公开(公告)号：US07560051B2

公开(公告)日：2009-07-14

申请号：US11373909

申请日：2006-03-14

Applicant: Masahiro Furusawa ,  Rumi Shinagawa ,  Toshimi Fukui ,  Junko Nakamoto ,  Kuninori Obata

Inventor： Masahiro Furusawa ,  Rumi Shinagawa ,  Toshimi Fukui ,  Junko Nakamoto ,  Kuninori Obata

IPC: H01B1/22

CPC classification number: H01B1/22 ,  C09D5/24 ,  C23C24/08 ,  C23C26/00 ,  H05K1/097 ,  H05K2201/0224 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/31678

Abstract: A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compound.

Abstract translation: 金属颗粒分散液包括：包含硫原子的化合物; 直径范围为1〜100nm的金属颗粒，由含有贵金属材料的材料构成; 和分散介质。 金属颗粒被化合物覆盖。

公开(公告)号：US20090166396A1

公开(公告)日：2009-07-02

申请号：US11966943

申请日：2007-12-28

Applicant: Lakshmi SUPRIYA ,  Ravi NALLA

Inventor： Lakshmi SUPRIYA ,  Ravi NALLA

IPC: B23K31/02

CPC classification number: B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11009 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/13155 ,  H01L2224/1316 ,  H01L2224/13186 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K1/111 ,  H05K3/3478 ,  H05K2201/0224 ,  H05K2201/083 ,  H05K2201/09036 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0776 ,  H05K2203/104 ,  H05K2203/105 ,  H01L2924/05381 ,  H01L2924/01027 ,  H01L2224/13099 ,  H01L2224/05599

Abstract: Electronic devices and methods for fabricating electronic devices are described. One method includes providing a substrate with a plurality of bonding pads thereon, and providing a plurality of solder microballs, the microballs including a coating thereon. The method also includes flowing the solder microballs onto the substrate and positioning the solder microballs on the bonding pads. The method also includes heating the solder microballs to reflow and form a joint between the solder microballs and the bonding pads. Other embodiments are described and claimed.

Abstract translation: 描述了用于制造电子设备的电子设备和方法。 一种方法包括在其上提供具有多个接合焊盘的基板，并且提供多个焊料微球，所述微球包括其上的涂层。 该方法还包括将焊料微球流到衬底上并将焊料微球定位在焊盘上。 该方法还包括加热焊料微球以回流并形成焊料微球和焊盘之间的接头。 描述和要求保护其他实施例。

公开(公告)号：US20090161328A1

公开(公告)日：2009-06-25

申请号：US12096446

申请日：2007-09-13

Applicant: Tadahiko Sakai ,  Hideki Eifuku ,  Kouji Motomura

Inventor： Tadahiko Sakai ,  Hideki Eifuku ,  Kouji Motomura

IPC: H05K7/00 ,  B23K35/363 ,  B23K31/02

CPC classification number: H05K3/323 ,  B23K35/365 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29486 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83855 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K2201/0224 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/0425 ,  H01L2924/00 ,  H01L2224/29311 ,  H01L2224/81805 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An object is to provide an electronic components mounting adhesive capable of lowering the probability of occurrence of short-circuiting and increasing the reliability of the joining of electrodes in an electronic components mounted structure obtained by bonding electronic components to each other, as well as a manufacturing method of such an electronic components mounting adhesive, a resulting electronic component mounted structure, and a manufacturing method of such an electronic component mounted structure.In an electronic components mounted structure 10, a first circuit board 11 and a second circuit board 13 are bonded to each other with an electronic components mounting adhesive 20. The electronic components mounting adhesive 20 is such that solder particles 22 are dispersed in a thermosetting resin 21. The solder particles 22 are subjected to heating treatment in an oxygen-containing atmosphere before being dispersed in the thermosetting resin 21. Electrodes 12 of the first circuit board 11 and electrodes 14 of the second circuit board 13 are electrically connected to each other by solder particles 22 that are sandwiched between the electrodes 12 and 14 and their surface oxide films 22a are thereby broken.

Abstract translation: 本发明的目的是提供一种能够降低短路发​​生的可能性的电子部件安装胶粘剂，并且通过将电子部件彼此粘合而获得的电子部件安装结构中的电极的接合的可靠性提高， 这种电子部件安装粘合剂的方法，所得到的电子部件安装结构以及这种电子部件安装结构的制造方法。 在电子部件安装结构体10中，第一电路基板11和第二电路基板13通过电子部件安装用粘合剂20彼此接合。电子部件安装用粘合剂20使得焊料粒子22分散在热固性树脂 焊料颗粒22在分散在热固性树脂21中之前在含氧气氛中进行加热处理。第一电路板11的电极12和第二电路板13的电极14通过 被夹在电极12和14之间的焊料颗粒22及其表面氧化膜22a被破坏。

公开(公告)号：US07492434B2

公开(公告)日：2009-02-17

申请号：US11462112

申请日：2006-08-03

Applicant: Kiyofumi Kudo ,  Futoshi Nakanishi

Inventor： Kiyofumi Kudo ,  Futoshi Nakanishi

IPC: G02F1/1345

CPC classification number: H05K3/323 ,  G02F1/13452 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/13016 ,  H01L2224/2929 ,  H01L2224/29355 ,  H01L2224/2939 ,  H01L2224/29399 ,  H01L2224/81903 ,  H01L2224/838 ,  H01L2224/83851 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K3/361 ,  H05K2201/0224 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A liquid crystal display (LCD) device includes a LCD panel and a flexible wiring member coupled together by an anisotropic-conductive adhesive film (ACF). The ACF includes insulating resin and a plurality of conductive particles dispersed therein and each having an insulating film on a conductive body. The insulating film is broken by the thermal compression of the ACF during manufacture of the LCD device, thereby allowing terminals of the LCD panel and terminals of the flexible wiring member to be electrically coupled together.

Abstract translation: 液晶显示器（LCD）装置包括LCD面板和通过各向异性导电粘合膜（ACF）连接在一起的柔性布线构件。 ACF包括绝缘树脂和分散在其中的多个导电颗粒，并且每个在导电体上具有绝缘膜。 在LCD装置的制造过程中，ACF的热压缩使绝缘膜断裂，从而使LCD面板的端子和柔性布线构件的端子电连接在一起。

公开(公告)号：US20090016924A1

公开(公告)日：2009-01-15

申请号：US12155674

申请日：2008-06-06

Applicant: Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppa

Inventor： Mark Allen ,  Tomi Mattila ,  Ari Alastalo ,  Heikki Seppa

IPC: B22F7/08 ,  B22F3/105

CPC classification number: H05K3/02 ,  H05K3/105 ,  H05K3/1266 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/0117 ,  H05K2203/0121 ,  H05K2203/0143 ,  H05K2203/0517 ,  H05K2203/105 ,  H05K2203/1131 ,  H05K2203/1545

Abstract: This publication discloses a method and apparatus for functionalizing nanoparticle systems. The method comprises treating a nanoparticle-containing layer so as to produce a pattern of structurally transformed zones, the treatment comprising applying an electric field through the nanoparticle layer. According to the invention an AC-field capacitively coupled to the nanoparticle-containing layer is used as said electric field. The treatment preferably results in at least partly sintered structures, which can be used as conductors, for example. The document discloses several realizations for utilization of the disclosed functionalization in mass-fabrication lines.

Abstract translation: 该出版物公开了一种功能化纳米粒子体系的方法和装置。 该方法包括处理含纳米颗粒的层以产生结构转化区的图案，该处理包括通过纳米颗粒层施加电场。 根据本发明，使用电容耦合到含纳米粒子层的AC场作为所述电场。 处理优选地导致例如至少部分烧结的结构，其可以用作导体。 该文献公开了在批量生产线中利用所公开的功能化的几种实现。

公开(公告)号：US20090014821A1

公开(公告)日：2009-01-15

申请号：US12155669

申请日：2008-06-06

Applicant: Tomi Mattila ,  Ari Alastalo ,  Mark Allen ,  Heikki Seppa

Inventor： Tomi Mattila ,  Ari Alastalo ,  Mark Allen ,  Heikki Seppa

IPC: H01L29/66 ,  H05K3/02 ,  G01R27/08 ,  H01L21/00

CPC classification number: H05K3/105 ,  B81C1/00031 ,  H01L2924/0002 ,  H05K1/095 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/105 ,  Y10S977/762 ,  Y10S977/773 ,  Y10T29/49156 ,  H01L2924/00

Abstract: This publication discloses a method for forming electrically conducting structures on a substrate. According to the method nanoparticles containing conducting or semiconducting material are applied on the substrate in a dense formation and a voltage is applied over the nanoparticles so as to at least locally increase the conductivity of the formation. According to the invention, the voltage is high enough to cause melting of the nanoparticles in a breakthrough-like manner. With the aid of the invention, small-linewidth structures can be created without high-precision lithography.

Abstract translation: 该出版物公开了一种在衬底上形成导电结构的方法。 根据该方法，将含有导电或半导体材料的纳米颗粒以密集地层施加在基底上，并且在纳米颗粒上施加电压，以便至少局部地增加地层的导电性。 根据本发明，电压足够高以使纳米颗粒以类似突破的方式熔化。 借助于本发明，可以在没有高精度光刻的情况下创建小线宽结构。

公开(公告)号：US20080173398A1

公开(公告)日：2008-07-24

申请号：US11964827

申请日：2007-12-27

Applicant: Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

Inventor： Yusuke Yasuda ,  Toshiaki Morita ,  Eiichi Ide ,  Hiroshi Hozoji ,  Toshiaki Ishii

IPC: B32B5/16 ,  B29C65/02

CPC classification number: H05K3/321 ,  B22F1/0014 ,  B22F1/0062 ,  B22F3/14 ,  B22F2003/145 ,  B23K35/22 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29007 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/2936 ,  H01L2224/29364 ,  H01L2224/29366 ,  H01L2224/29369 ,  H01L2224/29371 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/3754 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/84801 ,  H01L2224/85205 ,  H01L2224/8584 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/2076 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/12028 ,  Y10T428/12181 ,  Y10T428/2991 ,  Y10T428/8305 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/83205 ,  H01L2924/00012

Abstract: A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material.

Abstract translation: 包含涂覆有碳原子数为2〜8的有机物质的金属粒子的接合材料，其中所述金属粒子包含100nm以下的第一部分，大于100nm但不大于100μm的第二部分， 基于体积基数具有至少峰值分布的部分。 本公开还涉及使用接合材料的接合方法。

公开(公告)号：US20080131685A1

公开(公告)日：2008-06-05

申请号：US11939538

申请日：2007-11-13

Applicant: Sang-Soo LEE ,  Jun-Kyung Kim ,  Hae-Eun Jung ,  Min Park ,  Soon-Ho Lim ,  Hyun-Jung Lee

Inventor： Sang-Soo LEE ,  Jun-Kyung Kim ,  Hae-Eun Jung ,  Min Park ,  Soon-Ho Lim ,  Hyun-Jung Lee

IPC: B32B5/16

CPC classification number: H01B1/22 ,  H05K3/323 ,  H05K2201/0224 ,  H05K2203/1163 ,  Y10T428/254 ,  Y10T428/2989

Abstract: The present invention relates to a microcapsule-conductive particle complex comprising a conductive particle consisting of conductive metallic particle or polymer particle coated on a surface with a conductive metallic layer; a microcapsule being adsorbed by the conductive particle or adsorbing the conductive particle, comprising a core and a shell, wherein the core contains organic compound which is a curing agent for a fast curing at a low temperature and the shell has a surface functional group with affinity for metal of the conductive metallic layer on its surface, a preparation method thereof and an anisotropic conductive film (ACF) using the same.

Abstract translation: 本发明涉及一种微胶囊导电颗粒复合体，其包含由导电金属颗粒或涂覆在具有导电金属层的表面上的聚合物颗粒组成的导电颗粒; 微胶囊被导电颗粒吸附或吸附导电颗粒，包括芯和壳，其中芯包含作为在低温下快速固化的固化剂的有机化合物，并且壳具有亲和力的表面官能团 其表面上的导电金属层的金属，其制备方法和使用其的各向异性导电膜（ACF）。

公开(公告)号：US20080093019A1

公开(公告)日：2008-04-24

申请号：US11960034

申请日：2007-12-19

Applicant: Chad Cobbley ,  Steve Heppler

Inventor： Chad Cobbley ,  Steve Heppler

IPC: B29C65/52

CPC classification number: H05K3/323 ,  C08K7/16 ,  C08K9/00 ,  C09J5/00 ,  C09J9/02 ,  C09J11/08 ,  C09J2205/11 ,  H01R4/04 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2203/0278 ,  H05K2203/1163 ,  Y10T428/25 ,  Y10T428/263 ,  Y10T428/2982 ,  Y10T428/2989 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: An anisotropic electrically conducting interconnect is disclosed in which an adhesive comprising particles having a breakable coating of at least one electrically nonconductive material is compressed between a first contact and a second contact. Compression to two contacts breaks the breakable coating exposing an electrically conducting material which makes contact with the first and second contacts. The electrically conducting material may be a metal conductor or a two-part reactive conductive resin/catalyst system. Also disclosed are processes for making such electrical interconnects and adhesives for use in making electrical interconnect.

Abstract translation: 公开了一种各向异性导电互连件，其中包含具有至少一种非导电材料的可破坏涂层的颗粒的粘合剂在第一接触和第二接触之间被压缩。 对两个触点的压缩使可破坏的涂层暴露出与第一和第二触点接触的导电材料。 导电材料可以是金属导体或两部分反应性导电树脂/催化剂体系。 还公开了用于制造用于制造电互连的这种电互连和粘合剂的方法。

公开(公告)号：US20080081275A1

公开(公告)日：2008-04-03

申请号：US10575662

申请日：2004-09-15

Applicant: Kiyoko Ueda ,  Ichiro Nakamura ,  Kiyoyasu Sakurada

Inventor： Kiyoko Ueda ,  Ichiro Nakamura ,  Kiyoyasu Sakurada

IPC: G03G5/00 ,  G03G9/00

CPC classification number: H05K3/102 ,  C08F292/00 ,  H05K2201/0224 ,  Y10T428/29 ,  Y10T428/2982

Abstract: A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.

Abstract translation: 制造树脂涂覆的金属颗粒的方法包括用二氧化硅涂覆金属颗粒的表面; 使可聚合基团通过使用硅烷偶联剂吸附在二氧化硅被覆颗粒的表面上; 并且通过混合吸附有可聚合基团的颗粒，可聚合单体，聚合引发剂和分散剂，用聚合物树脂涂覆二氧化硅涂覆的颗粒的表面以聚合可聚合单体和可聚合基团。