公开(公告)号：US20090256246A1

公开(公告)日：2009-10-15

申请号：US12487666

申请日：2009-06-19

申请人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Y. Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

发明人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Y. Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L21/56

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

摘要翻译： 半导体封装包括杯形并保持半导体管芯的引线框架。 引线框架与裸片的一侧上的端子电接触，并且引线框架的引线以这样的方式弯曲，使得引线的一部分与管芯的另一侧共面，其还包含一个或多个端子 。 在引线框架和模具周围形成塑料胶囊。

公开(公告)号：US06744124B1

公开(公告)日：2004-06-01

申请号：US09468249

申请日：1999-12-10

申请人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Y. Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

发明人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Y. Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

IPC分类号： H01L2322

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/34 ,  H01L2224/32245 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

摘要翻译： 半导体封装包括杯形并保持半导体管芯的引线框架。 引线框架与裸片的一侧上的端子电接触，并且引线框架的引线以这样的方式弯曲，使得引线的一部分与管芯的另一侧共面，其还包含一个或多个端子 。 在引线框架和模具周围形成塑料胶囊。

公开(公告)号：US09040356B2

公开(公告)日：2015-05-26

申请号：US12487666

申请日：2009-06-19

申请人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

发明人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

IPC分类号： H01L21/50 ,  H01L23/495 ,  H01L23/31 ,  H01L23/544

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

摘要翻译： 半导体封装包括杯形并保持半导体管芯的引线框架。 引线框架与裸片的一侧上的端子电接触，并且引线框架的引线以这样的方式弯曲，使得引线的一部分与管芯的另一侧共面，其还包含一个或多个端子 。 在引线框架和模具周围形成塑料胶囊。

公开(公告)号：US06909170B2

公开(公告)日：2005-06-21

申请号：US10291153

申请日：2002-11-07

申请人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Y. Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

发明人： Mike Chang ,  King Owyang ,  Yueh-Se Ho ,  Y. Mohammed Kasem ,  Lixiong Luo ,  Wei-Bing Chu

IPC分类号： H01L23/495 ,  H01L23/04 ,  H01L23/34 ,  H01L23/52

CPC分类号： H01L23/49562 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/34 ,  H01L2224/32245 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/37099

摘要： A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the leadframe are bent in such a way that portions of the leads are coplanar with the other side of the die, which also contains one or more terminals. A plastic capsule is formed around the leadframe and die.

摘要翻译： 半导体封装包括杯形并保持半导体管芯的引线框架。 引线框架与裸片的一侧上的端子电接触，并且引线框架的引线以这样的方式弯曲，使得引线的一部分与管芯的另一侧共面，其还包含一个或多个端子 。 在引线框架和模具周围形成塑料胶囊。

公开(公告)号：US07633140B2

公开(公告)日：2009-12-15

申请号：US10732181

申请日：2003-12-09

申请人： Leeshawn Luo ,  Anup Bhalla ,  Sik K. Lui ,  Yueh-Se Ho ,  Mike F. Chang ,  Xiao Tiang Zhang

发明人： Leeshawn Luo ,  Anup Bhalla ,  Sik K. Lui ,  Yueh-Se Ho ,  Mike F. Chang ,  Xiao Tiang Zhang

IPC分类号： H01L23/495

CPC分类号： H01L24/48 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/37 ,  H01L24/40 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/84801 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.

摘要翻译： 半导体封装包括具有多个引线和引线框架焊盘的引线框架，所述引线框架焊盘包括耦合到其上的管芯，所述多个引线中的至少一个引线具有相对于所述封装的底表面向上倾斜的外部部分 将模具连接到多个引线的金属连接器以及封装模具，金属连接器和引线框架的至少一部分的树脂体。

公开(公告)号：US07208818B2

公开(公告)日：2007-04-24

申请号：US10896375

申请日：2004-07-20

申请人： Leeshawn Luo ,  Anup Bhalla ,  Sik K. Lui ,  Yueh-Se Ho ,  Mike F. Chang ,  Xiao Tian Zhang

发明人： Leeshawn Luo ,  Anup Bhalla ,  Sik K. Lui ,  Yueh-Se Ho ,  Mike F. Chang ,  Xiao Tian Zhang

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L23/492 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015

摘要： A semiconductor package including a relatively thick lead frame having a plurality of leads and a first lead frame pad, the first lead frame pad including a die coupled thereto, bonding wires connecting the die to the plurality of leads, the bonding wires being aluminum, and a resin body encapsulating the die, bonding wires and at least a portion of the lead frame.

摘要翻译： 一种半导体封装，包括具有多个引线的相对厚的引线框架和第一引线框架焊盘，所述第一引线框焊盘包括与其连接的管芯，将所述管芯连接到所述多个引线的接合线，所述接合线为铝，以及 封装模具的树脂体，接合线和引线框架的至少一部分。

公开(公告)号：US20160155688A9

公开(公告)日：2016-06-02

申请号：US14033140

申请日：2013-09-20

申请人： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

发明人： Yan Xun Xue ,  Yueh-Se Ho ,  Hamza Yilmaz ,  Jun Lu ,  Lei Shi ,  Liang Zhao ,  Ping Huang

IPC分类号： H01L23/495

CPC分类号： H01L23/49537 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/16245 ,  H01L2924/13091 ,  H01L2924/00

摘要： A power semiconductor package has an ultra thin chip with front side molding to reduce substrate resistance; a lead frame unit with grooves located on both side leads provides precise positioning for connecting numerous bridge-shaped metal clips to the front side of the side leads. The bridge-shaped metal clips are provided with bridge structure and half or fully etched through holes for relieving superfluous solder during manufacturing process.

公开(公告)号：US09184117B2

公开(公告)日：2015-11-10

申请号：US13663694

申请日：2012-10-30

申请人： Yueh-Se Ho ,  Yan Xun Xue ,  Hamza Yilmaz ,  Jun Lu

发明人： Yueh-Se Ho ,  Yan Xun Xue ,  Hamza Yilmaz ,  Jun Lu

IPC分类号： H01L29/40 ,  H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L23/4952 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L2221/68327 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13794 ,  H01L2224/13839 ,  H01L2224/1403 ,  H01L2224/16245 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/371 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40248 ,  H01L2224/40499 ,  H01L2224/405 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2224/8185 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92225 ,  H01L2224/92226 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01082 ,  H01L2924/07811 ,  H01L2924/00012

摘要： The invention relates to a power semiconductor device and a preparation method, particularly relates to preparation of stacked dual-chip packaging structure of MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) using flip chip technology with two interconnecting plates. The first chip is flipped and attached on the base such that the first chip is overlapped with the third pin; the back metal layer of the first chip is connected to the bonding strip of the first pin through a first interconnecting plate; the second chip is flipped and attached on a main plate portion of the first interconnecting plate such that the second chip is overlapped with the fourth pin; and the back metal layer of the second chip is connected to the bonding strip of the second pin through the second interconnecting plate.

摘要翻译： 本发明涉及一种功率半导体器件及其制备方法，特别涉及使用具有两个互连板的倒装芯片技术来制备MOSFET（金属氧化物半导体场效应晶体管）的层叠双芯片封装结构。 第一芯片被翻转并附接在基座上，使得第一芯片与第三引脚重叠; 第一芯片的背金属层通过第一互连板连接到第一引脚的接合条; 第二芯片被翻转并附接在第一互连板的主板部分上，使得第二芯片与第四引脚重叠; 并且第二芯片的背金属层通过第二互连板连接到第二引脚的接合条。

公开(公告)号：US20140242756A1

公开(公告)日：2014-08-28

申请号：US13775212

申请日：2013-02-24

申请人： Yan Xun Xue ,  Ping Huang ,  Hamza Yilmaz ,  Yueh-Se Ho ,  Lei Shi ,  Liang Zhao ,  Ping Li Wu ,  Lei Duan ,  Yuping Gong

发明人： Yan Xun Xue ,  Ping Huang ,  Hamza Yilmaz ,  Yueh-Se Ho ,  Lei Shi ,  Liang Zhao ,  Ping Li Wu ,  Lei Duan ,  Yuping Gong

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  H01L21/561 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/13 ,  H01L24/73 ,  H01L2224/1184 ,  H01L2224/13101 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/83191 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/13091 ,  H01L2924/18301 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

摘要： A method for preparing semiconductor devices in a flip chip process comprises forming deep grooves surrounding each of the semiconductor chips; depositing a first plastic package material to form a first plastic package layer covering front surface of the semiconductor wafer and filling the deep grooves; depositing a metal layer at back surface of the semiconductor wafer after grinding; grinding an outermost portion of the metal layer thus forming a ring area located at back surface around edge of the semiconductor wafer not covered by the metal layer; cutting the first plastic package layer, the semiconductor wafer, the metal layer and the first plastic package material filled in the deep grooves along a straight line formed by two ends of each of the deep grooves filled with the first plastic package material; and picking up the semiconductor devices and mounting on a substrate without flipping the semiconductor devices.

摘要翻译： 一种用于在倒装芯片工艺中制备半导体器件的方法包括形成围绕每个半导体芯片的深槽; 沉积第一塑料封装材料以形成覆盖半导体晶片的前表面并填充深槽的第一塑料封装层; 在研磨后在半导体晶片的背面沉积金属层; 研磨金属层的最外部分，从而形成位于未被金属层覆盖的半导体晶片的边缘周围的背面的环形区域; 沿着由填充有第一塑料包装材料的每个深槽的两端形成的直线切割填充在深槽中的第一塑料封装层，半导体晶片，金属层和第一塑料封装材料; 并且拾取半导体器件并安装在衬底上，而不会翻转半导体器件。

公开(公告)号：US20140191334A1

公开(公告)日：2014-07-10

申请号：US13734201

申请日：2013-01-04

申请人： Yan Xun Xue ,  Yueh-Se Ho ,  Lei Shi ,  Jun Lu ,  Liang Zhao

发明人： Yan Xun Xue ,  Yueh-Se Ho ,  Lei Shi ,  Jun Lu ,  Liang Zhao

IPC分类号： H01L23/495 ,  H01L27/088

CPC分类号： H01L23/49575 ,  H01L23/49524 ,  H01L23/49537 ,  H01L23/49562 ,  H01L24/34 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L27/088 ,  H01L2224/37011 ,  H01L2224/371 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A stacked power semiconductor device includes vertical metal oxide semiconductor field-effect transistors and dual lead frames packaged with flip-chip technology. In the method of manufacturing the stacked power semiconductor device, a first semiconductor chip is flip chip mounted on the first lead frame. A mounting clips is connected to the electrode at back side of the first semiconductor chip. A second semiconductor chip is mounted on the second lead frame, which is then flipped and stacked on the mounting clip.

摘要翻译： 叠层功率半导体器件包括垂直金属氧化物半导体场效应晶体管和采用倒装芯片技术封装的双引线框架。 在制造堆叠式功率半导体器件的方法中，第一半导体芯片是安装在第一引线框上的倒装芯片。 安装夹在第一半导体芯片的背面连接到电极。 第二半导体芯片安装在第二引线框架上，然后翻转并堆叠在安装夹上。