公开(公告)号：US20070102683A1

公开(公告)日：2007-05-10

申请号：US11642697

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070102682A1

公开(公告)日：2007-05-10

申请号：US11642695

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070096065A1

公开(公告)日：2007-05-03

申请号：US11642696

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US09793198B2

公开(公告)日：2017-10-17

申请号：US14275519

申请日：2014-05-12

申请人： Invensas Corporation

发明人： Cyprian Emeka Uzoh ,  Rajesh Katkar

IPC分类号： H01L23/498 ,  B23K35/22 ,  B23K35/02 ,  B32B15/01 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  B23K1/00 ,  B23K101/40

CPC分类号： H01L23/49811 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/0266 ,  B23K35/22 ,  B23K2101/40 ,  B32B15/01 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/73 ,  H01L24/742 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/98 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/03 ,  H01L2224/03001 ,  H01L2224/03009 ,  H01L2224/03318 ,  H01L2224/0332 ,  H01L2224/0333 ,  H01L2224/03334 ,  H01L2224/0348 ,  H01L2224/03848 ,  H01L2224/03849 ,  H01L2224/039 ,  H01L2224/03901 ,  H01L2224/0391 ,  H01L2224/04105 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05294 ,  H01L2224/05547 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/056 ,  H01L2224/05794 ,  H01L2224/05839 ,  H01L2224/05844 ,  H01L2224/05847 ,  H01L2224/05855 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/11901 ,  H01L2224/1191 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1319 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13561 ,  H01L2224/13562 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/1403 ,  H01L2224/16058 ,  H01L2224/16059 ,  H01L2224/16145 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/17505 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2401 ,  H01L2224/2402 ,  H01L2224/24137 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/75253 ,  H01L2224/81 ,  H01L2224/81138 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/81815 ,  H01L2224/82005 ,  H01L2224/82101 ,  H01L2224/82102 ,  H01L2224/82105 ,  H01L2224/83 ,  H01L2224/8385 ,  H01L2224/9211 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/07025 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841

摘要： A solder connection may be surrounded by a solder locking layer (1210, 2210) and may be recessed in a hole (1230) in that layer. The recess may be obtained by evaporating a vaporizable portion (1250) of the solder connection. Other features are also provided.

公开(公告)号：US07691664B2

公开(公告)日：2010-04-06

申请号：US11642664

申请日：2006-12-21

申请人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01L21/00

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20080108218A1

公开(公告)日：2008-05-08

申请号：US11642664

申请日：2006-12-21

申请人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo T. Kodas ,  Mark J. Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron D. Stump ,  Allen B. Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01L21/44

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070104881A1

公开(公告)日：2007-05-10

申请号：US11642720

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D3/02

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070104869A1

公开(公告)日：2007-05-10

申请号：US11642749

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： B05D5/00 ,  B05D3/02

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070102685A1

公开(公告)日：2007-05-10

申请号：US11642748

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.

公开(公告)号：US20070096063A1

公开(公告)日：2007-05-03

申请号：US11642667

申请日：2006-12-21

申请人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

发明人： Toivo Kodas ,  Mark Hampden-Smith ,  Karel Vanheusden ,  Hugh Denham ,  Aaron Stump ,  Allen Schult ,  Paolina Atanassova ,  Klaus Kunze

IPC分类号： H01B1/12

CPC分类号： H05K3/105 ,  C23C18/06 ,  C23C18/08 ,  H01B1/026 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/05294 ,  H01L2224/053 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/097 ,  H05K2201/0154 ,  H05K2203/1131 ,  H01L2924/00

摘要： A precursor composition for the deposition and formation of an electrical feature such as a conductive feature. The precursor composition advantageously has a low viscosity enabling deposition using direct-write tools. The precursor composition also has a low conversion temperature, enabling the deposition and conversion to an electrical feature on low temperature substrates. A particularly preferred precursor composition includes silver metal for the formation of highly conductive silver features.