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58 条记录 (耗时 0.027 秒)

    Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials
    21.
    发明申请
    Print Processing for Patterned Conductor, Semiconductor and Dielectric Materials 有权
    图案导体，半导体和电介质材料的印刷加工

    公开(公告)号：US20090065776A1

    公开(公告)日：2009-03-12

    申请号：US12114741

    申请日：2008-05-02

    申请人： Erik SCHER ,  Steven Molesa ,  Joerg Rockenberger ,  Arvind Kamath ,  Ikuo Mori

    发明人： Erik SCHER ,  Steven Molesa ,  Joerg Rockenberger ,  Arvind Kamath ,  Ikuo Mori

    IPC分类号： H01L29/04 ,  C08L83/00 ,  H01L29/06 ,  H01L29/16 ,  H01L21/208

    CPC分类号： C09D5/24 ,  C09D11/101 ,  C09D11/322 ,  C09D11/36 ,  C09D11/54 ,  H01B3/02 ,  H01L21/02532 ,  H01L21/02601 ,  H01L21/02628 ,  H01L21/28008 ,  H01L27/1292 ,  H01L29/6675 ,  H01L29/78696 ,  Y10T428/24802

    摘要： Embodiments relate to printing features from an ink containing a material precursor. In some embodiments, the material includes an electrically active material, such as a semiconductor, a metal, or a combination thereof. In another embodiment, the material includes a dielectric. The embodiments provide improved printing process conditions that allow for more precise control of the shape, profile and dimensions of a printed line or other feature. The composition(s) and/or method(s) improve control of pinning by increasing the viscosity and mass loading of components in the ink. An exemplary method thus includes printing an ink comprising a material precursor and a solvent in a pattern on the substrate; precipitating the precursor in the pattern to form a pinning line; substantially evaporating the solvent to form a feature of the material precursor defined by the pinning line; and converting the material precursor to the patterned material.

    摘要翻译： 实施例涉及从含有材​​料前体的油墨印刷特征。 在一些实施例中，材料包括电活性材料，例如半导体，金属或其组合。 在另一个实施例中，该材料包括电介质。 这些实施例提供改进的印刷工艺条件，其允许更精确地控制印刷线或其它特征的形状，轮廓和尺寸。 组合物和/或方法通过增加油墨中组分的粘度和质量负载来改善对钉扎的控制。 因此，示例性方法包括在基板上以图案印刷包含材料前体和溶剂的油墨; 以图案沉淀前体以形成钉扎线; 基本上蒸发溶剂以形成由钉扎线限定的材料前体的特征; 并将材料前体转化成图案化材料。

    Metal Inks, Methods of Making the Same, and Methods for Printing and/or Forming Metal Films
    22.
    发明申请
    Metal Inks, Methods of Making the Same, and Methods for Printing and/or Forming Metal Films 有权
    金属油墨，其制造方法以及印刷和/或形成金属膜的方法

    公开(公告)号：US20090004370A1

    公开(公告)日：2009-01-01

    申请号：US12131002

    申请日：2008-05-30

    申请人： Fabio ZURCHER ,  Aditi Chandra ,  Wenzhuo Guo ,  Erik Scher ,  Mao Takashima ,  Joerg Rockenberger

    发明人： Fabio ZURCHER ,  Aditi Chandra ,  Wenzhuo Guo ,  Erik Scher ,  Mao Takashima ,  Joerg Rockenberger

    IPC分类号： B05D5/12 ,  C09D11/02 ,  C09D1/00 ,  B05D5/00

    CPC分类号： C23C18/1692 ,  B41M3/006 ,  C08K3/10 ,  C09D7/61 ,  C09D11/38 ,  C23C18/1608 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1658 ,  C23C18/31 ,  C23C18/44

    摘要： Printable metal formulations, methods of making the formulations, and methods of coating or printing thin films from metal ink precursors are disclosed. The metal formulation generally includes one or more Group 4, 5, 6, 7, 8, 9, 10, 11, or 12 metal salts or metal complexes, one or more solvents adapted to facilitate coating and/or printing of the formulation, and one or more optional additives that form (only) gaseous or volatile byproducts upon reduction of the metal salt or metal complex to an elemental metal and/or alloy thereof. The formulation may be made by combining the metal salt(s) or metal complex(es) and the solvent(s), and dissolving the metal salt(s) or metal complex(es) in the solvent(s) to form the formulation. Thin films may be made by coating or printing the metal formulation on a substrate; removing the solvents to form a metal-containing precursor film; and reducing the metal-containing precursor film.

    摘要翻译： 公开了可印刷金属配方，制备方法，以及从金属油墨前体涂布或印刷薄膜的方法。 金属配方通常包括一种或多种组合物4,5,6,7,8,9,10,11或12金属盐或金属配合物，一种或多种适于促进制剂涂布和/或印刷的溶剂，以及 一种或多种任选的添加剂，其在将金属盐或金属络合物还原成元素金属和/或其合金时形成（仅）气态或挥发性副产物。 制剂可以通过将金属盐或金属络合物和溶剂组合，并将金属盐或金属络合物溶解在溶剂中来形成制剂， 。 薄膜可以通过在基底上涂覆或印刷金属制剂来制备; 除去溶剂以形成含金属的前体膜; 并还原含金属的前体膜。

    PRINTING OF CONTACT METAL AND INTERCONNECT METAL VIA SEED PRINTING AND PLATING
    30.
    发明申请
    PRINTING OF CONTACT METAL AND INTERCONNECT METAL VIA SEED PRINTING AND PLATING 有权
    通过种子印刷和镀层印刷接触金属和互连金属

    公开(公告)号：US20090020829A1

    公开(公告)日：2009-01-22

    申请号：US12175450

    申请日：2008-07-17

    申请人： Aditi CHANDRA ,  Arvind KAMATH ,  James Montague CLEEVES ,  Joerg ROCKENBERGER ,  Mao Takashima ,  Erik SCHER

    发明人： Aditi CHANDRA ,  Arvind KAMATH ,  James Montague CLEEVES ,  Joerg ROCKENBERGER ,  Mao Takashima ,  Erik SCHER

    IPC分类号： H01L21/768 ,  H01L21/28 ,  H01L29/78

    CPC分类号： H01L21/288 ,  H01L21/28518 ,  H01L21/32051 ,  H01L21/32053 ,  H01L21/76838 ,  H01L21/76873 ,  H01L21/76895 ,  H01L27/1285 ,  H01L27/1292 ,  H01L29/458 ,  H01L29/78618 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Methods of forming contacts (and optionally, local interconnects) using an ink comprising a silicide-forming metal, electrical devices such as diodes and/or transistors including such contacts and (optional) local interconnects, and methods for forming such devices are disclosed. The method of forming contacts includes depositing an ink of a silicide-forming metal onto an exposed silicon surface, drying the ink to form a silicide-forming metal precursor, and heating the silicide-forming metal precursor and the silicon surface to form a metal silicide contact. Optionally, the metal precursor ink may be selectively deposited onto a dielectric layer adjacent to the exposed silicon surface to form a metal-containing interconnect. Furthermore, one or more bulk conductive metal(s) may be deposited on remaining metal precursor ink and/or the dielectric layer. Electrical devices, such as diodes and transistors may be made using such printed contact and/or local interconnects. A metal ink may be printed for contacts as well as for local interconnects at the same time, or in the alternative, the printed metal can act as a seed for electroless deposition of other metals if different metals are desired for the contact and the interconnect lines. This approach advantageously reduces the number of processing steps and does not necessarily require any etching.

    摘要翻译： 公开了使用包含硅化物形成金属的油墨形成触点（和任选的局部互连）的方法，诸如二极管和/或包括这种触点的晶体管的电气器件，（可选的）局部互连）以及用于形成这种器件的方法。 形成接触的方法包括将硅化物形成金属的油墨沉积到暴露的硅表面上，干燥油墨以形成形成硅化物的金属前体，以及加热形成硅化物的金属前体和硅表面以形成金属硅化物 联系。 任选地，可以将金属前体油墨选择性地沉积到与暴露的硅表面相邻的电介质层上，以形成含金属互连。 此外，一个或多个体导电金属可以沉积在剩余的金属前体油墨和/或介电层上。 可以使用这种印刷的接触和/或局部互连来制造电子器件，例如二极管和晶体管。 金属墨水可以同时印刷以用于接触以及局部互连，或者替代地，如果需要用于接触和互连线的不同金属，印刷金属可以用作其它金属的无电沉积的种子 。 这种方法有利地减少了处理步骤的数量，并且不一定需要任何蚀刻。