公开(公告)号：US20080208342A1

公开(公告)日：2008-08-28

申请号：US11763619

申请日：2007-06-15

Applicant: David A. Hanson ,  Christopher J. Valois

Inventor： David A. Hanson ,  Christopher J. Valois

IPC: A61F2/44

CPC classification number: A61F2/447 ,  A61F2/28 ,  A61F2002/30266 ,  A61F2002/3082 ,  A61F2002/30892 ,  A61F2002/4475 ,  A61F2230/0082 ,  A61F2310/00359

Abstract: An implant is provided that includes a body having a convex and tapered leading end, a convex trailing end, opposing generally planar sides extending between the leading and trailing ends and superior and inferior surfaces. An opening extends through the body between the superior and inferior surfaces. The implant further includes a plurality of protrusions provided on each of the superior and inferior surfaces. Each protrusion has a flattened distal surface. The leading end includes first and second inclined surfaces and an intermediate surface, with the first inclined surface sloping downward from the superior surface to the intermediate surface and the second inclined surface sloping upward from the inferior surface to the intermediate surface.

Abstract translation: 提供一种植入物，其包括具有凸形和锥形前端的主体，凸起的后端，在前端和后端以及上表面和下表面之间延伸的相对的大致平面的侧面。 开口在上表面和下表面之间穿过主体。 植入物还包括设置在上表面和下表面中的每一个上的多个突起。 每个突起具有扁平的远端表面。 前端包括第一和第二倾斜表面和中间表面，第一倾斜表面从上表面向中间表面向下倾斜，第二倾斜表面从下表面向中间表面向上倾斜。

公开(公告)号：US06847527B2

公开(公告)日：2005-01-25

申请号：US10199926

申请日：2002-07-19

Applicant: Mark F. Sylvester ,  David A. Hanson ,  William G. Petefish

Inventor： Mark F. Sylvester ,  David A. Hanson ,  William G. Petefish

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H01L23/64 ,  H01L23/66 ,  H05K1/11 ,  H05K1/14 ,  H05K1/16 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46 ,  H05K7/06 ,  H05K1/03

CPC classification number: H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L23/642 ,  H01L23/66 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/113 ,  H05K1/141 ,  H05K1/162 ,  H05K3/0035 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/049 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09672 ,  H05K2201/09718 ,  H05K2201/10734 ,  H05K2203/1383 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/81205

Abstract: An interconnect module for an integrated circuit chip incorporates a thin, high dielectric constant embedded capacitor structure to provide reduced power distribution impedance, and thereby promote higher frequency operation. The interconnect module is capable of reliably attaching an integrated circuit chip to a printed wiring board via solder ball connections, while providing reduced power distribution impedance of less than or equal to approximately 0.60 ohms at operating frequencies in excess of 1.0 gigahertz.

Abstract translation: 用于集成电路芯片的互连模块结合了薄的高介电常数嵌入式电容器结构，以提供降低的功率分布阻抗，从而促进更高频率的操作。 互连模块能够通过焊球连接将集成电路芯片可靠地附接到印刷线路板，同时在超过1.0千兆赫的工作频率下提供小于或等于约0.60欧姆的降低的功率分布阻抗。

公开(公告)号：US06641582B1

公开(公告)日：2003-11-04

申请号：US09611237

申请日：2000-07-06

Applicant: David A. Hanson ,  Ross A. Longhini ,  Steven J. Seme

Inventor： David A. Hanson ,  Ross A. Longhini ,  Steven J. Seme

IPC: A61B1756

CPC classification number: A61F2/4465 ,  A61B17/1604 ,  A61B17/1659 ,  A61B17/1671 ,  A61B17/1735 ,  A61B17/1757 ,  A61B2017/0256 ,  A61F2/442 ,  A61F2/4611 ,  A61F2002/30131 ,  A61F2002/30383 ,  A61F2002/30599 ,  A61F2002/30747 ,  A61F2002/3082 ,  A61F2002/30879 ,  A61F2002/30892 ,  A61F2002/30904 ,  A61F2002/4475 ,  A61F2002/4624 ,  A61F2220/0025 ,  A61F2230/0013 ,  A61F2250/0063

Abstract: Instruments and methods for preparing adjacent bones for fusion are disclosed. In a typical embodiment, the instruments include paddles for spacing the adjacent bones a predetermined distance and a cutting edge to create a channel between the adjacent bones to receive a fusion implant. The instruments and methods are particularly advantageous for preparing a spinal fusion implant site.

Abstract translation: 公开了用于制备用于融合的相邻骨骼的仪器和方法。 在典型的实施例中，仪器包括用于将相邻骨头间隔预定距离的桨叶和切割边缘以在相邻骨骼之间形成通道以接收融合植入物。 仪器和方法对于准备脊柱融合植入部位是特别有利的。

公开(公告)号：US06184589B2

公开(公告)日：2001-02-06

申请号：US09195052

申请日：1998-11-18

Applicant: John J. Budnaitis ,  Paul J. Fischer ,  David A. Hanson ,  David B. Noddin ,  Mark F. Sylvester ,  William George Petefish

Inventor： John J. Budnaitis ,  Paul J. Fischer ,  David A. Hanson ,  David B. Noddin ,  Mark F. Sylvester ,  William George Petefish

IPC: H01L2302

CPC classification number: H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5383 ,  H01L23/5386 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  Y10T428/24917 ,  Y10T428/24942 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A constraining ring increases the modulus of an interconnect substrate to maintain flatness of the substrate. The constraining ring is made of materials selected to match the coefficient of thermal expansion of the substrate to that of the constraining ring. Circuit components including capacitors and resistors are formed on the constraining ring to provide enhanced electrical properties without adding to the size of the device.

Abstract translation: 约束环增加互连衬底的模量以保持衬底的平坦度。 约束环由选择的材料制成，以使衬底的热膨胀系数与约束环的热膨胀系数相匹配。 在约束环上形成包括电容器和电阻器的电路部件，以提供增强的电气性能，而不增加装置的尺寸。

公开(公告)号：US5863446A

公开(公告)日：1999-01-26

申请号：US752493

申请日：1996-11-08

Applicant: David A. Hanson

Inventor： David A. Hanson

IPC: H01L21/66 ,  H05K1/02 ,  H05K1/16 ,  H05K3/46 ,  B44C1/22

CPC classification number: H05K3/4638 ,  H01L22/12 ,  H01L2924/0002 ,  H05K1/0268 ,  H05K1/167 ,  H05K2201/09781

Abstract: A method for determining a fiducial misregistration of conductive layers of a laminated substrate by providing a plurality of alternatingly disposed dielectric layers and conductive layers. A predetermined area of resistive material is formed as part of at least one conductive layer. Each predetermined area of resistive material is formed at a same corresponding location in each respective conductive layer, and each predetermined area of resistive material has a first end and a second end. A through-via is formed and connected to each predetermined area of resistive material between the first and second ends of each respective predetermined area. A total resistance is determined between the first end and the second end of each predetermined area of resistive material. A first fractional resistance is determined between the first end of each predetermined area of resistive material and the through-via. A second fractional resistance is determined between the second end of each predetermined area of resistive material and the through-via. A fiducial misregistration of each conductive layer with respect to a location of the through-via is determined based on the respective first and second fractional resistances and the respective total resistance for each predetermined area of resistive material.

Abstract translation: 一种通过提供多个交替布置的电介质层和导电层来确定层压衬底的导电层的基准重合不良的方法。 电阻材料的预定区域被形成为至少一个导电层的一部分。 电阻材料的每个预定区域形成在每个相应导电层中的相同对应位置处，并且电阻材料的每个预定区域具有第一端和第二端。 在每个相应的预定区域的第一端和第二端之间形成通孔并连接到电阻材料的每个预定区域。 在电阻材料的每个预定区域的第一端和第二端之间确定总电阻。 在电阻材料的每个预定区域的第一端和通孔之间确定第一分数电阻。 在电阻材料的每个预定区域的第二端和通孔之间确定第二分数电阻。 基于每个电阻材料的每个预定面积的相应的第一和第二分数电阻和相应的总电阻来确定每个导电层相对于贯通孔的位置的基准重合。

公开(公告)号：US5841075A

公开(公告)日：1998-11-24

申请号：US14885

申请日：1998-01-28

Applicant: David A. Hanson

Inventor： David A. Hanson

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/66 ,  H05K1/11 ,  H05K1/00

CPC classification number: H01L23/5386 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5384 ,  H01L23/66 ,  H05K1/115 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/0792 ,  H05K2201/09509 ,  H05K2201/09627 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A method of making a low inductance conductive via in a laminated substrate by providing a first conductive layer. A first dielectric layer is formed on the first conductive layer. A second conductive layer is formed on the first dielectric layer. A first conductive path is formed in the first conductive layer extending along a first route between a first node and a second node. A first conductive blind-via is connected to the first conductive path at the second node, with the first-blind via being formed in the first dielectric layer at the second node. Lastly, a second conductive path is formed in the second conductive layer that is connected to the first blind via. The second conductive path extends between a third node and the first blind via along a second route. The second route corresponds identically to at least a portion of the first route.

公开(公告)号：US20140032578A1

公开(公告)日：2014-01-30

申请号：US13560810

申请日：2012-07-27

Applicant: David A. Hanson ,  Xin P. Lang ,  Wayne A. Malkin ,  Lauren A. Mayes ,  Evgeny Rozhdestvensky

Inventor： David A. Hanson ,  Xin P. Lang ,  Wayne A. Malkin ,  Lauren A. Mayes ,  Evgeny Rozhdestvensky

IPC: G06F17/30

CPC classification number: G06F16/21 ,  G06F16/2365

Abstract: A dynamic integration framework allows property data to be dynamically influenced by external data sources. In one example, a client services component receives, from a client application, a request to create or edit an object. The client services component retrieves, from a content repository, an initial property set applicable to the object. An external data service specifies an initial property modification set based on property dependencies between controlling property values and dependent properties. The external data service provides the property modifications to the client services component with an initial data identifier that indicates a state of the property modifications. The client services component merges the initial property modifications and the initial data identifier with the initial property set.

Abstract translation: 动态集成框架允许属性数据受外部数据源的动态影响。 在一个示例中，客户机服务组件从客户端应用程序接收创建或编辑对象的请求。 客户端服务组件从内容存储库检索适用于对象的初始属性集。 外部数据服务根据控制属性值和依赖属性之间的属性依赖关系指定初始属性修改集。 外部数据服务使用指示属性修改状态的初始数据标识符向客户端服务组件提供属性修改。 客户端服务组件将初始属性修改和初始数据标识符与初始属性集合合并。

公开(公告)号：USD611147S1

公开(公告)日：2010-03-02

申请号：US29277466

申请日：2007-02-27

Applicant: David A. Hanson ,  Christopher J. Valois

Designer： David A. Hanson ,  Christopher J. Valois

公开(公告)号：USD580552S1

公开(公告)日：2008-11-11

申请号：US29277221

申请日：2007-02-19

Applicant: Robert C. Cohen ,  Christopher J. Valois ,  David A. Hanson

Designer： Robert C. Cohen ,  Christopher J. Valois ,  David A. Hanson

公开(公告)号：US07125424B2

公开(公告)日：2006-10-24

申请号：US10261082

申请日：2002-09-27

Applicant: Christopher M. Banick ,  Jack A. Dant ,  David A. Hanson ,  Rodney L. Houfburg

Inventor： Christopher M. Banick ,  Jack A. Dant ,  David A. Hanson ,  Rodney L. Houfburg

IPC: A61F2/44

CPC classification number: A61F2/4455 ,  A61B90/90 ,  A61B2050/314 ,  A61F2/0095 ,  A61F2/3094 ,  A61F2/442 ,  A61F2/4611 ,  A61F2002/2825 ,  A61F2002/2839 ,  A61F2002/30131 ,  A61F2002/30153 ,  A61F2002/30168 ,  A61F2002/30324 ,  A61F2002/30561 ,  A61F2002/3071 ,  A61F2002/30785 ,  A61F2002/3082 ,  A61F2002/30828 ,  A61F2002/30879 ,  A61F2002/30892 ,  A61F2002/30925 ,  A61F2002/3097 ,  A61F2002/30975 ,  A61F2002/448 ,  A61F2002/4627 ,  A61F2002/4649 ,  A61F2230/0013 ,  A61F2230/0019 ,  A61F2230/0043 ,  A61F2250/0036 ,  A61F2250/0085

Abstract: A spinal implant is described in this disclosure. The implant includes first and second pieces separated by a controlled break location. Spinal implant kits having multiple spinal implant pieces derived from a common source also are disclosed.