公开(公告)号：US07459044B2

公开(公告)日：2008-12-02

申请号：US11050264

申请日：2005-02-03

Applicant: Subhotosh Khan ,  Michael Robert Samuels ,  Mikhail R. Levit

Inventor： Subhotosh Khan ,  Michael Robert Samuels ,  Mikhail R. Levit

IPC: B05D5/12 ,  B05D3/08

CPC classification number: H05K1/0366 ,  B32B5/022 ,  B32B5/145 ,  B32B5/26 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2264/0221 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2307/7265 ,  B32B2457/08 ,  D21H27/30 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24942 ,  Y10T442/2066 ,  Y10T442/2484 ,  Y10T442/2861

Abstract: A sheet comprising thermoplastic polymer (TP) and short high tensile modulus fibers, in which the concentration of TP in the middle of the sheet is higher than at the surface of the sheet, useful for making prepregs with a thermoset resin.

Abstract translation: 包含热塑性聚合物（TP）和短的高拉伸模量纤维的片材，其中片材中部的TP浓度高于片材表面的TP浓度，可用于制备具有热固性树脂的预浸料。

公开(公告)号：US20070158824A1

公开(公告)日：2007-07-12

申请号：US11647341

申请日：2006-12-29

Applicant: Chia-Liang Hsu

Inventor： Chia-Liang Hsu

IPC: H01L23/053

CPC classification number: H01L23/142 ,  B22F2998/00 ,  H01L23/367 ,  H01L23/3733 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/053 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  B22F1/004 ,  B22F1/0007 ,  B22F1/0055 ,  H01L2924/00

Abstract: This invention relates to a hybrid composite material substrate. The substrate includes a conductive layer, an insulating layer, and a dispersion material extending from the conductive layer into the insulating layer.

Abstract translation: 本发明涉及混合复合材料基板。 衬底包括导电层，绝缘层和从导电层延伸到绝缘层中的分散材料。

公开(公告)号：US07026054B2

公开(公告)日：2006-04-11

申请号：US09871896

申请日：2001-06-04

Applicant: Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

Inventor： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

IPC: B32B15/04

CPC classification number: H05K1/0366 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/095 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2916 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A laminate includes a metal layer which is formed on and covers a surface of an insulating substrate activated by a plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 μm and an average fiber length of 10 to 50 μm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.

Abstract translation: 层压体包括通过溅射法，真空蒸镀法，离子镀法等任一种方法形成在绝缘基板的表面并覆盖由等离子体处理而起作用的金属层。 通过将相对于100质量份的基础树脂相对于100质量份的含有20〜150质量份平均纤维直径为0.1〜5μm，平均纤维长度为10〜50μm的纤维状填料， 包括热塑性树脂和热固性树脂。

公开(公告)号：US20050043443A1

公开(公告)日：2005-02-24

申请号：US10919044

申请日：2004-08-16

Applicant: Robert Van Mullekom ,  Detlev Joachimi ,  Alexander Karbach ,  Peter Persigehl ,  Maarten De Bock

Inventor： Robert Van Mullekom ,  Detlev Joachimi ,  Alexander Karbach ,  Peter Persigehl ,  Maarten De Bock

IPC: C03C25/36 ,  C08K7/14 ,  C08K9/08 ,  H05K1/03 ,  C08K9/00 ,  C08K3/40

CPC classification number: C08K7/14 ,  C03C25/36 ,  C08K9/08 ,  H05K1/0373 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/09118

Abstract: A thermoplastic glass fibers reinforced molding composition that exhibits improved mechanical properties and resistance to hydrolysis is disclosed. The composition contains at least one thermoplastic polymer, sized glass fibers, and optional conventional additives and auxiliary substances. The sizing agent that is substantially free of emulsifiers not bound to the resin contains (a) at least one epoxide-functional, oligomeric resin, having epoxide group content of 0.15 to 0.75 mole per 100 g of resin, average functionality of at least 2.3 epoxide groups per molecule, (b) at least one epoxide curing agents, and (c) at least one silane coupling agent.

Abstract translation: 公开了一种具有改进的机械性能和抗水解性的热塑性玻璃纤维增​​强模塑组合物。 该组合物含有至少一种热塑性聚合物，尺寸的玻璃纤维和任选的常规添加剂和辅助物质。 基本上不含与树脂结合的乳化剂的上浆剂​​包含（a）至少一种环氧官能的低聚树脂，其环氧基团含量为每100克树脂0.15至0.75摩尔，平均官能度至少为2.3环氧化物 （b）至少一种环氧化物固化剂，和（c）至少一种硅烷偶联剂。

公开(公告)号：US20040238834A1

公开(公告)日：2004-12-02

申请号：US10857025

申请日：2004-06-01

Inventor： Tsuyoshi Yasuoka ,  Hirokazu Yoshida

IPC: H01L033/00

CPC classification number: H05K3/284 ,  H05K1/0274 ,  H05K2201/0112 ,  H05K2201/0251 ,  H05K2201/10106

Abstract: A highly reliable LED display apparatus is provided in which dust and other similar particles are prevented from entering spaces formed between light-emitting diodes and openings in a mask member provided on a circuit board. The LED display apparatus has the circuit board, the light-emitting diodes provided at predetermined positions thereon, and the mask member which is disposed approximately parallel to the circuit board. The mask member has openings at positions corresponding to the light-emitting diodes which are placed inside the respective openings. In the LED display apparatus described above, the openings of the mask member have fine projections on side surfaces thereof. The fine projections can be formed on the mask member by a flock processing technique.

Abstract translation: 提供了一种高度可靠的LED显示装置，其中防止灰尘和其它类似颗粒进入设置在电路板上的掩模构件中的发光二极管和开口之间形成的空间。 LED显示装置具有电路板，设置在其上的预定位置处的发光二极管和与电路板大致平行设置的掩模构件。 掩模构件在对应于放置在相应开口内的发光二极管的位置处具有开口。 在上述LED显示装置中，掩模构件的开口在其侧表面上具有微小的突起。 可以通过羊群处理技术在掩模构件上形成微细的突起。

公开(公告)号：US06673190B2

公开(公告)日：2004-01-06

申请号：US09826718

申请日：2001-04-04

Applicant: David Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard Pommer

Inventor： David Haas ,  Chengzeng Xu ,  Mavyn McAuliffe ,  Scott Zimmerman ,  Laura Miller ,  Meifang Qin ,  Baopei Xu ,  Richard Pommer

IPC: B32B3100

CPC classification number: H05K3/4626 ,  B29C70/885 ,  B32B7/06 ,  B32B15/08 ,  B32B17/04 ,  H05K3/0032 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/10378 ,  Y10S428/901 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T428/1476 ,  Y10T428/24917 ,  Y10T428/2839 ,  Y10T442/2861 ,  Y10T442/2992 ,  Y10T442/60 ,  Y10T442/615 ,  Y10T442/616 ,  Y10T442/623 ,  Y10T442/674 ,  Y10T442/697

Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.

Abstract translation: 本发明涉及包括非织造增强材料和至少一种树脂材料的可激光粘合层材料。 本发明还包括使用本发明的粘合层来制造高密度多层印刷线路板的方法。

公开(公告)号：US20030045164A1

公开(公告)日：2003-03-06

申请号：US09506318

申请日：2000-02-17

Inventor： Fumio Echigo ,  Yoshihiro Kawakita

IPC: B32B005/16 ,  B32B027/02

CPC classification number: D21H13/20 ,  B29C70/12 ,  D04H1/587 ,  D04H1/60 ,  D04H1/64 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/015 ,  H05K2201/0175 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/27 ,  Y10T442/2861 ,  Y10T442/2902

Abstract: The present invention provides a nonwoven fabric material prepared from short fibers including thermal-resistant synthetic fibers bound with an inorganic binder, a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed.

Abstract translation: 本发明提供一种由短纤维制成的无纺布材料，包括与无机粘合剂结合的耐热合成纤维，预浸料和使用其的电路板。 电路板即使在高温下也具有优异的尺寸稳定性，并且防止电路板翘曲或被吸湿等损坏。 无机粘合剂是由低熔点玻璃溶液或至少包含分散在其中的至少一种纤维或低熔点玻璃颗粒的水分散性胶体溶液形成的残留物。 当使用粘合剂时，形成通过硅氧烷键合的化学共价键合。

公开(公告)号：US20020132108A1

公开(公告)日：2002-09-19

申请号：US09986005

申请日：2001-11-07

Applicant: Matsushita Electric Works, Ltd.

Inventor： Naoto Ikegawa ,  Masahiro Sato ,  Naoyuki Kondo

IPC: B32B005/16 ,  B32B015/08

CPC classification number: H05K1/0373 ,  C08L51/06 ,  C08L55/02 ,  C23C14/022 ,  C23C14/20 ,  H01L2224/05553 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/09118 ,  H05K2203/095 ,  Y10S428/901 ,  Y10T428/249951 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31533 ,  Y10T428/31681 ,  Y10T428/31699 ,  C08L2666/14 ,  C08L2666/02 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A resin molded component, comprising metal coating treatment being provided on the surface by a physical deposition method chosen from among sputtering, vacuum deposition, and ion plating after the surface is activated by plasma treatment, and is produced by forming a resin composition combined a base resin comprising of a thermoplastic resin or a thermosetting resin with a rubber-like elastic material.

Abstract translation: 一种树脂成型部件，其特征在于，在表面被等离子体处理后，通过溅射，真空蒸镀，离子镀等选择的物理沉积方法，在表面上设置金属被膜成形体， 由具有橡胶状弹性材料的热塑性树脂或热固性树脂构成的树脂。

公开(公告)号：US06224965B1

公开(公告)日：2001-05-01

申请号：US09344038

申请日：1999-06-25

Applicant: David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe

Inventor： David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe

IPC: B32B300

CPC classification number: H05K3/4673 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T442/2008 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2762 ,  Y10T442/2861 ,  Y10T442/2926

Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

Abstract translation: 本发明涉及包含无纺布填料和树脂材料的电子基片。 本发明还包括由本发明的电子基板制造的电子产品，其包括但不限于预浸料，金属包覆层压板以及带和不带通孔的印刷线路板。 本发明还包括一种制造印刷的叠层电路板的方法，包括在预浸料坯中形成预浸料并形成至少一个通孔的步骤。

公开(公告)号：US5384181A

公开(公告)日：1995-01-24

申请号：US131870

申请日：1993-10-05

Applicant: David J. Arthur ,  Gwo S. Swei ,  Allen F. Horn, III ,  Brett Kilhenny

Inventor： David J. Arthur ,  Gwo S. Swei ,  Allen F. Horn, III ,  Brett Kilhenny

IPC: C08K9/06 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46 ,  B32B9/00

CPC classification number: H05K1/0373 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/389 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31692

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a silane and the ceramic has a volume % fraction of between about 26-45. The composite of this invention exhibits excellent chemical resistance, particularly to alkaline environments. Preferably, the silane comprises a blend of at least one phenyl silane and at least one fluorosilane. The silane is preferably coated to a level of 10% of the total weight of ceramic filler.

Abstract translation: 提出了一种复合材料，其由陶瓷填充的含氟聚合物组成，其中陶瓷涂覆有硅烷，陶瓷的体积％分数介于约26-45之间。 本发明的复合材料表现出优异的耐化学性，特别是对碱性环境。 优选地，硅烷包含至少一种苯基硅烷和至少一种氟硅烷的共混物。 优选将硅烷涂覆至陶瓷填料总重量的10％的水平。