公开(公告)号：US20060067057A1

公开(公告)日：2006-03-30

申请号：US11239300

申请日：2005-09-30

Applicant: Cheng-Lai Shen ,  Chuan-Te Chang

Inventor： Cheng-Lai Shen ,  Chuan-Te Chang

IPC: H05K7/20

CPC classification number: H01L23/427 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/467 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K2201/066 ,  H05K2201/10659 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A heat sink module is used for a central processing unit (CPU). The CPU is located on a top surface of a circuit board. The heat sink module includes a heat conducting structure for conducting and radiating the heat of the CPU. The heat conducting structure goes via the circuit board and extends to a bottom surface of the circuit board.

Abstract translation: 散热模块用于中央处理单元（CPU）。 CPU位于电路板的顶面。 散热器模块包括用于传导和辐射CPU的热量的导热结构。 导热结构通过电路板延伸到电路板的底面。

公开(公告)号：US06975518B2

公开(公告)日：2005-12-13

申请号：US10446462

申请日：2003-05-28

Applicant: Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahyaei-Moayyed ,  Geoffrey L. Reid

Inventor： Kristopher Frutschy ,  Glenn E. Stewart ,  Farzaneh Yahyaei-Moayyed ,  Geoffrey L. Reid

IPC: H01L23/498 ,  H05K1/02 ,  H05K3/32 ,  H05K7/10 ,  H05K3/30 ,  H05K7/12

CPC classification number: H05K1/0263 ,  H01L23/49811 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10734 ,  Y10T29/4913

Abstract: An electronic assembly includes one or more conductive clamps (302, 304, FIG. 3), which are used to supply current to an integrated circuit (IC) package (308). The conductive clamps are attached to a printed circuit (PC) board (312), which supplies the current to the IC package over one clamp, and receives returned current from the IC package over another clamp. Each clamp contacts a contact pad (330) on the surface of the PC board, and contacts another contact pad (334) on the top surface of the IC package. Vias (338, 339) and conductive planes (340, 342) within the package then carry current to and from an IC (e.g., IC 306) connected to the package. In another embodiment, the clamp (904, FIG. 9) holds a conductive structure (902) in place between the PC board contact pad (908) and the IC package contact pad (914), and current is carried primarily over the conductive structure, rather than over the clamp.

Abstract translation: 电子组件包括用于向集成电路（IC）封装（308）提供电流的一个或多个导电钳位件（302,304，图3）。 导电夹具连接到印刷电路板（PC）（312），该印刷电路板（312）通过一个夹具将电流提供给IC封装，并且通过另一个夹具接收来自IC封装的返回电流。 每个夹具接触PC板表面上的接触焊盘（330），并接触IC封装顶表面上的另一接触焊盘（334）。 封装内的通孔（338,339）和导电平面（340,342）然后将电流传送到连接到封装的IC（例如，IC 306）。 在另一个实施例中，夹具（904，图9）将导电结构（902）保持在PC板接触焊盘（908）和IC封装接触焊盘（914）之间的适当位置，电流主要承载在导电结构 ，而不是超过钳位。

公开(公告)号：US20050257958A1

公开(公告)日：2005-11-24

申请号：US11189999

申请日：2005-07-27

Applicant: Aneta Wyrzykowska ,  Herman Kwong ,  Luigi Difilippo

Inventor： Aneta Wyrzykowska ,  Herman Kwong ,  Luigi Difilippo

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/46

CPC classification number: H05K1/112 ,  H01L2224/14 ,  H01L2224/17 ,  H01L2924/00014 ,  H05K3/303 ,  H05K3/4623 ,  H05K2201/09472 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A method for implementing a circuit component on a surface of a multilayer circuit board is provided. The circuit component includes a plurality of pins and the circuit board includes a plurality of electrically conductive vias penetrating at least one layer of the circuit board and being arranged so as to form at least one channel for routing one or more traces at one or more signal layers of the circuit board. The method comprises the step of forming at least one pin of the plurality of pins of the circuit component to have a length compatible with a depth of a corresponding via of the circuit board.

公开(公告)号：US06911734B2

公开(公告)日：2005-06-28

申请号：US10391746

申请日：2003-03-20

Applicant: Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

Inventor： Hiroshi Kikuchi ,  Norio Nakazato ,  Hideko Ando ,  Takashi Suga ,  Satoru Isomura ,  Takashi Kubo ,  Hiroyasu Sasaki ,  Masanori Fukuhara ,  Naotaka Tanaka ,  Fujiaki Nose

IPC: H01L23/66 ,  H05K1/02 ,  H05K3/36 ,  H01L23/34

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15173 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1903 ,  H01L2924/19106 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0219 ,  H05K3/361 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10659 ,  H05K2201/10681 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A high-frequency signal from a tape-shaped line section having a surface layer signal lead and surface layer GND lead disposed on both sides thereof is directly inputted to a semiconductor chip via a signal surface layer wiring of a package substrate and through solder bump electrodes. Alternatively, a high-frequency signal from the semiconductor chip is outputted to the outside via the tape-shaped line section in reverse. Owing to the transmission of the high-frequency signal by only a microstrip line at the whole surface layer of the package substrate, the high-frequency signal can be transmitted by only the microstrip line at the surface layer without through vias or the like. Accordingly, the high-frequency signal can be transmitted without a loss in frequency characteristic, and a high-quality high-frequency signal can be transmitted with a reduction in loss at high-frequency transmission.

公开(公告)号：US06791845B2

公开(公告)日：2004-09-14

申请号：US10255312

申请日：2002-09-26

Applicant: Yakov Belopolsky

Inventor： Yakov Belopolsky

IPC: H05K710

CPC classification number: H05K3/3415 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K3/244 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3447 ,  H05K3/3463 ,  H05K2201/09781 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2203/047 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49004 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49165 ,  Y10T29/49222 ,  H01L2224/0401

Abstract: Methods for mounting electrical components on a substrate and securely retaining the components are described. The methods include altering solder paste compositions, interposed between component retentive pins and retentive through holes, during a reflow process. Electronic assemblies including circuit boards and electrical components mounted thereto are also described. In one of the electronic assembly embodiments, materials originally associated with a mounted electrical component migrate into solder paste coupling the electrical component to the circuit board.

Abstract translation: 描述了将电气部件安装在基板上并可靠地保持部件的方法。 所述方法包括在回流过程期间改变介于组分保持性针和保持性通孔之间的焊膏组合物。 还描述了包括电路板和安装在其上的电气部件的电子组件。 在电子组装实施例之一中，最初与安装的电气部件相关联的材料迁移到将电气部件连接到电路板的焊膏中。

公开(公告)号：US06781839B2

公开(公告)日：2004-08-24

申请号：US10457122

申请日：2003-06-09

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K720

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract translation: 因此，高密度垂直表面安装封装和热载体包括散热器。

公开(公告)号：US20030058650A1

公开(公告)日：2003-03-27

申请号：US09963101

申请日：2001-09-25

Inventor： Kelvin Shih

IPC: F21V029/00

CPC classification number: H01L33/647 ,  H01L33/62 ,  H01L2224/48091 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/10659 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A light emitting diode (LED) has an integrated heat sink structure for removing heat from an LED junction and for dissipating heat from the junction to the ambient air. The anode and the cathode both either act as or are coupled to a thermally conductive material which acts as the heat sink. In one embodiment, the heat sink forms a mounting configuration that allows air to circulate around multiple surfaces to maximize heat dissipation. As a result, the LED junction temperature remains low, allowing the LED to by driven with higher currents and generate a higher light output without adverse temperature-related effects.

Abstract translation: 发光二极管（LED）具有集成的散热器结构，用于从LED结点移除热量，并将热量从结到散热到环境空气。 阳极和阴极既可以作为或耦合到用作散热器的导热材料。 在一个实施例中，散热器形成允许空气围绕多个表面循环以最大化散热的安装构造。 结果，LED结温度保持较低，允许LED以更高的电流驱动，并产生更高的光输出，而不会产生不利的温度相关影响。

公开(公告)号：US20030006061A1

公开(公告)日：2003-01-09

申请号：US09885614

申请日：2001-06-20

Applicant: International Business Machines Corporation

Inventor： Mark R. Brinthaupt III ,  Lisa J. Jimarez ,  William F. Wildey

IPC: H05K001/03

CPC classification number: H05K1/116 ,  H05K1/0201 ,  H05K3/3415 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/10189 ,  H05K2201/10659

Abstract: A multi-layer circuit board is disclosed. The circuit board comprises a plurality of conductive planes; a plurality of plated through hole sets, each set comprising one or more plated through holes, none to all of the plated through holes of each set contacting at least one the conductive plane; a thermal break formed around each plated through hole in each conductive plane to which the plated through hole is connected; and one or more thermal vents, in the vicinity of each plated through hole in each conductive plane to which the plated through hole is connected. Additionally, surface mount technology pads are provided on a top surface of the circuit board.

Abstract translation: 公开了一种多层电路板。 电路板包括多个导电平面; 多个电镀通孔组，每组包括一个或多个电镀通孔，每组的电镀通孔中的至少一个接触至少一个导电平面; 在连接有电镀通孔的每个导电平面中的每个电镀通孔周围形成热断裂; 以及一个或多个热通风口，在每个电镀通孔附近，电镀通孔所连接的每个导电平面中。 此外，表面贴装技术垫设置在电路板的顶表面上。

公开(公告)号：US20030001254A1

公开(公告)日：2003-01-02

申请号：US09893307

申请日：2001-06-27

Inventor： James Daniel Jackson ,  Terrance J. Dishongh ,  Damion T. Searls

IPC: H01L023/488

CPC classification number: H05K3/3415 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2224/05599

Abstract: A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate and the second substrate and a multiplicity of signal connections separate from the plurality of power connections are also coupled between the first substrate and the second substrate. Each of the plurality of power connections have a substantially different size and shape compared to each of the multiplicity of signal connections.

公开(公告)号：US06435906B1

公开(公告)日：2002-08-20

申请号：US09164116

申请日：1998-09-30

Applicant: Jacques Longueville

Inventor： Jacques Longueville

IPC: H01R1366

CPC classification number: H05K3/341 ,  H01R12/57 ,  H01R12/707 ,  H01R43/0256 ,  H05K3/3421 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/10659 ,  Y02P70/613

Abstract: An electrical connector for assembly on a printed circuit board, the electrical connector having connecting elements for connecting the electrical connector at least electrically to the printed circuit board, and including an anchoring device for mechanically connecting the electrical connector to the printed circuit board, the anchoring device including a multiplicity of anchoring elements arranged side by side and formed so as to be solderable to the printed circuit board.

Abstract translation: 一种用于组装在印刷电路板上的电连接器，所述电连接器具有至少电连接到所述印刷电路板的用于连接所述电连接器的连接元件，并且包括用于将所述电连接器机械连接到所述印刷电路板的锚定装置， 装置，其包括并排布置的多个锚固元件，并且形成为可焊接到印刷电路板。