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    SIGNAL LEVEL CROSSING DETECTOR CIRCUIT
    191.
    发明申请
    SIGNAL LEVEL CROSSING DETECTOR CIRCUIT 有权
    信号电平交叉检测电路

    公开(公告)号：US20110279163A1

    公开(公告)日：2011-11-17

    申请号：US13106730

    申请日：2011-05-12

    Applicant: Iain Barnett ,  William Michael James Holland ,  Jonathan Ephraim David Hurwitz

    Inventor： Iain Barnett ,  William Michael James Holland ,  Jonathan Ephraim David Hurwitz

    IPC: H03L5/00

    CPC classification number: H05K1/162 ,  G01R15/06 ,  G01R15/16 ,  G01R19/12 ,  G01R19/175 ,  H03H7/004 ,  H05K1/0239 ,  H05K1/0256 ,  H05K2201/09309 ,  H05K2201/09972

    Abstract: A signal level crossing detector circuit includes a DC isolator and a detector circuit. The DC isolator has at least a first input, which is operable to receive a high voltage AC signal, and at least a first capacitor, a first plate of the first capacitor being electrically connected to the first input. The detector circuit is operable at a low voltage and has at least a first detector input, the first detector input being electrically connected to a second plate of the first capacitor, the low voltage detector circuit being operable to provide a change in output signal in dependence on a high voltage AC signal on the first input crossing a predetermined signal level. The signal level crossing detector may be single ended or differential.

    Abstract translation: 信号电平交叉检测器电路包括直流隔离器和检测器电路。 DC隔离器具有至少第一输入，其可操作以接收高压AC信号，以及至少第一电容器，第一电容器的第一板电连接到第一输入端。 检测器电路可在低电压下操作并且具有至少第一检测器输入，第一检测器输入电连接到第一电容器的第二板，低电压检测器电路可操作以依次提供输出信号的变化 在第一输入端上的高电压AC信号上穿过预定的信号电平。 信号电平交叉检测器可以是单端或差分。

    Package Having An Inner Shield And Method For Making The Same
    194.
    发明申请
    Package Having An Inner Shield And Method For Making The Same 有权
    内盾及其制作方法

    公开(公告)号：US20110090659A1

    公开(公告)日：2011-04-21

    申请号：US12856389

    申请日：2010-08-13

    Applicant: Kuo-Hsien Liao ,  Jian-Cheng Chen

    Inventor： Kuo-Hsien Liao ,  Jian-Cheng Chen

    IPC: H05K7/02 ,  H05K3/10

    CPC classification number: H05K9/0022 ,  H01L23/552 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/09972 ,  H05K2203/1316 ,  Y10T29/49146 ,  H01L2224/81

    Abstract: The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield. Therefore, the inner shield enables the electrical elements to have low electromagnetic interference and high electromagnetic compatibility.

    Abstract translation: 本发明涉及具有内屏蔽的封装及其制造方法。 封装包括基板，多个电气元件，模塑料，内护罩和保形罩。 电气元件设置在基板上。 模塑料被设置在基板的表面上，封装电气元件，并且包括至少一个凹槽。 凹槽穿过模制化合物的顶表面和底表面并且设置在电气元件之间，并且在凹槽的短边和模塑料的侧表面之间存在间隙。 内屏蔽件设置在凹槽中并电连接到基板。 共形屏蔽覆盖模塑料和基板的侧表面，并且电连接基板和内屏蔽。 因此，内部屏蔽使得电气元件具有低电磁干扰和高电磁兼容性。

    Print Circuit Board With High Insulated Region, Method Of Manufacturing Thereof, And Print Circuit Board Assembly Thereof
    195.
    发明申请
    Print Circuit Board With High Insulated Region, Method Of Manufacturing Thereof, And Print Circuit Board Assembly Thereof 有权
    具有高绝缘区域的印刷电路板，其制造方法及其印刷电路板组件

    公开(公告)号：US20110024163A1

    公开(公告)日：2011-02-03

    申请号：US12512029

    申请日：2009-07-30

    Applicant: Masaharu Goto ,  Minoru Uchida ,  Koji Tokuno

    Inventor： Masaharu Goto ,  Minoru Uchida ,  Koji Tokuno

    IPC: H05K1/05 ,  H05K3/00 ,  H05K1/11

    CPC classification number: H05K1/0256 ,  H05K1/181 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09972 ,  H05K2201/10166 ,  Y10T29/49155

    Abstract: A print circuit board includes: a first surface; a guard plane disposed on an inner layer; a high insulated region formed on the first surface of the board so as to be opposed to the guard plane, the high insulated region being substantially surrounded by one or more first guard patterns; and a quasi-high insulated region formed on the first surface of the board so as to be disposed adjacent to the high insulated region. The quasi-high insulated region is substantially surrounded by at least a part of the one or more first guard patterns and by one or more second guard patterns, in which the one or more first guard patterns and the one or more second guard patterns are each formed by forming one or more trenches in the first surface of the board so as to expose the guard plane on a bottom surface of the trenches.

    Abstract translation: 印刷电路板包括：第一表面; 设置在内层上的保护平面; 形成在所述基板的所述第一表面上以与所述保护平面相对的高绝缘区域，所述高绝缘区域基本上被一个或多个第一保护图案包围; 以及形成在所述基板的所述第一表面上以准备邻近所述高绝缘区域设置的准高绝缘区域。 准高绝缘区域基本上由一个或多个第一保护图案的至少一部分和一个或多个第二保护图案包围，其中一个或多个第一保护图案和一个或多个第二保护图案各自 通过在所述板的所述第一表面中形成一个或多个沟槽而形成，以便在所述沟槽的底表面上露出所述保护平面。

    AUDIO CIRCUIT BOARD
    196.
    发明申请
    AUDIO CIRCUIT BOARD 审中-公开
    音频电路板

    公开(公告)号：US20110013369A1

    公开(公告)日：2011-01-20

    申请号：US12607200

    申请日：2009-10-28

    Applicant: Wen-Cheng Lin

    Inventor： Wen-Cheng Lin

    IPC: H05K1/00 ,  H02H9/00

    CPC classification number: H05K1/0259 ,  H05K1/18 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663 ,  H05K2201/09972 ,  H05K2201/10022 ,  H05K2201/10189 ,  H05K2201/10446

    Abstract: An audio circuit board includes a main body, an audio connector, a digital ground loop, an analog ground portion and a moat. The main body includes an edge and a surface. The audio connector is disposed on one side of the main body and includes a fixing portion. The digital ground loop completely surrounds the edge of the main body. The audio connector is connected with the digital ground loop via the fixing portion. The analog ground portion is disposed on the surface of the main body and is disposed adjacent to the digital ground loop. The analog ground portion is separated from the main body via the moat.

    Abstract translation: 音频电路板包括主体，音频连接器，数字接地回路，模拟接地部分和护城河。 主体包括边缘和表面。 音频连接器设置在主体的一侧并且包括固定部分。 数字接地回路完全围绕主体的边缘。 音频连接器通过固定部分与数字接地回路连接。 模拟接地部分设置在主体的表面上并与数字接地回路相邻设置。 模拟接地部分经由护城河与主体分离。

    Metal core multi-LED SMD package and method of producing the same
    197.
    发明授权
    Metal core multi-LED SMD package and method of producing the same 失效
    金属芯多LED SMD封装及其制造方法

    公开(公告)号：US07868347B2

    公开(公告)日：2011-01-11

    申请号：US12404309

    申请日：2009-03-15

    Applicant: Lijun Cui

    Inventor： Lijun Cui

    IPC: H01L33/62

    CPC classification number: H05K3/202 ,  H01L33/486 ,  H01L2924/0002 ,  H05K3/06 ,  H05K2201/09118 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00

    Abstract: A new SMD (surface mount devices) package design for efficiently removing heat from LED Chip(s) is involved in this invention. Different from the regular SMD package, which electrical isolated materials like Alumina or AlN are used, the substrate material here is metal like Copper, Aluminum and so on. Also, different from regular design, which most time only has one LED chip inside, current design will at least have two or more LED chips (or chip groups) in one package. All chips are electrical connected via metal blocks, traces or wire-bond. This type of structure is generally fabricated via chemical etching and then filled with dielectric material inside to form a strong package. Because the thermal conductivity of the metal is much higher than the ceramics, the package thermal resistance is much lower than the ceramics based package. Also, the cost of the package is much lower than ceramics package. Moreover, emitting area in one package is much larger than the current arts.

    Abstract translation: 本发明涉及用于有效地从LED芯片去除热量的新的SMD（表面贴装器件）封装设计。 与常规SMD封装不同，使用了诸如氧化铝或AlN的电隔离材料，这里的基板材料是金属如铜，铝等。 此外，与常规设计不同的是，大多数时间内只有一个LED芯片，目前的设计将至少在一个封装中有两个或更多个LED芯片（或芯片组）。 所有芯片通过金属块，迹线或线接电连接。 这种类型的结构通常通过化学蚀刻制造，然后在其内填充介电材料以形成强封装。 由于金属的导热率远高于陶瓷，所以封装的热阻远低于陶瓷封装。 此外，封装的成本远低于陶瓷封装。 此外，一个封装中的发光面积远远大于当前的技术。

    ELECTRICAL JUNCTION BOX FOR VEHICLE
    198.
    发明申请
    ELECTRICAL JUNCTION BOX FOR VEHICLE 有权
    车用电接线盒

    公开(公告)号：US20100231038A1

    公开(公告)日：2010-09-16

    申请号：US12734230

    申请日：2008-05-27

    Applicant: Yoshiaki Sugimura ,  Tsuyoshi Hosono

    Inventor： Yoshiaki Sugimura ,  Tsuyoshi Hosono

    IPC: B60L1/00

    CPC classification number: H05K1/0263 ,  B60R16/0238 ,  B60R16/0239 ,  H05K2201/09972 ,  H05K2201/10053 ,  H05K2201/10303

    Abstract: An object of this invention is to provide an electrical junction box for a vehicle that can effectively restrain a control circuit from being subject to heat adverse effect from to a power distribution circuit, can downsize the whole structure, and can reduce the number of terminals for connecting the circuits to each other. The electrical junction box for a vehicle comprises a power distribution unit for constituting a part of the power distribution circuit, and a circuit board. A board body of the circuit board is divided into a power distribution circuit region Ap and a control circuit region Ac by a border line BL across the circuit board body. The control circuit is incorporated in the control circuit region Ac. The power distribution circuit region Ap is provided with a power distribution circuit having a current specification smaller than that of the power distribution circuit on the power distribution unit.

    Abstract translation: 本发明的目的在于提供一种可以有效地限制控制电路受到配电电路的热不利影响的用于车辆的电接线盒，能够实现整体结构的小型化，并且可以减少端子数量 将电路相互连接。 用于车辆的电接线盒包括用于构成配电电路的一部分的配电单元和电路板。 电路板的电路板主体通过跨越电路板主体的边界线BL被分成功率分配电路区域Ap和控制电路区域Ac。 控制电路并入控制电路区域Ac。 配电电路区域Ap具有电力规格小于配电单元上的配电电路的配电电路。

    PROCESS FOR MULTIPLE PLATINGS AND FINE ETCH ACCURACY ON THE SAME PRINTED WIRING BOARD
    199.
    发明申请
    PROCESS FOR MULTIPLE PLATINGS AND FINE ETCH ACCURACY ON THE SAME PRINTED WIRING BOARD 有权
    相同印刷线路上多种镀层的工艺和精密蚀刻精度

    公开(公告)号：US20100224586A1

    公开(公告)日：2010-09-09

    申请号：US12712430

    申请日：2010-02-25

    Applicant: John W. Hauff

    Inventor： John W. Hauff

    IPC: H01B13/00

    CPC classification number: H05K3/06 ,  H05K1/0237 ,  H05K1/0265 ,  H05K2201/0347 ,  H05K2201/0959 ,  H05K2201/09736 ,  H05K2201/09972 ,  H05K2203/1476

    Abstract: A process for manufacturing a printed wiring board includes specifying overlapping etches for a first portion of the printed wiring board and a second portion of the printed wiring board, the first portion of the printed wiring board having disposed thereon a printed circuit having at least one dimension critical to printed wiring board operation, etching a first conductor in the first portion of the printed wiring board when a first conductor thickness is a predetermined thickness, completing all plating steps, and etching a second conductor in the second portion of the printed wiring board.

    Abstract translation: 一种制造印刷电路板的方法，包括：对印刷电路板的第一部分和印刷线路板的第二部分进行重叠蚀刻，印刷线路板的第一部分设置有印刷电路，印刷电路具有至少一个尺寸 对印刷线路板操作至关重要，当第一导体厚度为预定厚度时，蚀刻印刷电路板的第一部分中的第一导体，完成所有电镀步骤，以及蚀刻印刷线路板的第二部分中的第二导体。

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