公开(公告)号：US20100044080A1

公开(公告)日：2010-02-25

申请号：US12608326

申请日：2009-10-29

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H05K1/00 ,  C25D5/00 ,  C25D5/02 ,  C25D5/48

CPC classification number: C25D5/022 ,  C25D5/54 ,  H05K1/0373 ,  H05K3/07 ,  H05K3/107 ,  H05K3/188 ,  H05K2201/0191 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2201/09036 ,  H05K2203/1492

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

公开(公告)号：US20090313819A1

公开(公告)日：2009-12-24

申请号：US12489084

申请日：2009-06-22

Applicant: Karen P. Shrier

Inventor： Karen P. Shrier

IPC: H05K3/10

CPC classification number: H01R13/6485 ,  H01C7/005 ,  H01C17/06586 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/0052 ,  H05K2201/0738 ,  Y10T29/49107 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49195 ,  Y10T29/49222

Abstract: Devices capable of protecting electronic components during the occurrence of a disturbance event using printed circuit board manufacturing techniques. A three (3) layer structure is formed comprising a polymer-based formulation sandwiched between two electrode layers. The devices can be manufactured in panel form providing high quantities of devices which can be removed from the panel and applied directly to the component to be protected. Desired patterns can be formed on either one of the electrode layers by photo-etch techniques thereby providing a process that can be tailored to a large number of applications.

Abstract translation: 在使用印刷电路板制造技术的干扰事件发生期间能够保护电子部件的装置。 形成三（3）层结构，其包含夹在两个电极层之间的聚合物基配方。 这些装置可以以面板形式制造，提供大量的装置，其可以从面板上移除并直接施加到待保护的部件上。 期望的图案可以通过光蚀刻技术形成在任一个电极层上，从而提供可以针对大量应用而定制的工艺。

公开(公告)号：US07612976B2

公开(公告)日：2009-11-03

申请号：US11498916

申请日：2006-08-03

Applicant: Hundi Panduranga Kamath

Inventor： Hundi Panduranga Kamath

IPC: H02H1/00

CPC classification number: H05K1/0257 ,  H01C1/146 ,  H01C7/12 ,  H05K1/0259 ,  H05K1/167 ,  H05K3/323 ,  H05K3/4053 ,  H05K3/4614 ,  H05K2201/0738 ,  H05K2201/09318

Abstract: Circuit boards including embedded transient voltage protection.

Abstract translation: 电路板包括嵌入式瞬态电压保护。

公开(公告)号：US07609141B2

公开(公告)日：2009-10-27

申请号：US11679061

申请日：2007-02-26

Applicant: Edwin James Harris ,  Timothy Pachla ,  Tushar Vyas

Inventor： Edwin James Harris ,  Timothy Pachla ,  Tushar Vyas

IPC: H01C7/10

CPC classification number: H01C7/12 ,  H01G2/14 ,  H02H9/044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/0738 ,  H05K2201/09763

Abstract: A first voltage variable material (“VVM”) includes an insulative binder, first conductive particles with a core and a shell held in the insulating binder and second conductive particles without a shell held in the insulating binder; a second VVM includes an insulating binder, first conductive particles with a core and a shell held in the insulating binder, second conductive particles without a shell held in the insulating binder, and semiconductive particles with a core and a shell held in the insulating binder; a third VVM includes only first conductive particles with a core and a shell held in the insulating binder.

Abstract translation: 第一电压可变材料（“VVM”）包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒和没有保持在绝缘粘合剂中的壳的第二导电颗粒; 第二VVM包括绝缘粘合剂，具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒，没有保持在绝缘粘合剂中的壳的第二导电颗粒和保持在绝缘粘合剂中的芯和壳的半导体颗粒; 第三VVM仅包括具有芯和保持在绝缘粘合剂中的壳的第一导电颗粒。

公开(公告)号：US20090044970A1

公开(公告)日：2009-02-19

申请号：US12284790

申请日：2008-09-24

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H05K1/09 ,  H05K3/46 ,  H01L21/768

CPC classification number: H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A method comprises providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

Abstract translation: 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。

公开(公告)号：US20080278873A1

公开(公告)日：2008-11-13

申请号：US12049726

申请日：2008-03-17

Applicant: Yves Leduc ,  Nathalie Messina ,  Charvaka Duvvury ,  Kurt P. Wachtler

Inventor： Yves Leduc ,  Nathalie Messina ,  Charvaka Duvvury ,  Kurt P. Wachtler

IPC: H02H9/04 ,  H01H11/00

CPC classification number: H01L23/62 ,  H01L23/60 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/15311 ,  H05K1/0259 ,  H05K2201/0738 ,  Y10T29/49105 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A packaged semiconductor device (200) with a substrate (220) having, sandwiched in an insulator (221), a flat sheet-like sieve member (240) made of a non-linear material switching from insulator to conductor mode at a preset voltage. Both member surfaces are free of indentations; the member is perforated by through-holes, which are grouped into a first set (241) and a second set (242). Metal traces (251) over one member surface are positioned across the first set through-holes (241); each trace is connected to a terminal on the substrate top and, through the hole, to a terminal on the substrate bottom. Analogous for metal traces (252) over the opposite member surface and second set through-holes (242). Traces (252) overlap with a portion of traces (252) to form the locations for the conductivity switches, creating local ultra-low resistance bypasses to ground for discharging overstress events.

Abstract translation: 一种封装半导体器件（200），其具有夹在绝缘体（221）中的基板（220），由预定电压从绝缘体切换到导体模式的非线性材料制成的平板状筛构件（240） 。 两个构件表面都没有压痕; 所述构件穿过通孔，所述通孔被分组成第一组（241）和第二组（242）。 一个构件表面上的金属迹线（251）跨过第一组通孔（241）定位; 每个迹线连接到基板顶部上的端子，并且通过孔连接到基板底部上的端子。 类似于相对构件表面上的金属迹线（252）和第二组通孔（242）。 轨迹（252）与轨迹（252）的一部分重叠以形成用于导电开关的位置，从而产生局部超低电阻旁路到地以释放过应力事件。

公开(公告)号：US07446030B2

公开(公告)日：2008-11-04

申请号：US10941226

申请日：2004-09-14

Applicant: Lex Kosowsky

Inventor： Lex Kosowsky

IPC: H01L21/4763

CPC classification number: H05K3/188 ,  C25D5/54 ,  H05K1/0254 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105

Abstract: A method is provided for fabricating current-carrying formation on substrates. The method includes providing a substrate including a layer of a voltage switchable dielectric material, forming a mask over the layer of the voltage switchable dielectric material, and forming an electrically conductive layer. The mask includes gaps and the electrically conductive layer is formed in the gaps. The voltage switchable dielectric material has a characteristic voltage and the electrically conductive layer is formed by applying a voltage in excess of the characteristic voltage to the substrate and depositing the electrically conductive material through an electrochemical process such as electroplating.

Abstract translation: 提供了一种用于在衬底上制造载流形成的方法。 该方法包括提供包括可切换电介质材料层的衬底，在电压可切换电介质材料的层上形成掩模，以及形成导电层。 掩模包括间隙，并且导电层形成在间隙中。 电压可切换介电材料具有特征电压，并且通过向基板施加超过特征电压的电压并且通过诸如电镀的电化学过程沉积导电材料来形成导电层。

公开(公告)号：US20080035370A1

公开(公告)日：2008-02-14

申请号：US11829951

申请日：2007-07-29

Applicant: Lex Kosowsky ,  Robert Fleming

Inventor： Lex Kosowsky ,  Robert Fleming

IPC: H05K1/09 ,  C23C18/54

CPC classification number: C25D15/00 ,  B82Y10/00 ,  C25D5/02 ,  C25D5/18 ,  C25D5/56 ,  C25D7/123 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/242 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0738 ,  H05K2203/105

Abstract: An electronic device comprising voltage switchable dielectric material (VSD) material that is composed in part of organic particles.

Abstract translation: 一种电子装置，包括部分由有机颗粒组成的可变压介电材料（VSD）材料。

公开(公告)号：US20080029405A1

公开(公告)日：2008-02-07

申请号：US11829946

申请日：2007-07-29

Applicant: Lex KOSOWSKY ,  Robert Fleming

Inventor： Lex KOSOWSKY ,  Robert Fleming

IPC: C25C1/12

CPC classification number: H01C17/06586 ,  B82Y10/00 ,  H01C7/105 ,  H01C17/0652 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/0738

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Abstract translation: 一个或多个实施方案提供了组合物，其包括（i）导电或半导电的有机材料，和（ii）有机材料以外的导体和/或半导体颗粒。 有机材料和导体和/或半导体颗粒被组合以提供组合物的特征是：（i）不存在超过特征电压水平的电压的电介质，以及（ii）通过施加超过 特征电压电平。

公开(公告)号：US20070211398A1

公开(公告)日：2007-09-13

申请号：US11684474

申请日：2007-03-09

Applicant: Stephen J. Whitney

Inventor： Stephen J. Whitney

IPC: H02H3/00 ,  H02H9/08 ,  G08B13/14

CPC classification number: G06K19/077 ,  G06K19/07735 ,  G06K19/07749 ,  H01L2224/16225 ,  H01L2924/12044 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/167 ,  H05K3/323 ,  H05K2201/0738 ,  H05K2201/10674 ,  H01L2924/00

Abstract: An electrostatic discharge control system and circuit uses a voltage variable material to protect an electrical circuit, such as radio frequency identification (RFID) tag, from electrostatic damage, The circuit includes two separate electrical circuit traces with a gap between the traces. The circuit includes and protects an electrical device, such as an integrated circuit, connected between the traces. The circuit includes a voltage variable material disposed adjacent to the gap and configured to directly electrically couple the first circuit trace to the second circuit trace upon occurrence of an electrostatic discharge event. The voltage variable material may be anisotropic.

Abstract translation: 静电放电控制系统和电路使用电压可变材料来保护诸如射频识别（RFID）标签的电路免受静电损坏。该电路包括两条分离的电路迹线，其间迹线间有间隙。 电路包括并保护连接在迹线之间的诸如集成电路的电气设备。 电路包括邻近间隙设置的电压可变材料，并且被配置为在发生静电放电事件时将第一电路迹线直接电耦合到第二电路迹线。 电压可变材料可以是各向异性的。