公开(公告)号：US3152288A

公开(公告)日：1964-10-06

申请号：US18554962

申请日：1962-04-06

Applicant: SHELDON MITTLER

Inventor： SHELDON MITTLER

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/365 ,  H05K1/189 ,  H05K3/306 ,  H05K3/326 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10651

公开(公告)号：US3056939A

公开(公告)日：1962-10-02

申请号：US4532360

申请日：1960-07-26

Applicant: ILLINOIS TOOL WORKS

Inventor： RAYBURN CHARLES C

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10015 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10871 ,  H05K2201/10878

公开(公告)号：US3001104A

公开(公告)日：1961-09-19

申请号：US59602156

申请日：1956-07-05

Applicant: PHILCO CORP

Inventor： BROWN JR REYNOLDS D

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2203/1446

公开(公告)号：US2984768A

公开(公告)日：1961-05-16

申请号：US51252655

申请日：1955-06-01

Applicant: ILLINOIS TOOL WORKS

Inventor： HENRY ROBERT L

IPC: A01K1/06 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K1/141 ,  A01K1/0613 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/09072 ,  H05K2201/09181 ,  H05K2201/10325 ,  H05K2201/10651

公开(公告)号：US2977672A

公开(公告)日：1961-04-04

申请号：US78012658

申请日：1958-12-12

Applicant: GEN ELECTRIC

Inventor： TELFER THOMAS A

IPC: H01B3/00 ,  H01L21/00 ,  H05K1/00 ,  H05K1/14 ,  H05K3/40 ,  H05K7/06 ,  H05K13/00

CPC classification number: H01B3/00 ,  H01L21/00 ,  H05K1/0289 ,  H05K1/141 ,  H05K3/4084 ,  H05K7/06 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10651 ,  H05K2203/1189 ,  Y10T29/49016 ,  Y10T29/49162

公开(公告)号：US20240107666A1

公开(公告)日：2024-03-28

申请号：US18070344

申请日：2022-11-28

Applicant: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.

Inventor： MING-HSUN LEE ,  CHEN-EN LIN

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H05K1/184 ,  H05K2201/10651

Abstract: A circuit board includes a first electronic component and a circuit substrate. The first electrode component includes two electrodes. The circuit substrate includes an inner substrate and an outer substrate formed on the inner substrate. The inner substrate defines a receiving cavity, and the first electronic component received in the receiving cavity. Each electrode faces an inner sidewall of the receiving cavity. The inner substrate includes a first insulating layer and a blocking layer embedded in the first insulating layer, an end of the blocking layer exposed from the inner sidewall. The outer substrate defines two through holes. Each through hole passes through a portion of the first insulating layer connected to the inner sidewall and exposes the blocking layer. A top end of each of the two electrodes facing the outer substrate is partially received in one through hole.

公开(公告)号：US20180061570A1

公开(公告)日：2018-03-01

申请号：US15802383

申请日：2017-11-02

Applicant: Deere & Company

Inventor： Christopher J. Schmit ,  Neal D. Clements ,  Andrew D. Wieland

IPC: H01G2/08 ,  H01G4/32 ,  H01G4/38 ,  H01G4/228 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01G2/08 ,  H01G4/228 ,  H01G4/32 ,  H01G4/38 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/1056 ,  H05K2201/10651

Abstract: A capacitor comprises a first winding member, where the first winding member comprises a first dielectric layer and a first conductive layer. A second winding member comprises a second dielectric layer and second conductive layer. The first winding member is interleaved, partially or entirely, with the second winding layer. A dielectric package is adapted to at least radially contain or border the first winding member and the second winding member. A first metallic member has a generally planar, radially extending surface for electrically and mechanically contacting an upper portion the first conductive layer. A second metallic member has a generally planar, radially extending surface for electrically and mechanically contacting a lower portion of the second conductive layer.

公开(公告)号：US20170154840A1

公开(公告)日：2017-06-01

申请号：US15361144

申请日：2016-11-25

Applicant: Siyang Grande Electronics Co., Ltd.

Inventor： Yunhui Zhong

IPC: H01L23/495 ,  H01L21/66 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L29/861

CPC classification number: H01L23/49562 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L22/10 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49551 ,  H01L23/49579 ,  H01L29/861 ,  H01L2224/32245 ,  H05K3/3426 ,  H05K2201/10174 ,  H05K2201/10628 ,  H05K2201/10651

Abstract: A surface mount (SMD) diode taking a runner as the body and a manufacturing method thereof are described. An elongated runner groove is adopted to cure and package groups of diode chips arranged side by side and corresponding copper pins thereon, with the utilization rate of epoxy resin up to 90% or more. The use cost of epoxy resin is thus reduced, and environmental pollution is also reduced.

公开(公告)号：US09519018B2

公开(公告)日：2016-12-13

申请号：US14284451

申请日：2014-05-22

Applicant: Dell Products L.P.

Inventor： James Lewis Petivan ,  Alan R. Dellinger

IPC: G01R31/04 ,  H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: G01R31/041 ,  G01R31/04 ,  G01R31/2813 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/113 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K2201/10939 ,  Y10T29/49156 ,  Y10T29/49167

Abstract: In accordance with embodiments of the present disclosure, a circuit board may include a connector configured to electrically couple a device to the circuit board. The connector may include a conductive element configured to be electrically coupled to a first voltage and a detection pad configured to be electrically coupled to a second voltage via a resistor, such that when a device pin of a device is electrically coupled to the conductive element, the detection pad is electrically coupled to the conductive element via the device pin.

Abstract translation: 根据本公开的实施例，电路板可以包括被配置为将设备电耦合到电路板的连接器。 连接器可以包括被配置为电耦合到第一电压的导电元件和被配置为经由电阻器电耦合到第二电压的检测焊盘，使得当器件的器件引脚电耦合到导电元件时， 检测焊盘通过器件引脚电耦合到导电元件。

公开(公告)号：US20160344119A1

公开(公告)日：2016-11-24

申请号：US14714916

申请日：2015-05-18

Applicant: Autoliv ASP, Inc.

Inventor： Boris G. Karasik ,  William M. Leach

IPC: H01R12/70 ,  H05K1/18

CPC classification number: H01R12/7076 ,  H01R12/724 ,  H01R13/719 ,  H05K1/18 ,  H05K3/301 ,  H05K3/306 ,  H05K3/308 ,  H05K2201/10015 ,  H05K2201/10446 ,  H05K2201/10462 ,  H05K2201/105 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10962

Abstract: An assembly provides a dual function for mounting a port connector on a circuit board and also secures a capacitor to the circuit board. The assembly includes the circuit board and a monolithic plastic frame having a flange, a snap structure, a capacitor cradle, and a socket section. The flange has a fastening structure for fastening the frame to the circuit board. The snap structure for a snap-in attachment of the port connector to the frame is arranged near an end edge of the circuit board. The capacitor cradle for holding a cylindrical capacitor is formed adjacent to the snap structure and is elevated from the circuit board by an air gap. The socket section bears socket contacts for receiving capacitor contact leads.

Abstract translation: 组件提供了用于将端口连接器安装在电路板上并且还将电容器固定到电路板的双重功能。 组件包括电路板和具有凸缘，卡扣结构，电容器支架和插座部分的整体式塑料框架。 凸缘具有用于将框架紧固到电路板的紧固结构。 用于端口连接器到框架的卡扣附接的卡扣结构布置在电路板的端部边缘附近。 用于保持圆柱形电容器的电容器支架邻近卡扣结构形成，并且通过气隙从电路板升高。 插座部分用于接收电容器接触引线的插座触点。