公开(公告)号：US07196531B2

公开(公告)日：2007-03-27

申请号：US11073187

申请日：2005-03-04

Applicant: Gary W. Grube ,  Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Poya Lotfizadeh ,  Jim Chih-Chiang Tseng

Inventor： Gary W. Grube ,  Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Poya Lotfizadeh ,  Jim Chih-Chiang Tseng

IPC: G01R31/02 ,  G01R31/26 ,  G06F17/50

CPC classification number: G01R31/2886 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R1/07378 ,  G01R3/00 ,  Y10T29/49126

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

公开(公告)号：US07189077B1

公开(公告)日：2007-03-13

申请号：US09710539

申请日：2000-11-09

Applicant: Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H01R12/10

CPC classification number: H05K7/1069 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K3/4092 ,  Y10T29/49151 ,  Y10T29/4922

Abstract: Improved lithographic type microelectronic spring structures and methods are disclosed, for providing improved tip height over a substrate, an improved elastic range, increased strength and reliability, and increased spring rates. The improved structures are suitable for being formed from a single integrated layer (or series of layers) deposited over a molded sacrificial substrate, thus avoiding multiple stepped lithographic layers and reducing manufacturing costs. In particular, lithographic structures that are contoured in the z-direction are disclosed, for achieving the foregoing improvements. For example, structures having a U-shaped cross-section, a V-shaped cross-section, and/or one or more ribs running along a length of the spring are disclosed. The present invention additionally provides a lithographic type spring contact that is corrugated to increase its effective length and elastic range and to reduce its footprint over a substrate, and springs which are contoured in plan view. The present invention further provides combination (both series and parallel) electrical contacts tips for lithographic type microelectronic spring structures. The microelectronic spring structures according to the present invention are particularly useful for making very fine pitch arrays of electrical connectors for use with integrated circuits and other substrate-mounted electronic devices, because their performance characteristics are enhanced, while at the same time, they may be manufactured at greatly reduced costs compared to other lithographic type microelectronic spring structures.

Abstract translation: 公开了改进的光刻型微电子弹簧结构和方法，用于提供改善的基板上的尖端高度，改进的弹性范围，增加的强度和可靠性以及增加的弹簧刚度。 改进的结构适于由沉积在模制的牺牲衬底上的单个集成层（或一系列层）形成，从而避免多个阶梯式光刻层并降低制造成本。 特别地，为了实现上述改进，公开了在z方向上成形的平版印刷结构。 例如，公开了具有沿着弹簧的长度延伸的U形横截面，V形横截面和/或一个或多个肋的结构。 本发明另外提供了一种平版印刷型弹性接触件，其被波纹化以增加其有效长度和弹性范围并减小其在基底上的覆盖面，以及在俯视图中成形的弹簧。 本发明还提供了用于光刻型微电子弹簧结构的组合（串联和并联）电接触尖端。 根据本发明的微电子弹簧结构特别适用于制造用于集成电路和其它基板安装的电子设备的电连接器的非常精细的间距阵列，因为它们的性能特性被增强，同时它们可以是 与其他光刻型微电子弹簧结构相比大大降低了成本。

公开(公告)号：US07179662B2

公开(公告)日：2007-02-20

申请号：US10244910

申请日：2002-09-16

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: H01L21/66

CPC classification number: H01L22/22 ,  H01L23/5256 ,  H01L23/5258 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method and system for sealing or covering exposed fuses on a semiconductor device are disclosed. A semiconductor device prober incorporating a spray device for applying a sealing compound to individual fuses on a semiconductor device subsequent to testing the semiconductor device is disclosed. A method and system for sealing exposed fuses on a semiconductor device is disclosed which allows the sealing step to be performed either prior to or following singulation of the semiconductor device into individual dice.

Abstract translation: 公开了一种用于密封或覆盖半导体器件上暴露的熔丝的方法和系统。 公开了一种半导体器件探测器，其包括用于在测试半导体器件之后在半导体器件上的单个熔丝施加密封化合物的喷射装置。 公开了一种用于密封半导体器件上的暴露的熔丝的方法和系统，其允许在将半导体器件分割成单个裸片之前或之后执行密封步骤。

公开(公告)号：US07169646B2

公开(公告)日：2007-01-30

申请号：US11237090

申请日：2005-09-27

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: H01L21/44

CPC classification number: G01R1/0466 ,  G01R1/06711 ,  G01R1/07307 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/67005 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01R12/57 ,  H01R12/714 ,  H01R12/853 ,  H01R13/2407 ,  H05K3/303 ,  H05K3/325 ,  H05K3/4092 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y10S439/948 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. The stop structure may be formed as a sheet with openings and applied to an unsingulated semiconductor wafer with resilient contacts located in the openings.

Abstract translation: 互连组件和形成和使用它们的方法。 在本发明的一个示例中，互连组件包括基板，弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置，其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中，止动结构设置在具有第一接触元件的第一基板上，该止动结构限定弹性接触元件的第一位置，该第一位置设置在第二基板上，弹性接触元件位于其中 与第一接触元件机械和电接触。 止动结构可以形成为具有开口的片材，并且被施加到位于开口中的具有弹性接触点的未起伏半导体晶片。

公开(公告)号：US07140883B2

公开(公告)日：2006-11-28

申请号：US10692114

申请日：2003-10-23

Applicant: Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier, II ,  William D. Smith

Inventor： Igor Y. Khandros ,  Benjamin N. Eldridge ,  Gaetan L. Mathieu ,  Thomas H. Dozier, II ,  William D. Smith

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/48

Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.

Abstract translation: 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。

公开(公告)号：US07127811B2

公开(公告)日：2006-10-31

申请号：US10651821

申请日：2003-08-29

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: H05K3/02

CPC classification number: H01L24/13 ,  G01R1/06761 ,  G01R1/07342 ,  G01R1/07378 ,  G01R3/00 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0308 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: A method of fabricating and using an interconnection element that includes a first element material adapted to be coupled to a substrate and a second element material comprising a material having a transformable property such that upon transformation, a shape of the interconnection is deformed. An example is a material that has a transformable property such that a volume of the first and/or second element material may undergo a thermal transformation from one volume to a different volume (such as a smaller volume) resulting in the deformation of the interconnection element.

Abstract translation: 一种制造和使用互连元件的方法，所述互连元件包括适于耦合到基底的第一元件材料和第二元件材料，所述第二元件材料包括具有可变形特性的材料，使得在变形时互连的形状变形。 一个实例是具有可变形特性的材料，使得第一和/或第二元件材料的体积可以经历从一个体积到不同体积（例如较小体积）的热转换，导致互连元件的变形 。

公开(公告)号：US07122760B2

公开(公告)日：2006-10-17

申请号：US10302969

申请日：2002-11-25

Applicant: Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

Inventor： Gaetan L. Mathieu ,  Benjamin N. Eldridge ,  Gary W. Grube

IPC: B23H9/00

CPC classification number: B23H9/00 ,  G01R1/07314

Abstract: A method of forming a probe array includes forming a layer of tip material over a block of probe material. A first electron discharge machine (EDM) electrode is positioned over the layer of tip material, the EDM electrode having a plurality of openings corresponding to a plurality of probes to be formed. Excess material from the layer of tip material and the block of probe material is removed to form the plurality of probes. A substrate having a plurality of through holes corresponding to the plurality of probes is positioned so that the probes penetrate the plurality of through holes. The substrate is bonded to the plurality of probes. Excess probe material is removed so as to planarize the substrate.

Abstract translation: 形成探针阵列的方法包括在探针材料块上形成尖端材料层。 第一电子放电机（EDM）电极位于尖端材料层上方，EDM电极具有与要形成的多个探针对应的多个开口。 去除从尖端材料层和探针材料块的多余材料以形成多个探针。 具有对应于多个探针的多个通孔的基板被定位成使得探针穿透多个通孔。 衬底被结合到多个探针。 去除过量的探针材料以使基底平坦化。

公开(公告)号：US07084650B2

公开(公告)日：2006-08-01

申请号：US10321743

申请日：2002-12-16

Applicant: Timothy E. Cooper ,  Benjamin N. Eldridge ,  Carl V. Reynolds ,  Ravindra Vaman Shenoy

Inventor： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Carl V. Reynolds ,  Ravindra Vaman Shenoy

IPC: G01R31/02

CPC classification number: G01R31/2887 ,  G01R3/00 ,  G01R31/2886

Abstract: Methods and apparatuses for testing semiconductor devices are disclosed. Over travel stops limit over travel of a device to be tested with respect to probes of a probe card assembly. Feedback control techniques are employed to control relative movement of the device and the probe card assembly. A probe card assembly includes flexible base for absorbing excessive over travel of the device to be tested with respect to the probe card assembly.

公开(公告)号：US07059047B2

公开(公告)日：2006-06-13

申请号：US10673691

申请日：2003-09-29

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen ,  Michael A. Stadt

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pedersen ,  Michael A. Stadt

IPC: H01R9/00

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

公开(公告)号：US07010854B2

公开(公告)日：2006-03-14

申请号：US10119963

申请日：2002-04-10

Applicant: Benjamin N. Eldridge ,  Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge ,  Gaetan L. Mathieu

IPC: H05K3/30

CPC classification number: B81C1/00214 ,  B81B7/04 ,  B81C3/002 ,  B81C2203/051 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15174 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49204 ,  H01L2924/00

Abstract: Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.