Abstract:
A signal level crossing detector circuit includes a DC isolator and a detector circuit. The DC isolator has at least a first input, which is operable to receive a high voltage AC signal, and at least a first capacitor, a first plate of the first capacitor being electrically connected to the first input. The detector circuit is operable at a low voltage and has at least a first detector input, the first detector input being electrically connected to a second plate of the first capacitor, the low voltage detector circuit being operable to provide a change in output signal in dependence on a high voltage AC signal on the first input crossing a predetermined signal level. The signal level crossing detector may be single ended or differential.
Abstract:
In the case where a chip is made of wide band gap semiconductor, a power conversion apparatus is obtained in which a component having a low heat resistant temperature is prevented from receiving thermal damage by heat generated at the chip. In a configuration including: a chip portion (20) including a chip (21) made of wide band gap semiconductor and a member (22, 23) having a heat resistant temperature equal to or higher than that of the chip (21); and a peripheral component (25) arranged in the vicinity of the chip portion (20) and having a heat resistant temperature lower than that of the chip (21). The chip (21) and the peripheral component (25) are thermally insulated from each other so that the temperature of the peripheral component (25) does not exceed the heat resistant temperature of the peripheral component (25).
Abstract:
Disclosed are a multi-layer flexible printed circuit board and a method for manufacturing the same. The multi-layer flexible printed circuit board includes an adhesion sheet from which a pressing and heating area is cut, an upper base layer, from which the pressing and heating area is cut, on the adhesion sheet, and a lower base layer under to the adhesion sheet.
Abstract:
The present invention relates to a package having an inner shield and a method for making the same. The package includes a substrate, a plurality of electrical elements, a molding compound, an inner shield and a conformal shield. The electrical elements are disposed on the substrate. The molding compound is disposed on a surface of the substrate, encapsulates the electrical elements, and includes at least one groove. The groove penetrates a top surface and a bottom surface of the molding compound and is disposed between the electrical elements, and there is a gap between a short side of the groove and a side surface of the molding compound. The inner shield is disposed in the groove and electrically connected to the substrate. The conformal shield covers the molding compound and a side surface of the substrate, and electrically connects the substrate and the inner shield. Therefore, the inner shield enables the electrical elements to have low electromagnetic interference and high electromagnetic compatibility.
Abstract:
A print circuit board includes: a first surface; a guard plane disposed on an inner layer; a high insulated region formed on the first surface of the board so as to be opposed to the guard plane, the high insulated region being substantially surrounded by one or more first guard patterns; and a quasi-high insulated region formed on the first surface of the board so as to be disposed adjacent to the high insulated region. The quasi-high insulated region is substantially surrounded by at least a part of the one or more first guard patterns and by one or more second guard patterns, in which the one or more first guard patterns and the one or more second guard patterns are each formed by forming one or more trenches in the first surface of the board so as to expose the guard plane on a bottom surface of the trenches.
Abstract:
An audio circuit board includes a main body, an audio connector, a digital ground loop, an analog ground portion and a moat. The main body includes an edge and a surface. The audio connector is disposed on one side of the main body and includes a fixing portion. The digital ground loop completely surrounds the edge of the main body. The audio connector is connected with the digital ground loop via the fixing portion. The analog ground portion is disposed on the surface of the main body and is disposed adjacent to the digital ground loop. The analog ground portion is separated from the main body via the moat.
Abstract:
A new SMD (surface mount devices) package design for efficiently removing heat from LED Chip(s) is involved in this invention. Different from the regular SMD package, which electrical isolated materials like Alumina or AlN are used, the substrate material here is metal like Copper, Aluminum and so on. Also, different from regular design, which most time only has one LED chip inside, current design will at least have two or more LED chips (or chip groups) in one package. All chips are electrical connected via metal blocks, traces or wire-bond. This type of structure is generally fabricated via chemical etching and then filled with dielectric material inside to form a strong package. Because the thermal conductivity of the metal is much higher than the ceramics, the package thermal resistance is much lower than the ceramics based package. Also, the cost of the package is much lower than ceramics package. Moreover, emitting area in one package is much larger than the current arts.
Abstract:
An object of this invention is to provide an electrical junction box for a vehicle that can effectively restrain a control circuit from being subject to heat adverse effect from to a power distribution circuit, can downsize the whole structure, and can reduce the number of terminals for connecting the circuits to each other. The electrical junction box for a vehicle comprises a power distribution unit for constituting a part of the power distribution circuit, and a circuit board. A board body of the circuit board is divided into a power distribution circuit region Ap and a control circuit region Ac by a border line BL across the circuit board body. The control circuit is incorporated in the control circuit region Ac. The power distribution circuit region Ap is provided with a power distribution circuit having a current specification smaller than that of the power distribution circuit on the power distribution unit.
Abstract:
A process for manufacturing a printed wiring board includes specifying overlapping etches for a first portion of the printed wiring board and a second portion of the printed wiring board, the first portion of the printed wiring board having disposed thereon a printed circuit having at least one dimension critical to printed wiring board operation, etching a first conductor in the first portion of the printed wiring board when a first conductor thickness is a predetermined thickness, completing all plating steps, and etching a second conductor in the second portion of the printed wiring board.
Abstract:
An egress lighting system which utilizes an efficient primary and emergency light source and complies with the NEC standards for emergency egress lighting. This invention combines two sets of LEDs onto a single circuit board to provide primary lighting and secondary emergency egress lighting while keeping the circuits of the primary and secondary lighting electrically separate or isolated.