公开(公告)号：US6132543A

公开(公告)日：2000-10-17

申请号：US41666

申请日：1998-03-13

申请人： Noboru Mohri ,  Hayami Matsunaga ,  Masaaki Hayama ,  Tomitarou Murakami

发明人： Noboru Mohri ,  Hayami Matsunaga ,  Masaaki Hayama ,  Tomitarou Murakami

IPC分类号： H05K3/40 ,  H01L23/12 ,  H01L23/13 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/12 ,  H05K3/20 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46 ,  B32B31/26

CPC分类号： H05K3/3484 ,  H05K3/207 ,  H05K3/3457 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/162 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/09572 ,  H05K2201/09763 ,  H05K2203/0113 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K3/1216 ,  H05K3/386 ,  H05K3/4061 ,  Y10T29/49163

摘要： The present invention provides a packaged substrate which has a superior positioning accuracy of wiring formed on a circuit substrate made of ceramics, and a conductive pattern with a thick film and yet a fine pattern. On a surface of flexible base member made of plastic, fine grooves are formed in a pattern corresponding to a first conductive pattern so that a cavity face is produced. Conductive paste is filled and into the grooves on this cavity face, and then dried. The cavity face and a circuit substrate are pasted with each other by applying predetermined heat and pressure. A pattern of the dried conductive paste is transcribed onto the circuit substrate, and then the first conductive pattern is formed by firing. A first ball solder is coupled with a second conductive pattern which is coupled to the first conductive pattern through an electrode in a through-hole of the circuit substrate.

摘要翻译： 本发明提供一种封装基板，其具有优良的定位精度，该布线形成在由陶瓷制成的电路基板上，导电图案具有厚膜，而且精细图案。 在由塑料制成的柔性基材的表面上，以对应于第一导电图案的图案形成微细凹槽，从而产生空腔面。 将导电浆料填充到该空腔面上的凹槽中，然后干燥。 通过施加预定的热和压力将空腔面和电路基板彼此粘贴。 将干燥的导电浆料的图案转印到电路基板上，然后通过烧制形成第一导电图案。 第一球焊与第二导电图案耦合，第二导电图案通过电路基板的通孔中的电极耦合到第一导电图案。

公开(公告)号：US07180012B2

公开(公告)日：2007-02-20

申请号：US10493437

申请日：2003-08-25

申请人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H01L23/28

CPC分类号： H01L23/3121 ,  H01L23/13 ,  H01L23/552 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/403 ,  H01L2924/00

摘要： A module component with a good shield effect and a low height including a circuit board having mounted thereon a mount device including an electronic part. The device is sealed with a sealing body having a metal film formed on the sealing body surface. A ground pattern is formed at the outer periphery of the principal surface of the circuit board. The metal film is conductively connected with the ground pattern.

摘要翻译： 具有良好屏蔽效果和低高度的模块部件，包括其上安装有包括电子部件的安装装置的电路板。 该装置用形成在密封体表面上的金属膜的密封体密封。 在电路板的主表面的外周形成接地图案。 金属膜与接地图形导电连接。

公开(公告)号：US07161252B2

公开(公告)日：2007-01-09

申请号：US10485540

申请日：2003-06-16

申请人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Michiaki Tsuneoka ,  Koji Hashimoto ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H01L23/28

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/60 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H01L2224/29075 ,  H01L2924/00014

摘要： A module includes a component, a circuit board having the component mounted thereon, a first grounding pattern formed on an outermost periphery of a surface portion of the circuit board; a first sealer provided on the circuit board and having a dimension projected on the circuit board, and a metal film covering the sealer and connected to the grounding pattern. The dimension of the first dealer is smaller than an outside dimension of the circuit board. The first sealer is made of first resin and sealing the component. The module has a low profile and is adequately shielded.

摘要翻译： 模块包括部件，具有安装在其上的部件的电路板，形成在电路板的表面部分的最外周上的第一接地图案​​; 设置在电路板上并具有投影在电路板上的尺寸的第一密封器，以及覆盖密封件并连接到接地图案的金属膜。 第一经销商的尺寸小于电路板的外部尺寸。 第一个封口机由第一个树脂制成并密封组件。 该模块具有低外形并且被充分屏蔽。

公开(公告)号：US06998532B2

公开(公告)日：2006-02-14

申请号：US10500539

申请日：2003-12-22

申请人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe

发明人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe

IPC分类号： H01L23/28

CPC分类号： H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

摘要翻译： 模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料， 覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。 阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。 当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。

公开(公告)号：US06861744B2

公开(公告)日：2005-03-01

申请号：US10074792

申请日：2002-02-12

申请人： Masaaki Hayama ,  Noboru Mouri ,  Hayami Matsunaga

发明人： Masaaki Hayama ,  Noboru Mouri ,  Hayami Matsunaga

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/12 ,  H05K1/03 ,  H05K1/09 ,  H05K3/12 ,  H05K3/20 ,  H05K3/38 ,  H05K3/40 ,  H05K3/46 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L21/4867 ,  H01L24/28 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/207 ,  H05K3/386 ,  H05K3/4053 ,  H05K3/4061 ,  H05K3/4605 ,  H05K3/4647 ,  H05K3/4667 ,  H05K2203/0113 ,  H01L2924/00

摘要： A multilayer ceramic substrate has a first conductive pattern that is transfer-printed on a ceramic substrate using an intaglio plate made of a flexible resin. The intaglio plate has a plurality of grooves with different depts. A first insulation layer is on the first conductive pattern, and a second conductive pattern is on the insulating layer. The two conductive patterns are coupled by a via.

摘要翻译： 多层陶瓷基板具有使用由柔性树脂制成的凹版印刷在陶瓷基板上的第一导电图案。 凹版板具有多个具有不同深度的凹槽。 第一绝缘层位于第一导电图案上，第二导电图案在绝缘层上。 两个导电图案通过通孔耦合。

公开(公告)号：US20050017740A1

公开(公告)日：2005-01-27

申请号：US10488552

申请日：2003-02-19

申请人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

发明人： Hiroshi Higashitani ,  Takeo Yasuho ,  Masaaki Hayama

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H05K3/46 ,  G01R31/02

CPC分类号： G01R31/02 ,  G01R31/28 ,  H01L21/4857 ,  H01L21/563 ,  H01L23/49822 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2224/8114 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/16 ,  H05K1/186 ,  H05K3/20 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0723 ,  H05K2203/063 ,  H05K2203/1147 ,  H05K2203/167 ,  H05K2203/171 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

摘要翻译： 一种模块部件，其包括在至少一个表面上具有一个或多个部件1的电路基板3，以及具有中空部分4或孔的接合电路基板5，其对应于安装在一个或多个部件上的一个或多个部件1的部分 用于安装安装部件1的电路基板3的表面。这些基板被层压以形成单体，使得安装的部件1被包含在内部。 上述配置确保了层间连接的高可靠性，并且能够以高尺寸精度密集地安装多个部件。 因此，提供了高度可靠的紧凑模块组件。

公开(公告)号：US06759925B2

公开(公告)日：2004-07-06

申请号：US10148702

申请日：2002-09-10

申请人： Yuki Satoh ,  Tetsuya Tsurunari ,  Kozo Murakami ,  Yoshiharu Omori ,  Masaaki Hayama

发明人： Yuki Satoh ,  Tetsuya Tsurunari ,  Kozo Murakami ,  Yoshiharu Omori ,  Masaaki Hayama

IPC分类号： H03H964

CPC分类号： H04B1/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/16152 ,  H01L2924/19105 ,  H04B1/406 ,  H04B1/48 ,  H01L2924/00 ,  H01L2224/0401

摘要： A small radio-frequency hybrid switch module is provided for switching between transmitted signals and received signals in plural frequency bands. This module includes: a laminated body including a dielectric layer; a diplexer; a switching circuit; a low pass filter (LPF); a conductive pattern provided on the dielectric layer for forming at least one of the diplexer, the switching circuit and the LPF; a surface acoustic wave (SAW) filter mounted on the laminated body; a cover provided on the SAW filter for forming a cavity which allows surface acoustic wave vibration and for hermetically sealing the cavity; and a semiconductor switching device mounted on the laminated body for forming a part of the switching circuit.

摘要翻译： 提供了一种小型射频混合开关模块，用于在多个频带中的发射信号和接收信号之间切换。 该模块包括：包括电介质层的层叠体; 双工器 开关电路; 低通滤波器（LPF）; 设置在电介质层上的用于形成双工器，开关电路和LPF中的至少一个的导电图案; 安装在层叠体上的表面声波（SAW）滤波器; 设置在所述SAW滤波器上用于形成空腔的盖，所述空腔允许表面声波振动并且用于气密地密封所述空腔; 以及安装在层叠体上用于形成开关电路的一部分的半导体开关装置。

公开(公告)号：US20100025099A1

公开(公告)日：2010-02-04

申请号：US12461320

申请日：2009-08-07

申请人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

发明人： Toshio Sugawa ,  Satoshi Murakawa ,  Masaaki Hayama ,  Takeo Yasuho

IPC分类号： H05K1/02 ,  H05K3/10

CPC分类号： H05K3/4069 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2203/1461 ,  Y10T29/49155 ,  Y10T428/24917

摘要： A circuit board is manufactured by filling a via-hole formed in an insulating substrate with conductive material, disposing conductive layers on both sides of the insulating substrate, and forming alloy of component material of the conductive material with component material of the conductive layers. In the circuit board, therefore, the conductive material filled in the via-hole formed in the insulating substrate is securely connected electrically as well as mechanically to the conductive layers on both sides of the insulating substrate with high reliability.

摘要翻译： 通过用导电材料填充形成在绝缘基板中的通孔来制造电路板，在绝缘基板的两侧设置导电层，以及将导电材料的组分材料的合金与导电层的成分材料形成。 因此，在电路板中，填充在形成于绝缘基板上的通路孔中的导电材料与绝缘基板两侧的导电层电连接并且机械地牢固地连接在一起，具有高可靠性。

公开(公告)号：US06846375B2

公开(公告)日：2005-01-25

申请号：US09979018

申请日：2001-03-15

申请人： Masaaki Hayama ,  Kazuhiro Miura ,  Akira Hashimoto ,  Takeo Yasuho

发明人： Masaaki Hayama ,  Kazuhiro Miura ,  Akira Hashimoto ,  Takeo Yasuho

IPC分类号： H01L21/48 ,  H05K3/46 ,  B32B31/26

CPC分类号： H01L21/4857 ,  H01L21/4867 ,  H05K3/4664

摘要： The present invention provides a method of manufacturing a low-temperature sintering multilayer ceramic wiring board comprising the steps of: forming a wiring layer by printing conductive paste (4) on an unfired green sheet (1); forming a laminate by laminating, on at least one side of a ceramic substrate, the unfired green sheet having the wiring layer; and firing the laminate. The present invention also provides paste for use with this method. In the firing step, after an adhesive layer (8) or binder resin in said green sheet used for lamination burns, glass ceramic in the green sheet starts to sinter, and upon or after the start of sintering of the glass ceramic, conductive particles in the conductive paste starts to sinter. This manufacturing method can provide an precise wiring board without pattern deformation and also provide a low-temperature ceramic multilayer wiring board that has no cracks in the glass ceramic on the periphery of electrodes and has electrodes of a dense film structure.

摘要翻译： 本发明提供一种制造低温烧结多层陶瓷布线板的方法，包括以下步骤：通过在未烧成的生片（1）上印刷导电浆料（4）形成布线层; 在陶瓷基板的至少一侧层叠具有布线层的未烧成的生片，形成层叠体; 并烧制层压板。 本发明还提供了用于该方法的糊剂。 在烧成工序中，在用于层压燃烧的所述生片中的粘合剂层（8）或粘合剂树脂后，生片中的玻璃陶瓷开始烧结，玻璃陶瓷的烧结开始或之后，导电粒子 导电膏开始烧结。 该制造方法可以提供没有图案变形的精确布线板，并且还提供在电极周边的玻璃陶瓷中没有裂纹并且具有致密膜结构的电极的低温陶瓷多层布线板。

公开(公告)号：US20050013082A1

公开(公告)日：2005-01-20

申请号：US10500539

申请日：2003-12-22

申请人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe

发明人： Eiji Kawamoto ,  Masaaki Hayama ,  Masaaki Katsumata ,  Hiroki Yabe

IPC分类号： H01L21/60 ,  H05K3/28 ,  H05K3/34 ,  H02H1/00

CPC分类号： H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10175 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/0209 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599

摘要： A module includes an electronic component having at least two electrodes, a board having electrodes on its surface to be connected to the electrodes of the electronic component, respectively, solders for connecting the electrodes of the electronic component to the electrodes of the board, respectively, an insulating resin covering the electronic component, the surface of the board, the solder, and the electrodes, and solder resists provided on the surface of the board and around the electrodes of the board, respectively. One of the solder resists is separated from the other electrode at a portion between the electronic component and the board. When this module is mounted on a motherboard, the solder does not flow out of the electrodes even when the solder in the insulating resin melts.

摘要翻译： 模块包括具有至少两个电极的电子部件，其表面上分别连接到电子部件的电极的电极板，用于将电子部件的电极分别连接到电路板的电极的焊料， 覆盖电子部件的绝缘树脂，板的表面，焊料和电极以及设置在板的表面上和板的电极周围的阻焊剂。 阻焊剂之一在电子部件与电路板之间的部分与另一个电极分离。 当该模块安装在母板上时，即使当绝缘树脂中的焊料熔化时，焊料也不会流出电极。