公开(公告)号：US20120062260A1

公开(公告)日：2012-03-15

申请号：US13251789

申请日：2011-10-03

Applicant: Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/073 ,  G01R1/067

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US07878385B2

公开(公告)日：2011-02-01

申请号：US11929539

申请日：2007-10-30

Applicant: Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard T. Chen ,  Christopher A. Bang ,  Vacit Arat ,  Michael S. Lockard ,  Uri Frodis ,  Pavel B. Lembrikov ,  Jeffrey A. Thompson

Inventor： Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard T. Chen ,  Christopher A. Bang ,  Vacit Arat ,  Michael S. Lockard ,  Uri Frodis ,  Pavel B. Lembrikov ,  Jeffrey A. Thompson

IPC: B23K31/02

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract translation: 本发明的实施例涉及在临时衬底上形成微探针（即柔性电气或电子接触元件），切割单独的探针阵列，然后将阵列转移到空间变压器或其它永久衬底。 在将探针从其上形成探针的临时基底分离出来之前，本发明的一些实施方案将探针转移到永久性基底上，而其他实施方案相反。 一些实施例，在转移之前去除牺牲材料，而其它实施例在转移后去除牺牲材料。 一些实施例涉及使用一个或多个具有增强的纵横比（即，高度与宽度比）的焊料凸块来将第一和第二电气部件接合在一起，这是由于至少部分地由保持材料的环围绕凸块而得到的。 保留材料可以用作焊接掩模材料。

公开(公告)号：US20100213068A1

公开(公告)日：2010-08-26

申请号：US12706566

申请日：2010-02-16

Applicant: Christopher A. Bang

Inventor： Christopher A. Bang

IPC: C25D1/00

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：US20100176834A1

公开(公告)日：2010-07-15

申请号：US12724287

申请日：2010-03-15

Applicant: Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

Inventor： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R1/067 ,  G01R31/02

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。

公开(公告)号：US20100133109A1

公开(公告)日：2010-06-03

申请号：US12624240

申请日：2009-11-23

Applicant: Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Vacit Arat ,  Christopher A. Bang ,  John C. Dixon

Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Dennis R. Smalley ,  Vacit Arat ,  Christopher A. Bang ,  John C. Dixon

IPC: C25D5/02 ,  C25D5/48 ,  C25D7/00

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20090015903A1

公开(公告)日：2009-01-15

申请号：US12099976

申请日：2008-04-09

Applicant: Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  John D. Evans

Inventor： Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  John D. Evans

IPC: G02B26/00 ,  C25D5/02

CPC classification number: H02N1/008 ,  B33Y10/00 ,  B81C1/0019 ,  C25D1/003

Abstract: Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB®).

Abstract translation: 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB）形成器件。

公开(公告)号：US20080211524A1

公开(公告)日：2008-09-04

申请号：US11928868

申请日：2007-10-30

Applicant: Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

Inventor： Richard T. Chen ,  Ezekiel J.J. Kruglick ,  Christopher A. Bang ,  Vacit Arat ,  Adam L. Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis R. Smalley

IPC: G01R1/073

CPC classification number: A61N1/00 ,  C25D1/00 ,  C25D1/003

Abstract: Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.

Abstract translation: 用于测试半导体管芯的多层探针结构通过多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括大致螺旋形构造，当探针从衬底向外延伸，波纹管状构造等时具有窄半径的螺旋形构造。 在一些实施例中，提供了多个探针的阵列。

公开(公告)号：US07185542B2

公开(公告)日：2007-03-06

申请号：US10313795

申请日：2002-12-06

Applicant: Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  John D. Evans

Inventor： Christopher A. Bang ,  Adam L. Cohen ,  Michael S. Lockard ,  John D. Evans

IPC: G01P15/10 ,  G01P15/125

CPC classification number: B81C1/0019 ,  B33Y10/00

Abstract: Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB™)

Abstract translation: 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB TM）形成器件，

公开(公告)号：US06431003B1

公开(公告)日：2002-08-13

申请号：US09656202

申请日：2000-09-06

Applicant: Kevin C. Stark ,  Christopher A. Bang

Inventor： Kevin C. Stark ,  Christopher A. Bang

IPC: G01L912

CPC classification number: G01L9/0073 ,  G01L13/026

Abstract: A pressure sensor for measuring the differential pressure of a first and a second fluid. The sensor includes a housing having an internal opening, a first diaphragm disposed in the opening and exposed to the first fluid, and a second diaphragm disposed in the opening and exposed to the second fluid. The first diaphragm and the second diaphragm are each made of a conductive material and coupled together such that the differential pressure of the first and second fluids deflects the first and second diaphragms in the same direction. The deflection of the first and second diaphragms can be sensed to determine the differential pressure.

Abstract translation: 一种用于测量第一和第二流体的压差的压力传感器。 传感器包括具有内部开口的壳体，设置在开口中并暴露于第一流体的第一隔膜，以及设置在开口中并暴露于第二流体的第二隔膜。 第一膜片和第二膜片各自由导电材料制成并且联接在一起，使得第一和第二流体的压差使第一和第二膜片沿相同方向偏转。 可以检测第一和第二隔膜的偏转以确定差压。

公开(公告)号：US08729916B2

公开(公告)日：2014-05-20

申请号：US13273897

申请日：2011-10-14

Applicant: Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

Inventor： Richard T. Chen ,  Ezekiel J. J. Kruglick ,  Christopher A. Bang ,  Dennis R. Smalley ,  Pavel B. Lembrikov

IPC: G01R31/00

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. Some embodiments are directed to various designs of cantilever-like probe structures while other embodiments are directed to methods for fabricating probe structures. In some embodiments, methods are used to form probe structures from a plurality of planar multi-material layers wherein each probe structure includes a contact tip and a compliant body wherein a portion of the complaint body is formed, then the contact tip is formed and then finally the rest of the compliant body is formed, wherein the compliant body provides for elastic compression of the probe in a plane of primary motion during use and wherein during formation of the layers a stacking direction of the plurality of layers is perpendicular to the plane of primary motion.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 一些实施例涉及悬臂式探针结构的各种设计，而其他实施例涉及用于制造探针结构的方法。 在一些实施例中，使用方法来从多个平面多材料层形成探针结构，其中每个探针结构包括接触尖端和柔顺体，其中形成了部分投诉体，然后形成接触尖端，然后形成 最后形成柔性体的其余部分，其中顺应性主体在使用期间在主运动平面中提供探针的弹性压缩，并且其中在层的形成期间，多个层的堆叠方向垂直于 主要运动。