公开(公告)号：US20050046038A1

公开(公告)日：2005-03-03

申请号：US10962931

申请日：2004-10-11

申请人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

发明人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L21/768 ,  H01L21/98 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065 ,  G01R31/02

CPC分类号： H01L21/561 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A semiconductor component includes a base die and a secondary die stacked on and bonded to the base die. The base die includes conductive vias which form an internal signal transmission system for the component, and allow the circuit side of the secondary die to be bonded to the back side of the base die. The component also includes an array of terminal contacts on the circuit side of the base die in electrical communication with the conductive vias. The component can also include an encapsulant on the back side of the base die, which substantially encapsulates the secondary die, and a polymer layer on the circuit side of the base die which functions as a protective layer, a rigidifying member and a stencil for forming the terminal contacts. A method for fabricating the component includes the step of bonding singulated secondary dice to base dice on a base wafer, or bonding a secondary wafer to the base wafer, or bonding singulated secondary dice to singulated base dice.

摘要翻译： 半导体部件包括基模和层叠在基模上的二次模。 基模具包括形成用于部件的内部信号传输系统的导电通孔，并允许二次管芯的电路侧接合到基座的后侧。 该组件还包括与导电通孔电连通的基座芯片的电路侧上的端子触点阵列。 该组件还可以包括在基模的背侧上的密封剂，其基本上封装次模，以及在用作保护层的基模的电路侧上的聚合物层，用于形成的用于固化的模板 终端接触。 一种用于制造该部件的方法包括将单个二次骰子接合到基底晶片上的基底骰子上，或将次晶片接合到基底晶片，或将单个二次骰子接合到单个基体骰子的步骤。

公开(公告)号：US20070170350A1

公开(公告)日：2007-07-26

申请号：US11727545

申请日：2007-03-27

申请人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

发明人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

IPC分类号： H01L27/00

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US20060243889A1

公开(公告)日：2006-11-02

申请号：US11476015

申请日：2006-06-28

申请人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

发明人： Warren Farnworth ,  Sidney Rigg ,  William Hiatt ,  Alan Wood ,  Peter Benson ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Charles Watkins ,  Salman Akram

IPC分类号： H01L27/00

CPC分类号： H01L27/00 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/00014

摘要： Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.

公开(公告)号：US20050230811A1

公开(公告)日：2005-10-20

申请号：US11152438

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly and a contactor card system are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

公开(公告)号：US20050230809A1

公开(公告)日：2005-10-20

申请号：US11151925

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly and a contactor card system are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供了柔性接触销组件和接触器卡系统。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20060270108A1

公开(公告)日：2006-11-30

申请号：US11497699

申请日：2006-08-02

申请人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

发明人： Warren Farnworth ,  Alan Wood ,  William Hiatt ,  James Wark ,  David Hembree ,  Kyle Kirby ,  Pete Benson

IPC分类号： H01L21/00

CPC分类号： H01L21/561 ,  B33Y70/00 ,  B33Y80/00 ,  H01L21/563 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05118 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05178 ,  H01L2224/0518 ,  H01L2224/05181 ,  H01L2224/05184 ,  H01L2224/05559 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06582 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/18161 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2924/207 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for fabricating a semiconductor component includes the steps of providing a substrate having a contact on a circuit side thereof, forming an opening from a backside of the substrate to the contact, forming a conductive via in the opening in electrical contact with a surface of the contact, and forming a second contact on the back side in electrical communication with the conductive via. The method can also include the steps of thinning the substrate from the backside, forming insulating layers on the circuit side and the backside, and forming a conductor and terminal contact on the circuit side in electrical communication with the conductive via. A semiconductor component includes the contact on the circuit side, the conductive via in electrical contact with the contact, and the second contact on the backside in electrical communication with the conductive via. The semiconductor component can also include the insulating layers, the conductor and the terminal contact.

摘要翻译： 一种制造半导体部件的方法包括以下步骤：提供在其电路侧具有接触的基板，从基板的背面形成开口到触点，在开口中形成导电通孔，该导电通孔与 接触，并且在背面形成与导电通孔电连通的第二接触。 该方法还可以包括从背面减薄衬底的步骤，在电路侧和背面形成绝缘层，以及在电路侧上形成与导电通孔电连通的导体和端子触点。 半导体部件包括电路侧的触点，与触点电接触的导电通孔以及与导电通路电气连通的背侧的第二触点。 半导体部件还可以包括绝缘层，导体和端子触头。

公开(公告)号：US20050230810A1

公开(公告)日：2005-10-20

申请号：US11151928

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly and a contactor card are provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供了柔性接触销组件和接触器卡。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20050229393A1

公开(公告)日：2005-10-20

申请号：US11152496

申请日：2005-06-14

申请人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

发明人： Kyle Kirby ,  Warren Farnworth ,  James Wark ,  William Hiatt ,  David Hembree ,  Alan Wood

IPC分类号： G01R1/073 ,  H01L21/66 ,  H01L23/48 ,  H01L23/498 ,  H01L23/58 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/06 ,  H05K7/10

CPC分类号： G01R1/0735 ,  G01R1/07314 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01R12/714 ,  H01R13/24 ,  H01R2201/20 ,  H05K3/326 ,  H05K7/1069 ,  H05K2201/0314 ,  H05K2201/09036 ,  H05K2201/10378 ,  Y10T29/49165 ,  Y10T29/49174 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2224/05599

摘要： A compliant contact pin assembly method for making is provided. A compliant contact pin assembly includes a contact pin formed from a portion of a substrate with the contact pin compliantly held suspended within the substrate by a compliant coupling structure. The suspension within the substrate results in a compliant deflection orthogonal to the plane of the substrate. The contact pin assembly is formed by generally thinning the substrate around the contact pin location and then specifically thinning the substrate immediately around the contact pin location for forming a void. The contact pin is compliantly coupled, in one embodiment by compliant coupling material, and in another embodiment by compliantly flexible portions of the substrate.

摘要翻译： 提供了一种用于制造的柔性接触销组装方法。 柔性接触销组件包括由衬底的一部分形成的接触针，其中触发销通过柔性耦合结构顺应地保持悬挂在衬底内。 衬底内的悬浮液导致与衬底的平面垂直的柔顺偏转。 接触销组件通过使基板围绕接触销位置大体变薄而形成，然后特别地使基板在接触销位置周围特别地变薄以形成空隙。 在一个实施例中，接触销被顺从地联接，在一个实施例中通过柔性耦合材料，并且在另一个实施例中，通过柔性柔性部分的衬底。

公开(公告)号：US20070045632A1

公开(公告)日：2007-03-01

申请号：US11217877

申请日：2005-09-01

申请人： Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

发明人： Steven Oliver ,  Lu Velicky ,  William Hiatt ,  David Hembree ,  Mark Tuttle ,  Sidney Rigg ,  James Wark ,  Warren Farnworth ,  Kyle Kirby

IPC分类号： H01L33/00

CPC分类号： H01L21/00 ,  H01L21/76898 ,  H01L23/552 ,  H01L27/14609 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L2924/0002 ,  H01L2924/00

摘要： Microelectronic imaging units and methods for manufacturing a plurality of imaging units at the wafer level are disclosed herein. In one embodiment, a method for manufacturing a plurality of imaging units includes providing an imager workpiece having a plurality of imaging dies including integrated circuits, external contacts electrically coupled to the integrated circuits, and image sensors operably coupled to the integrated circuits. The individual image sensors include at least one dark current pixel at a perimeter portion of the image sensor. The method includes depositing a cover layer onto the workpiece and over the image sensors. The method further includes patterning and selectively developing the cover layer to form discrete volumes of cover layer material over corresponding image sensors. The discrete volumes of cover layer material have sidewalls aligned with an inboard edge of the individual dark current pixels such that the dark current pixels are not covered by the discrete volumes.

摘要翻译： 本文公开了用于在晶片级制造多个成像单元的微电子成像单元和方法。 在一个实施例中，制造多个成像单元的方法包括提供具有多个成像管芯的成像工件，所述成像管芯包括集成电路，电耦合到集成电路的外部触点以及可操作地耦合到集成电路的图像传感器。 各个图像传感器包括在图像传感器的周边部分处的至少一个暗电流像素。 该方法包括将覆盖层沉积在工件上并在图像传感器上方。 该方法还包括图案化和选择性地显影覆盖层以在对应的图像传感器上形成分离体积的覆盖层材料。 覆盖层材料的离散体积具有与各个暗电流像素的内侧边缘对准的侧壁，使得暗电流像素不被离散体积覆盖。

公开(公告)号：US20110233777A1

公开(公告)日：2011-09-29

申请号：US13154550

申请日：2011-06-07

申请人： Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

发明人： Salman Akram ,  Charles Watkins ,  Mark Hiatt ,  David Hembree ,  James Wark ,  Warren Farnworth ,  Mark Tuttle ,  Sidney Rigg ,  Steven Oliver ,  Kyle Kirby ,  Alan Wood ,  Lu Velicky

IPC分类号： H01L23/498 ,  H01L23/48

CPC分类号： H01L21/76877 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/45 ,  H01L27/14634 ,  H01L27/14636 ,  H01L2221/6834 ,  H01L2224/02166 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

摘要翻译： 公开了一种用于成像器，存储器和其他集成电路应用的透晶片互连，从而消除了对引线接合的需要，使得结合这种互连的器件可堆叠并且实现成像器件的晶片级封装。 此外，实现了更小且更可靠的管芯封装，并且由于信号路径长度的减小，电路寄生（例如，L和R）被减小。