：US09636783B2

公开(公告)日：2017-05-02

申请号：US14265672

申请日：2014-04-30

Applicant: International Business Machines Corporation

Inventor： Russell A. Budd ,  Bing Dang ,  John U. Knickerbocker

IPC: H01L21/00 ,  B23K26/364 ,  H01L21/67 ,  B23K26/36 ,  H01L21/78 ,  H01L21/304 ,  H01L21/306 ,  B23K26/06 ,  B23K26/18 ,  B23K26/38 ,  B23K26/402 ,  B23K26/0622 ,  B23K101/40 ,  B23K103/00

CPC classification number: B23K26/364 ,  B23K26/0624 ,  B23K26/0626 ,  B23K26/18 ,  B23K26/38 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/50 ,  B23K2103/56 ,  H01L21/304 ,  H01L21/306 ,  H01L21/67115 ,  H01L21/78

Abstract: A method includes cutting a semiconductor wafer on a substrate wafer using at least one laser. By setting the laser to a set of parameters that define a laser beam, the laser beam can avoid ablation of the substrate wafer. The laser beam is also set equal to, or within, an ablation threshold of the semiconductor wafer for selectively ablating the semiconductor wafer. The set of parameters includes wavelength, pulse width and pulse frequency.

公开(公告)号：US09531052B2

公开(公告)日：2016-12-27

申请号：US14750033

申请日：2015-06-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P5/08 ,  H01P3/16 ,  H01P3/08

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Abstract translation: 实施例包括具有集成波导的封装结构，以实现封装组件之间的高数据速率通信。 例如，封装结构包括具有集成波导的封装衬底和安装到封装衬底的第一和第二集成电路芯片。 第一集成电路芯片使用第一传输线到波导过渡耦合到集成波导，并且第二集成电路芯片使用第二传输线耦合到集成波导到波导转换。 第一和第二集成电路芯片被配置为通过在封装载体内使用集成波导发送信号进行通信。

公开(公告)号：US20160276729A1

公开(公告)日：2016-09-22

申请号：US14750033

申请日：2015-06-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  Alberto Valdes-Garcia

IPC: H01P5/107 ,  H01P3/08 ,  H01P5/08 ,  H01P3/16

CPC classification number: H01P5/107 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/19031 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/19039 ,  H01P3/08 ,  H01P3/121 ,  H01P3/16 ,  H01P5/02 ,  H01P5/08 ,  H01P5/087 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/50 ,  H05K1/0243 ,  H05K2201/037 ,  H05K2201/10522

Abstract: Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

公开(公告)号：US20160240513A1

公开(公告)日：2016-08-18

申请号：US15137123

申请日：2016-04-25

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Yu Luo ,  Steven L. Wright

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/50 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11334 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/1712 ,  H01L2224/1751 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06565

Abstract: A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.

Abstract translation: 一种结构包括在包括多个突起的第一基板和包括多个焊料凸块的第二基板之间的电互连，所述多个突起包括穿透多个焊料凸块的尖锐尖端，并且通过物理建立永久电互连 所述多个突起与所述多个焊料凸块之间的接触包括冶金接头。

公开(公告)号：US20160219715A1

公开(公告)日：2016-07-28

申请号：US15090656

申请日：2016-04-05

Applicant: International Business Machines Corporation

Inventor： Steven A. Cordes ,  Bing Dang ,  Sung K. Kang ,  Yu Luo ,  Peter J. Sorce

IPC: H05K3/00

CPC classification number: H05K3/0094 ,  C23C18/1603 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/1689 ,  C25D5/02 ,  C25D7/00 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/5384 ,  H05K3/388 ,  H05K3/424 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/308

Abstract: A method for filling vias with metal includes receiving a substrate having vias, forming a metal plating layer over the vias on a first side of the substrate, fill-plating the vias with a first metal beginning with the metal plating layer on the first side of the substrate and advancing to a second side of the substrate to provide filled vias. The metal plating layer may be subsequently patterned to provide selected circuit connections or chemically-mechanically polished to completely remove the metal plating layer. Forming a metal plating layer over the vias may include filling the vias with a sacrificial filler to enable formation of the metal plating layer and subsequently removing the sacrificial filler via an etching operation or the like. In other embodiments, forming the metal plating layer over the vias is accomplished by bonding a metallic layer onto the first side of the substrate.

公开(公告)号：US12121368B2

公开(公告)日：2024-10-22

申请号：US17095101

申请日：2020-11-11

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Rajeev Narayanan ,  Jeffrey L. Rogers

IPC: A61B5/00 ,  A61B5/01 ,  A61B5/0534 ,  A61B5/0537 ,  A61B5/0538 ,  A61B5/08 ,  A61B5/145 ,  A61B5/1473 ,  A61B5/22

CPC classification number: A61B5/682 ,  A61B5/002 ,  A61B5/01 ,  A61B5/0534 ,  A61B5/0537 ,  A61B5/0538 ,  A61B5/0816 ,  A61B5/14539 ,  A61B5/14542 ,  A61B5/1473 ,  A61B5/228 ,  A61B5/4277 ,  A61B5/4542 ,  A61B5/4818 ,  A61B5/4884 ,  A61B2562/0247 ,  A61B2562/0261 ,  A61B2562/028 ,  A61B2562/16

Abstract: Embodiments of the present invention provide an oral device. According to one embodiment of the present invention, a mouthpiece suitable to detachably engage teeth of an upper jaw is provided. The mouthpiece comprises an adhesive layer configured to attach a hermetically sealed chamber to the mouthpiece. The hermitically sealed chamber fits within a concave space created by the mouthpiece. The hermitically sealed chamber comprises two layers and embedded between those two layers are a pressure sensor, a microphone, an optical sensor, a temperature sensor, a communications module, a storage enclosure, and a biosensor. Each of the pressure sensor, the microphone, the optical sensor, the temperature sensor, the communications module, the storage enclosure, and the biosensor are operably connected within the hermetically sealed chamber.

公开(公告)号：US11539088B2

公开(公告)日：2022-12-27

申请号：US16813071

申请日：2020-03-09

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Leanna Pancoast ,  Jae-Woong Nah ,  John Knickerbocker

IPC: H01M50/10 ,  H01M10/052 ,  H01M10/04 ,  H01M50/116 ,  H01M50/543

Abstract: Microbatteries and methods for forming microbatteries are provided. The microbatteries and methods address at least one or both of edge sealing issues for edges of a stack forming part of a microbatteries and overall sealing for individual cells for microbatteries in a batch process. A transferable solder molding apparatus and sealing structure are proposed in an example to provide a metal casing for a solid-state thin-film microbattery. An exemplary proposed process involves deposition or pre-forming low-temperature solder casing separately from the microbatteries. Then a thermal compression may be used to transfer the solder casing to each battery cell, with a handler apparatus in a batch process in an example. These exemplary embodiments can address the temperature tolerance constrain for solid state thin film battery during handling, metal sealing, and packaging.

公开(公告)号：US11539080B2

公开(公告)日：2022-12-27

申请号：US16787167

申请日：2020-02-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  H01M10/052 ,  H01M10/04 ,  A61B5/00

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.