公开(公告)号：US20070045387A1

公开(公告)日：2007-03-01

申请号：US11495214

申请日：2006-07-28

Applicant: Francois Marion

Inventor： Francois Marion

IPC: B23K31/02

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/381 ,  H05K2201/094 ,  H05K2201/097 ,  H05K2203/0465 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00014

Abstract: The hybridisation method involves: providing a first component 1 with first pads 3 for accommodating protrusions, providing a second component 2 with second pads 5 for accommodating protrusions, the first pads 3 and second pads 5 respectively being intended to line up two by two in order to form pairs of pads, then providing the first pads and/or second pads with protrusions 4 made of a fusible material, then placing the first and second components one on top of the other, then bringing the assembly consisting of the first and second components and consequently the solder protrusions to a soldering temperature in order to interconnect the first and second pads of each pair of pads by soldering the protrusions to these pads, and finally, cooling down the soldered joint thus obtained. Some of the protrusions 4 of fusible material fitted on the first and/or second pads 3 and 5 respectively consist of at least three larger-sized protrusions 6, especially taller protrusions, so that before the temperature is increased to the hybridisation temperature, the component only rests on the larger protrusions.

Abstract translation: 杂交方法包括：向第一部件1提供用于容纳突起的第一焊盘3，为第二部件2提供用于容纳突起的第二焊盘5，第一焊盘3和第二焊盘5分别按顺序逐排排列 以形成一对焊盘，然后将第一焊盘和/或第二焊盘提供有由可熔材料制成的突起4，然后将第一和第二部件放置在另一个之上，然后将由第一和第二部件组成的组件 并且因此焊料突出到焊接温度，以便通过将突起焊接到这些焊盘上来互连每对焊盘的第一和第二焊盘，最后冷却由此获得的焊接接头。 安装在第一和/或第二垫3和5上的可熔材料的一些突起4分别由至少三个更大尺寸的突起6，特别是较高的突起组成，使得在温度升高到杂交温度之前， 只能靠在较大的突起上。

公开(公告)号：US20050213896A1

公开(公告)日：2005-09-29

申请号：US11133884

申请日：2005-05-19

Applicant: Francois Marion ,  Cecile Bory

Inventor： Francois Marion ,  Cecile Bory

IPC: G02B7/00 ,  F16M11/04 ,  F16M11/08 ,  G02B6/42 ,  G02B6/43 ,  G02B6/36

CPC classification number: F16M11/041 ,  F16M11/22 ,  G02B6/4231 ,  G02B6/43

Abstract: A process and a device for the passive alignment of supports, particularly plates which carry optical components. According to the invention, in order to align supports (2, 8), holes (6, 7, 11, 12) are formed in these supports, in correspondence with each other, balls (14, 16) are placed on the holes of one of the supports and these are assembled by placing the holes of the other support onto the balls. The sizes of the holes or of the balls are chosen so as to obtain a pre-set non-zero angle (α) between the assembled supports.

Abstract translation: 用于支撑件的被动对准的工艺和装置，特别是承载光学部件的板。 根据本发明，为了对准支撑件（2,8），在这些支撑件中形成孔（6,7,11,12），彼此对应地，将球（14,16）放置在 一个支撑件，并且通过将另一个支撑件的孔放置在球上来组装。 选择孔或球的尺寸以便在组装的支撑件之间获得预定的非零角度（α）。

公开(公告)号：US06639928B2

公开(公告)日：2003-10-28

申请号：US10124324

申请日：2002-04-18

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H01S500

CPC classification number: H01S5/423 ,  H01S5/18358 ,  H01S5/18388 ,  H01S5/4087

Abstract: The device comprises several resonant cavities of different lengths, in order to emit over several different wavelengths, depending on the length of the corresponding cavity. Each resonant cavity comprises a convex cap, preferably hemispherical, of transparent material for the emitted wavelengths. The convex cap defines, at one end of the cavity, an excessive thickness, of length li, which enables to vary the length of the corresponding cavity. The caps are, preferably, obtained by remelting cakes of preset dimensions, for example of selenium, on the material forming the cavities.

公开(公告)号：US5602385A

公开(公告)日：1997-02-11

申请号：US341072

申请日：1994-11-17

Applicant: Lydie Mathieu ,  Francois Marion ,  Christian Lucas

Inventor： Lydie Mathieu ,  Francois Marion ,  Christian Lucas

IPC: G01J1/02 ,  G01J5/02 ,  G01J5/28 ,  G01J5/60 ,  H01L27/146 ,  G01J3/50

CPC classification number: H01L27/1465

Abstract: A radiation detector which senses two wave bands and a process for making this detector. A first substrate includes a first photodetection element sensitive to a first wave band. A second substrate contains a second photodetection element which is sensitive to a second wave band. The second substrate is transparent to at least the first wave band. The two photodetection elements are positioned facing each other. The substrates are interconnected by conductive spheres.

Abstract translation: 感测两个波段的辐射检测器和用于制造该检测器的过程。 第一基板包括对第一波段敏感的第一光电检测元件。 第二基板包含对第二波段敏感的第二光电检测元件。 第二衬底对于至少第一波段是透明的。 两个光电检测元件被定位成彼此面对。 基板通过导电球相互连接。

公开(公告)号：US5119240A

公开(公告)日：1992-06-02

申请号：US564732

申请日：1990-08-08

Applicant: Francois Marion ,  Michel Ravetto ,  Jean-Luc Tissot

Inventor： Francois Marion ,  Michel Ravetto ,  Jean-Luc Tissot

IPC: F16B5/08 ,  B23P21/00 ,  F16B11/00 ,  G02B7/00 ,  G02B7/182 ,  H01L21/60 ,  H05K3/34

CPC classification number: H01L24/81 ,  G02B7/00 ,  G02B7/182 ,  H05K3/3436 ,  H01L2224/81801 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K2201/094 ,  H05K2201/10484 ,  H05K2203/0465 ,  H05K3/3484 ,  Y02P70/613 ,  Y10T403/479

Abstract: An assembly of parts forming an angle between facing surfaces of the parts and a process for producing an assembly is described. The parts (2, 4) are provided with contact elements or pads (6, 8, 10, 12) for connection to one another by means of a relatively low melting point metallic soldering material. The surface of each of the pads is wettable by the low melting point metallic material in the molten state, while areas surrounding the pads are not wettable. The contact pads of one of the parts are covered with flat coils or wafers (10, 12) of the low melting point metallic material. The wafers have the same thickness, but different volumes. The contact pads of the other part are placed on the corresponding wafers. The wafers' thickness, volumes, and spacing are chosen so that when the wafers are heated to the molten state and form truncated spherical drops due to surface tension, the parts form between them a predetermined angle. The invention has particular application to the manufacture of mirrors.

Abstract translation: 描述了在部件的相对表面之间形成角度的部件的组件和用于制造组件的工艺。 部分（2,4）设置有用于通过相对低熔点的金属焊接材料彼此连接的接触元件或焊盘（6,8,10,12）。 每个焊盘的表面在熔融状态下被低熔点金属材料润湿，而焊盘周围的区域不能被润湿。 其中一个部分的接触垫被低熔点金属材料的扁平线圈或晶片（10,12）覆盖。 晶片具有相同的厚度，但是具有不同的体积。 另一部分的接触垫放置在相应的晶片上。 选择晶片的厚度，体积和间距，使得当晶片被加热到熔融状态并由于表面张力而形成截头球形液滴时，它们之间形成预定角度。 本发明特别适用于制造镜子。

公开(公告)号：US08898896B2

公开(公告)日：2014-12-02

申请号：US12866687

申请日：2009-02-19

Applicant: Francois Marion ,  Damien Saint-Patrice

Inventor： Francois Marion ,  Damien Saint-Patrice

IPC: H01K3/10 ,  H01L23/00 ,  H05K3/34

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/09472 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.

Abstract translation: 本发明涉及一种用于制造连接部件的方法，该连接部件包括与另一部件电连接的一组导电插入件，所述插入件是中空的。

公开(公告)号：US08735819B2

公开(公告)日：2014-05-27

申请号：US12603143

申请日：2009-10-21

Applicant: Manuel Fendler ,  Gilles Lasfargues ,  Francois Marion

Inventor： Manuel Fendler ,  Gilles Lasfargues ,  Francois Marion

IPC: G01J5/00 ,  G01J5/02 ,  G02B6/42

CPC classification number: G01J5/0205 ,  G01J5/02 ,  G01J5/023 ,  G01J5/0275 ,  G01J5/04 ,  G01J5/045 ,  G02B6/4228 ,  G02B6/4231 ,  H01L31/0203 ,  H01L31/18 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention relates to a system and method for positioning and passively aligning at least one optical component as close as possible to an electromagnetic radiation detector. This system comprises supporting wedges (37) for Z positioning of the optical component (35) as close as possible to the detector (21) and passive X and Y alignment means via holding wedges and/or holding balls (36), the X, Y and Z axes being axes perpendicular to each other.

Abstract translation: 本发明涉及一种用于将至少一个光学部件定位和被动地对准到尽可能靠近电磁辐射探测器的系统和方法。 该系统包括用于通过保持楔形件和/或保持球（36）将光学部件（35）的Z定位靠近检测器（21）和无源X和Y对准装置的支撑楔（37） Y轴和Z轴是彼此垂直的轴。

公开(公告)号：US20110300487A1

公开(公告)日：2011-12-08

申请号：US13212502

申请日：2011-08-18

Applicant: Francois Marion ,  Olivier Gravrand

Inventor： Francois Marion ,  Olivier Gravrand

IPC: G03F7/20

CPC classification number: H01L24/95 ,  H01L21/6835 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/25 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0753 ,  H01L25/50 ,  H01L33/62 ,  H01L2224/13099 ,  H01L2224/1319 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01093 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a method for producing a matrix of electronic components, comprising a step of producing an active layer on a substrate, and a step of individualizing the components by forming trenches in the active layer at least until the substrate emerges. The method comprises steps of depositing a layer of functional material on the active layer, depositing a photosensitive resin on the layer of material in such a way as to fill said trenches and to form a thin film on the upper face of the components, at least partially exposing the resin to radiation while underexposing the portion of resin in the trenches, developing the resin in such a way as to remove the properly exposed portion thereof, removing the functional material layer portion that shows through after the development step, and removing the remaining portion of resin.

Abstract translation: 本发明涉及一种用于制造电子元件基质的方法，包括在基底上制备活性层的步骤，以及通过在活性层中形成沟槽至少直至基底露出来使组分个体化的步骤。 该方法包括以下步骤：在有源层上沉积一层功能材料，将光敏树脂沉积在材料层上，以便填充所述沟槽并在组件的上表面上形成薄膜，至少 将树脂部分地暴露于辐射，同时使沟槽中树脂的部分露出，同时将树脂显影以除去适当暴露的部分，除去显影步骤后通过的功能材料层部分，并除去剩余的 部分树脂。

公开(公告)号：US20110094789A1

公开(公告)日：2011-04-28

申请号：US12866687

申请日：2009-02-19

Applicant: Francois Marion ,  Damien Saint-Patrice

Inventor： Francois Marion ,  Damien Saint-Patrice

IPC: H05K1/11 ,  H01L21/60 ,  H01L21/50

CPC classification number: H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/114 ,  H01L2224/1147 ,  H01L2224/116 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H05K3/3436 ,  H05K2201/09472 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: The invention relates to a method for making a connection component that comprises a set of conducting inserts to be electrically connected with another component, said inserts being hollow.

Abstract translation: 本发明涉及一种用于制造连接部件的方法，该连接部件包括与另一部件电连接的一组导电插入件，所述插入件是中空的。

公开(公告)号：US07569940B2

公开(公告)日：2009-08-04

申请号：US10577142

申请日：2004-10-28

Applicant: Francois Marion

Inventor： Francois Marion

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L24/92 ,  H01L23/3185 ,  H01L24/48 ,  H01L24/81 ,  H01L24/96 ,  H01L25/18 ,  H01L27/148 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The invention relates to an electronic device comprising: a circuit, comprising a first and a second face, the first face being provided with electrical connection means, a transfer element, comprising a first face and a second face, and being assembled to the second face of the active element through its first face, and comprising electrical connection means on its second face, a connection between the electrical connection means of the active element and the electrical connection means of the transfer element.

Abstract translation: 本发明涉及一种电子设备，包括：电路，包括第一和第二面，所述第一面设置有电连接装置，传输元件，包括第一面和第二面，并被组装到所述第二面 的有源元件的第一面，并且在其第二面上包括电连接装置，有源元件的电连接装置与传输元件的电连接装置之间的连接。