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公开(公告)号：US20140320231A1
公开(公告)日：2014-10-30
申请号：US13872718
申请日：2013-04-29
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner
CPC classification number: H01P5/08 , H01L21/56 , H01L21/568 , H01L23/3128 , H01L23/66 , H01L24/19 , H01L24/25 , H01L2223/6633 , H01L2223/6677 , H01L2224/12105 , H01L2224/13 , H01L2224/21 , H01L2224/221 , H01L2224/24195 , H01L2224/2518 , H01L2924/1421 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01P1/16 , H01P3/121 , H01P5/107 , H01L2924/00
Abstract: An integrated-circuit module includes a package molding compound layer, a radio-frequency (RF) integrated circuit embedded within the package molding compound layer and having an RF port, a waveguide transition structure embedded within the package molding compound layer, and a redistribution layer. The waveguide transition structure includes a transmission line interface section, a waveguide interface section configured for coupling to a rectangular waveguide housing, and a transformer section configured to provide a mode transition between the transmission line interface section and the waveguide interface section. The redistribution layer includes at least one insulating layer and at least one metallization layer, extending between the RF integrated circuit and the waveguide transition structure across a surface of the package molding compound layer. The first redistribution layer includes an RF transmission line conductively connected between the RF port of the RF integrated circuit and the transmission line interface section of the waveguide transition structure.
Abstract translation: 集成电路模块包括封装模塑复合层，嵌入在封装模塑复合层内的射频（RF）集成电路，并具有RF端口，嵌入封装模塑复合层内的波导过渡结构以及再分配层 。 波导过渡结构包括传输线接口部分，被配置为耦合到矩形波导壳体的波导接口部分和被配置为在传输线接口部分和波导接口部分之间提供模式转换的变压器部分。 再分配层包括至少一个绝缘层和至少一个金属化层，其跨过封装模塑复合层的表面在RF集成电路和波导过渡结构之间延伸。 第一再分配层包括导电连接在RF集成电路的RF端口和波导过渡结构的传输线接口部分之间的RF传输线。
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12.发明申请EMBEDDED CHIP PACKAGES AND METHODS FOR MANUFACTURING AN EMBEDDED CHIP PACKAGE 有权嵌入式芯片封装和制造嵌入式芯片封装的方法公开(公告)号：US20140110858A1
公开(公告)日：2014-04-24
申请号：US13736097
申请日：2013-01-08
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Gottfried Beer , Walter Hartner
IPC: H01L23/00 , H01L21/78 , H01L23/522
CPC classification number: H01L24/82 , H01L21/568 , H01L21/78 , H01L23/3128 , H01L23/49816 , H01L23/5226 , H01L23/5384 , H01L23/5389 , H01L23/66 , H01L24/16 , H01L24/19 , H01L24/24 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/105 , H01L25/16 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/04105 , H01L2224/05599 , H01L2224/12105 , H01L2224/16225 , H01L2224/24195 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/451 , H01L2224/48227 , H01L2224/73267 , H01L2224/97 , H01L2225/06551 , H01L2225/06562 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/12042 , H01L2924/1301 , H01L2924/1423 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/207 , H01Q1/2283 , H01Q23/00 , H01L2224/82 , H01L2924/00 , H01L2224/45099
Abstract: A method for manufacturing an embedded chip package is provided. The method may include: forming electrically conductive lines over a substrate; placing the substrate next to a chip arrangement comprising a chip, the chip comprising one or more contact pads, wherein one or more of the electrically conductive lines are arranged proximate to a side wall of the chip; and forming one or more electrical interconnects over the chip arrangement to electrically connect at least one electrically conductive line to at least one contact pad.
Abstract translation: 提供一种用于制造嵌入式芯片封装的方法。 该方法可以包括：在衬底上形成导电线; 将衬底放置在包括芯片的芯片装置旁边，该芯片包括一个或多个接触焊盘，其中一个或多个导电线被布置成靠近芯片的侧壁; 以及在所述芯片布置上形成一个或多个电互连以将至少一个导电线电连接到至少一个接触垫。
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13.发明申请公开(公告)号：US20140110840A1
公开(公告)日：2014-04-24
申请号：US13736553
申请日：2013-01-08
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Maciej Wojnowski , Walter Hartner , Ottmar Geitner , Gottfried Beer , Klaus Pressel , Mehran Pour Mousavi
IPC: H01L23/498 , H01L21/768
CPC classification number: H01L23/49816 , H01L21/568 , H01L21/76802 , H01L21/76885 , H01L23/3128 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2223/6677 , H01L2224/12105 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/17519 , H01L2224/211 , H01L2224/215 , H01L2224/82101 , H01L2224/96 , H01L2924/0002 , H01L2924/12042 , H01L2924/1301 , H01L2924/181 , H01Q1/2283 , H01Q9/0407 , H01Q9/16 , H01Q23/00 , H01L2224/19 , H01L2924/014 , H01L2924/01022 , H01L2924/01074 , H01L2924/04941 , H01L2924/04953 , H01L2924/01029 , H01L2924/01055 , H01L2924/01064 , H01L2924/01044 , H01L2924/01042 , H01L2924/01015 , H01L2924/0105 , H01L2924/00012 , H01L2924/00
Abstract: In one embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A chip is disposed in the substrate. The chip includes a plurality of contact pads at the first major surface. A first antenna structure is disposed at the first major surface. A reflector is disposed at the second major surface.
Abstract translation: 在本发明的一个实施例中，半导体封装包括具有第一主表面和相对的第二主表面的衬底。 芯片设置在基板中。 芯片包括在第一主表面处的多个接触垫。 第一天线结构设置在第一主表面处。 反射器设置在第二主表面处。
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公开(公告)号：US12107026B2
公开(公告)日：2024-10-01
申请号：US17542905
申请日：2021-12-06
Applicant: Infineon Technologies AG
Inventor： Raphael Hellwig , Philip Amos , Walter Hartner
IPC: H01L23/34 , H01L23/498 , H01L23/552
CPC classification number: H01L23/34 , H01L23/49816 , H01L23/49822 , H01L23/552
Abstract: A circuit arrangement has a chip arrangement in the form of an embedded Wafer Level Ball Grid Array (eWLB) arrangement with solder contacts on one side and a thermal interface on a side of the chip arrangement facing away from the solder contacts which is designed to dissipate heat from the semiconductor chip. In examples, the thermal interface has a thermally and electrically conductive material, wherein in a top view of the chip arrangement, a contact area in which the thermally and electrically conductive material is in thermal contact with the chip arrangement is limited to the fan-out area. In examples, the thermal interface has at least one RF absorption layer which is designed to absorb electromagnetic radiation at an operating frequency of the semiconductor chip.
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公开(公告)号：US11824019B2
公开(公告)日：2023-11-21
申请号：US17356831
申请日：2021-06-24
Applicant: Infineon Technologies AG
Inventor： Tuncay Erdoel , Walter Hartner , Ulrich Moeller , Bernhard Rieder , Ernst Seler , Maciej Wojnowski
CPC classification number: H01L23/66 , H01L23/3114 , H01L23/49816 , H01L23/49822 , H01P3/121 , H01Q1/2283 , G01S13/02 , H01L2223/6627 , H01L2223/6677 , H01L2223/6683
Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.
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Patent Agency Ranking
公开(公告)号：US11791529B2
公开(公告)日：2023-10-17
申请号：US17444864
申请日：2021-08-11
Applicant: Infineon Technologies AG
Inventor： Walter Hartner , Bernhard Rieder
CPC classification number: H01P3/121 , H01Q1/50 , H05K1/028 , H05K1/0243 , H05K2201/10098
Abstract: A radio-frequency device comprises a printed circuit board and a radio-frequency package, which is mounted on the printed circuit board at a first mounting point and has a radio-frequency chip and a radio-frequency radiation element, wherein the printed circuit board has a first elasticity at least in a first section comprising the first mounting point. The radio-frequency device further comprises a waveguide component, which is mounted on the printed circuit board at a second mounting point and has a waveguide, wherein the radio-frequency radiation element is configured to radiate signals into the waveguide and/or to receive signals by way of the waveguide. The printed circuit board has a second elasticity at least in a second section with an increased elasticity between the first mounting point and the second mounting point, wherein the second elasticity is higher than the first elasticity.
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公开(公告)号：US11251146B2
公开(公告)日：2022-02-15
申请号：US16841298
申请日：2020-04-06
Applicant: Infineon Technologies AG
Inventor： Walter Hartner , Francesca Arcioni , Birgit Hebler , Martin Richard Niessner , Claus Waechter , Maciej Wojnowski
IPC: H01L21/00 , H01L23/00 , H01L23/522
Abstract: A semiconductor device comprises a semiconductor chip having a radio-frequency circuit and a radio-frequency terminal, an external radio-frequency terminal, and a non-galvanic connection arranged between the radio-frequency terminal of the semiconductor chip and the external radio-frequency terminal, wherein the non-galvanic connection is designed to transmit a radio-frequency signal.
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公开(公告)号：US20210359387A1
公开(公告)日：2021-11-18
申请号：US17302468
申请日：2021-05-04
Applicant: Infineon Technologies AG
Inventor： Walter Hartner , Bernhard Rieder
Abstract: A radio-frequency device comprises an encapsulation material and a radio-frequency chip embedded into the encapsulation material, wherein the radio-frequency chip has a first main surface and a second main surface. The radio-frequency device furthermore comprises an electrical redistribution layer arranged over the first main surface of the radio-frequency chip and the encapsulation material, and a radio-frequency antenna formed in the redistribution layer and configured to emit signals in a direction pointing from the second main surface to the first main surface and/or to receive signals in a direction pointing from the first main surface to the second main surface. The radio-frequency device furthermore comprises a microwave component having an electrically conductive wall structure, the microwave component being arranged below the radio-frequency antenna and embedded into the encapsulation material.
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公开(公告)号：US20180180730A1
公开(公告)日：2018-06-28
申请号：US15901108
申请日：2018-02-21
Applicant: Infineon Technologies AG
Inventor： Josef Boeck , Rudolf Lachner , Maciej Wojnowski , Walter Hartner
CPC classification number: G01S13/86 , G01S7/006 , G01S7/02 , G01S7/032 , G01S13/003 , G01S13/878 , G01S13/931 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H04B1/40
Abstract: A semiconductor package having an antenna; and a semiconductor die which is coupled to the antenna and comprises a transmitter configured to transmit wirelessly via the antenna a wireless signal having information on a local oscillator signal to a further semiconductor package comprising a further semiconductor die.
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20.发明授权Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound 有权在塑料波导和半导体芯片之间的转变，其中半导体芯片被嵌入并封装在模具化合物内公开(公告)号：US09583811B2
公开(公告)日：2017-02-28
申请号：US14453746
申请日：2014-08-07
Applicant: Infineon Technologies AG
Inventor： Ernst Seler , Maciej Wojnowski , Walter Hartner , Josef Boeck
CPC classification number: H01P5/107 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01L2924/18162 , H01P1/042 , H01P11/002 , H01P11/003 , H04B5/00
Abstract: A microwave device includes a semiconductor package comprising a microwave semiconductor chip and a waveguide part associated with the semiconductor package. The waveguide part is configured to transfer a microwave waveguide signal. It includes one or more pieces. The microwave device further includes a transformer element configured to transform a microwave signal from the microwave semiconductor chip into the microwave waveguide signal or to transform the microwave waveguide signal into a microwave signal for the microwave semiconductor chip.
Abstract translation: 微波器件包括包括微波半导体芯片和与半导体封装件相关联的波导部件的半导体封装。 波导部分被配置为传送微波波导信号。 它包括一个或多个片段。 微波装置还包括变换元件，其被配置为将来自微波半导体芯片的微波信号转换成微波波导信号，或者将微波波导信号转换为用于微波半导体芯片的微波信号。
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