公开(公告)号：US5626771A

公开(公告)日：1997-05-06

申请号：US470270

申请日：1995-06-06

申请人： Charles R. Davis ,  Frank D. Egitto ,  Eugene R. Skarvinko

发明人： Charles R. Davis ,  Frank D. Egitto ,  Eugene R. Skarvinko

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H05K1/00 ,  H05K3/00 ,  H05K3/46 ,  H01L21/268

CPC分类号： H05K3/0035 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/142 ,  H01L23/145 ,  H01L23/49894 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0373 ,  H05K2201/0195 ,  H05K2203/0207 ,  H05K3/4602 ,  H05K3/4641 ,  H05K3/4644 ,  H05K3/4676 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/3154 ,  Y10T428/31721

摘要： A multi-layer electronic circuit package including at least one electrically conductive plane, a first organic polymeric dielectric material having a first optical absorbency to an ablating wavelength of laser light, and a second organic polymeric dielectric material having a second optical absorbency to the ablating wavelength of laser light. The first and second optical absorbencies being different from each other. A first layer of one of the organic polymeric materials overlays at least one surface of the at least one electrically conductive plane and a second layer of a different organic polymeric material with a different optical absorbency to the material in the first layer overlays the first layer.

摘要翻译： 一种多层电子电路封装，包括至少一个导电平面，对激光的消融波长具有第一光学吸收性的第一有机聚合物电介质材料和具有对消融波长的第二光学吸收性的第二有机聚合物电介质材料 的激光。 第一和第二光吸收率彼此不同。 有机聚合材料之一的第一层覆盖至少一个导电平面的至少一个表面，并且具有与第一层中的材料不同的光学吸收性的不同有机聚合物材料的第二层覆盖在第一层上。

公开(公告)号：US5384690A

公开(公告)日：1995-01-24

申请号：US97544

申请日：1993-07-27

申请人： Charles R. Davis ,  Thomas P. Duffy ,  Steven L. Hanakovic ,  Howard L. Heck ,  John T. Kolias ,  John S. Kresge ,  David N. Light ,  Ajit K. Trivedi

发明人： Charles R. Davis ,  Thomas P. Duffy ,  Steven L. Hanakovic ,  Howard L. Heck ,  John T. Kolias ,  John S. Kresge ,  David N. Light ,  Ajit K. Trivedi

IPC分类号： H01R4/26 ,  H01R4/58 ,  H01R12/61 ,  H01R13/66 ,  H05K1/00 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/32 ,  H05K3/46 ,  H01R23/68

CPC分类号： H05K3/4635 ,  H01R12/613 ,  H01R13/665 ,  H05K3/462 ,  H01R4/26 ,  H01R4/58 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/09109 ,  H05K2201/09536 ,  H05K2201/10159 ,  H05K3/328 ,  H05K3/4623 ,  H05K3/4641 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49179 ,  Y10T428/24917

摘要： Disclosed is a parallel processor packaging structure and a method for manufacturing the structure. The individual logic and memory elements are on printed circuit cards. These printed circuit boards and cards are, in turn, mounted on or connected to circuitized flexible substrates extending outwardly from a laminate of the circuitized, flexible substrates. Intercommunication is provided through a switch structure that is implemented in the laminate. The printed circuit cards are mounted on or connected to a plurality of circuitized flexible substrates, with one printed circuit card at each end of the circuitized flexible circuit. The circuitized flexible substrates connect the separate printed circuit boards and cards through the central laminate portion. This laminate portion provides XY plane and Z-axis interconnection for inter-processor, inter-memory, inter-processor/memory element, and processor to memory bussing interconnection, and communication. The planar circuitization, as data lines, address lines, and control lines of a logic chip or a memory chip are on the individual printed circuit boards and cards, which are connected through the circuitized flex, and communicate with other layers of flex through Z-axis circuitization (vias and through holes) in the laminate. Lamination of the individual subassemblies is accomplished with a low melting adhesive that is chemical compatible with (bondable to) the perfluorocarbon polymer between the subassemblies in the regions intended to be laminated, and, optionally, a high melting mask that is chemically incompatible with (not bondable to) the perfluorocarbon polymer between the subassemblies in the regions not intended to be laminated. The subassembly stack is heated to selectively effect adhesion and lamination in areas thereof intended to be laminated while avoiding lamination in areas not intended to be laminated.

摘要翻译： 公开了一种并行处理器封装结构和用于制造该结构的方法。 单独的逻辑和存储器元件在印刷电路卡上。 这些印刷电路板和卡依次安装在或连接到从电路化的柔性基板的层叠体向外延伸的电路化柔性基板上。 通过在层压板中实现的开关结构来提供互通。 印刷电路卡安装在或连接到多个电路化的柔性基板上，在电路化柔性电路的每一端具有一个印刷电路卡。 电路化的柔性基板通过中央层压体部分连接分开的印刷电路板和卡。 该层压部分为处理器间，存储器间，处理器间/存储器元件以及处理器到存储器总线互连和通信提供XY平面和Z轴互连。 作为逻辑芯片或存储器芯片的数据线，地址线和控制线的平面电路在通过电路化的柔性连接的各个印刷电路板和卡上，并且通过Z轴与其它柔性层通信， 轴向电路（通孔和通孔）。 各个子组件的层压是通过与要层压的区域中的子组件之间的全氟化碳聚合物化学相容（可粘合）化学相容的低熔点粘合剂，以及任选的与化学不相容的高熔点掩模 可粘合到）在不想层压的区域中的子组件之间的全氟化碳聚合物。 加热组件叠层以选择性地在要层压的区域中进行粘合和层压，同时避免在不想层压的区域中层压。

公开(公告)号：US5206074A

公开(公告)日：1993-04-27

申请号：US657795

申请日：1991-02-20

申请人： Charles R. Davis ,  Ashit A. Mehta ,  Konstantinos Papathomas ,  Lee P. Springer ,  William J. Summa ,  David W. Wang

发明人： Charles R. Davis ,  Ashit A. Mehta ,  Konstantinos Papathomas ,  Lee P. Springer ,  William J. Summa ,  David W. Wang

IPC分类号： C07D303/12 ,  C09J4/00 ,  H05K1/03

CPC分类号： C08G59/4014 ,  B32B15/08 ,  B32B15/20 ,  B32B27/06 ,  B32B27/34 ,  B32B7/12 ,  C08L63/00 ,  C08L79/08 ,  H05K1/034 ,  Y10S428/901 ,  Y10T428/24917

摘要： Disclosed is a polymeric product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Also disclosed is an organic polymeric dielectric composite of organic polymeric films, as polyimide films, dispersed in and reinforcing the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane. Further disclosed is an electronic circuit package that is adapted to receive at least one microelectronic circuit chip, with at least one layer having a substrate of an organic polymeric dielectric composite of organic polymeric films and the organic polymeric adhesive reaction product of diglycidyl bis phenol p-dialkyl benzene, and dicyanate diphenyl hexafluoro isopropane.

摘要翻译： 公开了二缩水甘油基双酚对二烷基苯和二氰基二苯基六氟异丙烷的聚合物。 还公开了分散在二缩水甘油基双酚对二烷基苯和二氰基二苯基六氟异丙苯的有机聚合物粘合反应产物中的有机聚合物膜作为聚酰亚胺膜的有机聚合物电介质复合材料。 还公开了一种电子电路封装，其适于接收至少一个微电子电路芯片，其中至少一层具有有机聚合物膜的有机聚合物电介质复合材料的基底和二缩水甘油基双酚对苯二甲酸的有机聚合物粘合反应产物， 二苯基苯和二氰基二苯基六氟异丙苯。

公开(公告)号：US4787077A

公开(公告)日：1988-11-22

申请号：US90636

申请日：1987-08-28

申请人： Roger W. Barton ,  Martin Y. Chen ,  Charles R. Davis ,  Grace L. Gorman ,  Vincent Marrello ,  Kurt A. Rubin

发明人： Roger W. Barton ,  Martin Y. Chen ,  Charles R. Davis ,  Grace L. Gorman ,  Vincent Marrello ,  Kurt A. Rubin

IPC分类号： G11B7/0045 ,  G11B7/243 ,  G11C13/02 ,  G11B7/24

CPC分类号： G11B7/00454 ,  G11B7/243 ,  G11B2007/24312 ,  G11B2007/24316 ,  Y10S430/146

摘要： An optical storage system has an information containing film of a material which has a crystallization temperature between 100.degree. C. and 400.degree. C. and can be switched between the amorphous and the crystalline states. Both the amorphous and crystalline states are substantially a single phase where the stoichiometric ratio of the material remains unchanged. Spots on the film is heated with a circular laser beam with a controlled pulse duration and intensity to melt the material in the spots. The spots are quenched at one rate to produce the amorphous state, and in a second revolution of the disk, at a different rate to produce the crystalline state.

摘要翻译： 光学存储系统具有包含结晶温度在100℃至400℃之间的材料的膜的信息，并且可以在无定形状态和结晶状态之间切换。 无定形和结晶状态都基本上是单相，其中材料的化学计量比保持不变。 膜上的斑点用具有受控脉冲持续时间和强度的圆形激光束加热以熔化斑点中的材料。 斑点以一个速率淬火以产生非晶态，并且在盘的第二次旋转中以不同的速率产生晶体状态。

公开(公告)号：US06912281B2

公开(公告)日：2005-06-28

申请号：US10330430

申请日：2002-12-30

申请人： Charles R. Davis

发明人： Charles R. Davis

IPC分类号： H04B3/23 ,  H04M9/08

CPC分类号： H04B3/23

摘要： Long distance telephone connections must commonly employ echo cancellers to eliminate irritating echo. The normal practice is to additionally employ non-linear processors (NLPs) as an integral component of an echo canceller in order to eliminate small residual echo which remains after initial echo cancellation. While such devices do indeed remove remaining residual echo, they also may introduce additional problems, such as suppression of the background signal. However, in some cases there is no need to deploy a potentially problematic non-linear processor. If the overall route delay of the telephone connection is not excessive, the participants do not notice the residual echo. Therefore, a determination is made of the end to end delay of the overall telephone connection. If the determined delay is not excessive, non-linear processing is not applied or is applied less aggressively. This results in a clearer telephone call, free from non-linear processor problems.

摘要翻译： 长距离电话连接必须通常使用回声消除器来消除刺激性回声。 通常的做法是额外地使用非线性处理器（NLP）作为回波消除器的组成部分，以便消除在初始回波消除之后保留的小残留回波。 虽然这样的装置确实去除剩余的残留回波，但是它们也可能引入诸如抑制背景信号的附加问题。 然而，在某些情况下，不需要部署潜在的有问题的非线性处理器。 如果电话连接的整体路由延迟不超过，参与者不会注意到剩余的回波。 因此，确定整体电话连接的端到端延迟。 如果确定的延迟不是过大的，则不应用非线性处理或较不积极地应用非线性处理。 这导致更清晰的电话呼叫，没有非线性处理器问题。

公开(公告)号：US06486557B1

公开(公告)日：2002-11-26

申请号：US09515110

申请日：2000-02-29

申请人： Charles R. Davis ,  Daniel Charles Edelstein ,  John C. Hay ,  Jeffrey C. Hedrick ,  Christopher Jahnes ,  Vincent McGahay ,  Henry A. Nye, III

发明人： Charles R. Davis ,  Daniel Charles Edelstein ,  John C. Hay ,  Jeffrey C. Hedrick ,  Christopher Jahnes ,  Vincent McGahay ,  Henry A. Nye, III

IPC分类号： H01L2348

CPC分类号： H01L21/76808 ,  H01L21/76835 ,  H01L23/5222 ,  H01L23/53228 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： A multi-level, coplanar copper damascene interconnect structure on an integrated circuit chip includes a first planar interconnect layer on an integrated circuit substrate and having plural line conductors separated by a dielectric material having a relatively low dielectric constant and a relatively low elastic modulus. A second planar interconnect layer on the first planar interconnect layer comprises a dielectric film having an elastic modulus higher than in the first planar interconnect layer and conductive vias therethrough. The vias are selectively in contact with the line conductors. A third planar interconnect layer on the second planar interconnect layer has plural line conductors separated by the dielectric material and selectively in contact with the vias.

摘要翻译： 集成电路芯片上的多层共面铜镶嵌互连结构包括在集成电路基板上的第一平面互连层，并且具有由具有相对较低的介电常数和相对低的弹性模量的介电材料隔开的多个线导体。 第一平面互连层上的第二平面互连层包括具有高于第一平面互连层的弹性模量和通过其的导电通孔的电介质膜。 通孔选择性地与线路导体接触。 第二平面互连层上的第三平面互连层具有被电介质材料隔开并选择性地与通孔接触的多个线导体。

公开(公告)号：US5848143A

公开(公告)日：1998-12-08

申请号：US718491

申请日：1996-11-05

申请人： G. Wayne Andrews ,  Steven H. Webber ,  James P. Kelly ,  Lawrence E. Johnson ,  Jerry A. Stern ,  Vincent J. Milano, Jr. ,  Charles R. Davis

发明人： G. Wayne Andrews ,  Steven H. Webber ,  James P. Kelly ,  Lawrence E. Johnson ,  Jerry A. Stern ,  Vincent J. Milano, Jr. ,  Charles R. Davis

IPC分类号： H04M3/22 ,  H04M3/36 ,  H04M3/493 ,  H04M3/51 ,  H04M3/523 ,  H04M7/12 ,  H04Q3/66 ,  H04Q3/72 ,  H04M7/06

CPC分类号： H04Q3/66 ,  H04M3/493 ,  H04M3/5191 ,  H04M3/5237 ,  H04M2242/22 ,  H04M3/22 ,  H04M3/36 ,  H04M3/42042 ,  H04M3/42059 ,  H04M3/42102 ,  H04M7/12 ,  H04Q2213/13034 ,  H04Q2213/1307 ,  H04Q2213/13072 ,  H04Q2213/13091 ,  H04Q2213/13103 ,  H04Q2213/13104 ,  H04Q2213/13141 ,  H04Q2213/13148 ,  H04Q2213/13167 ,  H04Q2213/13206 ,  H04Q2213/13209 ,  H04Q2213/1322 ,  H04Q2213/13288 ,  H04Q2213/13296 ,  H04Q2213/13349 ,  H04Q2213/13377 ,  H04Q2213/13389 ,  H04Q3/72

摘要： A communications system and method for automatically making telephone routing decisions with "global authority" based upon information gathered in real time from the entire communications system and global optimization criteria. The present invention permits unified central control and management for the entire system.

摘要翻译： PCT No.PCT / US96 / 02890 Sec。 371日期：1996年11月5日 102（e）日期1996年11月5日PCT 1996年3月4日PCT公布。 WO96 / 27254 PCT公开号 日期1996年9月6日基于从整个通信系统和全球优化标准实时收集的信息，自动进行电话路由决策的通信系统和方法。 本发明允许对整个系统进行统一的中央控制和管理。

公开(公告)号：US5421507A

公开(公告)日：1995-06-06

申请号：US134994

申请日：1993-10-12

申请人： Charles R. Davis ,  Richard Hsiao ,  James R. Loomis ,  Jae M. Park ,  Jonathan D. Reid

发明人： Charles R. Davis ,  Richard Hsiao ,  James R. Loomis ,  Jae M. Park ,  Jonathan D. Reid

IPC分类号： H01R43/02 ,  B23K35/00 ,  B23K35/30 ,  H01R4/02 ,  H05K3/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/46 ,  B23K1/00

CPC分类号： B23K35/3013 ,  B23K35/001 ,  H01R4/02 ,  H05K3/4614 ,  H01L2924/0132 ,  H05K2201/0305 ,  H05K3/28 ,  H05K3/328 ,  H05K3/4038 ,  Y10S428/901 ,  Y10T156/1056 ,  Y10T29/49126

摘要： A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au--Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

摘要翻译： 公开了一种同时层压电路化电介质层以形成多层高性能电路板并制造层间电连接的方法。 该方法选择将在一个低温下形成共晶体的两种元素，并将固化形成合金，该合金将仅在任何后续层压所要求的第二温度下再熔化。 使用瞬态液体粘合技术和足够的Au和Sn制成接头，以在低温下产生Au-Sn20wt％共晶。 一旦固化，形成的合金在随后的叠片中保持固体。 结果，制造复合的，多层的高性能电路板，通过固体合金在选定的焊盘处电连接。

公开(公告)号：US4722160A

公开(公告)日：1988-02-02

申请号：US896644

申请日：1986-08-15

申请人： Charles R. Davis

发明人： Charles R. Davis

IPC分类号： A47G7/06 ,  E04H13/00 ,  A01G5/00

CPC分类号： A47G7/06 ,  E04H13/003

摘要： A combination grave marker and vase is disclosed. The marker has an enclosure with a top, bottom and four sides. The top has an opening closed by a swinging cover. The cover has a lever with a counterweight. The lever also has an arcuate slot which registers with a slotted member extending generally vertically. An axle on the counterweight engages both the slot in the lever and enclosure. The cover has a receptacle for flowers. When the marker is in use, the cover is opened which will be moved to use position and the flowers can then be placed in the flower receptacle. Since the flower receptacle is integral with the cover, it cannot be craried away and lost. The enclosure top can be flush with the surface of the ground so that it does not interfere with normal cemetery maintenance.

摘要翻译： 公开了组合坟墓标记和花瓶。 标记有一个顶部，底部和四边的外壳。 顶部有一个由摇摆盖封闭的开口。 盖子有一个带有配重的杠杆。 杠杆还具有弓形槽，其与通常垂直延伸的开槽构件对准。 配重上的轴与杠杆和外壳中的槽啮合。 盖子有一个花的插座。 当使用标记时，打开盖子，将其移动到使用位置，然后可以将花放置在花瓶中。 由于花容器与盖子是一体的，因此不能被破坏并丢失。 外壳顶部可以与地面平齐，以免干扰正常的墓地维护。

公开(公告)号：US4651337A

公开(公告)日：1987-03-17

申请号：US792276

申请日：1985-10-28

申请人： Jonathan C. Boomgaarden ,  Bruce Q. Bautista ,  Charles R. Davis ,  Steven R. Frank

发明人： Jonathan C. Boomgaarden ,  Bruce Q. Bautista ,  Charles R. Davis ,  Steven R. Frank

IPC分类号： G03B42/02

CPC分类号： G03B42/025

摘要： A method and apparatus for controlling motion of power driven mechanisms in a medical x-ray spot filming system in order to minimize induced vibrations of x-ray film due to acceleration and deceleration of the power driven mechanisms. The invention includes a method and apparatus for establishing a desired profile of position of the x-ray associated mechanisms as a function of time and for implementing a move of the mechanism in accordance with the desired profile. In one form the profile is divided into a plurality of equal time increments and the motion of the mechanism is computed for each time increment as a function of a particular change in position such that a move can be completed within a fixed time interval. Depending upon the length of the move, a change in position for each time increment is determined and the mechanism is moved in accordance with the computed position change for each time increment.

摘要翻译： 一种用于控制医用x射线点成像系统中的动力驱动机构的运动的方法和装置，以便最小化由于动力驱动机构的加速和减速引起的X射线胶片的诱发振动。 本发明包括一种方法和装置，用于根据时间建立与X射线相关联的机构的位置的期望分布，以及根据期望的轮廓实现机构的移动。 在一种形式中，轮廓被分成多个相等的时间增量，并且针对每个时间增量计算机构的运动，作为特定位置变化的函数，使得可以在固定的时间间隔内完成移动。 根据移动的长度，确定每个时间增量的位置变化，并且根据每个时间增量的计算的位置变化来移动机构。