公开(公告)号：US08611493B2

公开(公告)日：2013-12-17

申请号：US13174058

申请日：2011-06-30

Applicant: Kiyoshi Hasegawa ,  Yutaka Ikku ,  Hideki Takiguchi

Inventor： Kiyoshi Hasegawa ,  Yutaka Ikku ,  Hideki Takiguchi

IPC: G01N23/223

CPC classification number: G01N23/223 ,  G01N2223/076

Abstract: The X-ray fluorescence analyzer (100) includes: an enclosure (10); a door (20) for putting the sample into and out of the enclosure; a height measurement mechanism (7) capable of measuring a height at the irradiation point; a moving mechanism control unit (9) for adjusting a distance between the sample and the radiation source as well as the X-ray detector based on the measured height at the irradiation point; a laser unit (7) for irradiating the irradiation point with a visible light laser beam; a laser start control unit (9) for irradiating the visible light laser beam by the laser unit (7) when the door is open state; and a height measurement mechanism start control unit (9) for starting the height measurement mechanism to measure the height at the irradiation point when the door is opened.

Abstract translation: X射线荧光分析仪（100）包括：外壳（10）; 用于将样品放入和离开外壳的门（20）; 能够测量照射点的高度的高度测量机构（7） 移动机构控制单元，用于根据所述照射点处的测量高度来调整所述样本和所述辐射源之间的距离以及所述X射线检测器; 用于用可见光激光束照射所述照射点的激光单元（7）; 激光启动控制单元（9），用于当所述门处于打开状态时，通过所述激光单元（7）照射所述可见光激光束; 以及高度测量机构启动控制单元（9），用于启动高度测量机构以测量门打开时的照射点处的高度。

公开(公告)号：US08426742B2

公开(公告)日：2013-04-23

申请号：US12597835

申请日：2008-04-23

Applicant: Yoshinori Ejiri ,  Shuichi Hatakeyama ,  Shigeharu Arike ,  Kiyoshi Hasegawa

Inventor： Yoshinori Ejiri ,  Shuichi Hatakeyama ,  Shigeharu Arike ,  Kiyoshi Hasegawa

IPC: H01L23/498 ,  H01L21/60 ,  H01B1/02

CPC classification number: C23C18/1651 ,  C23C18/1837 ,  C23C18/42 ,  C23C18/54 ,  H01L21/4846 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/97 ,  H01L2223/54426 ,  H01L2223/5446 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/244 ,  H05K2203/072 ,  H05K2203/073 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2924/20752 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2224/0401

Abstract: The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer.

Abstract translation: 通过将导电层，无电解镀镍膜，作为99质量％以下的位错或无电解镀钯膜的第一钯镀膜连接的端子，可以提高具有位移镀金膜的连接端子的连接可靠性，或者 更优选为纯度为90质量％以上且99质量％以下的化学镀钯膜的第二镀钯膜，以及置换镀金膜，其中，化学镀镍膜，第一钯镀层 膜，第二钯电镀膜和置换镀金膜在导电层的一侧依次层叠，位移镀金膜位于与导电层相反一侧的最上层。

公开(公告)号：US20120094063A1

公开(公告)日：2012-04-19

申请号：US13378621

申请日：2010-05-26

Applicant: Kiyoshi Hasegawa ,  Shuuji Adachi ,  Mitsuo Uchiyama ,  Yoshirou Noguchi ,  Takahiro Iwasaki ,  Kimio Nishimura

Inventor： Kiyoshi Hasegawa ,  Shuuji Adachi ,  Mitsuo Uchiyama ,  Yoshirou Noguchi ,  Takahiro Iwasaki ,  Kimio Nishimura

IPC: B32B3/30 ,  B23K26/00 ,  B23H1/04 ,  B32B3/10

CPC classification number: C23C4/02 ,  B23B41/12 ,  B23H9/008 ,  B23K26/0093 ,  B23K26/3584 ,  B23K26/364 ,  F02F1/00 ,  F05C2253/12 ,  Y10T428/24281 ,  Y10T428/2457

Abstract: A boring cutter body (5) is inserted into a circular hole (3) and is rotated and moved in an axial direction, whereby screw-shaped groove parts (11) are formed by using a tool bit (9) provided on a tip end of an outer peripheral portion, and broken surfaces (15) are formed by breaking tips of ridge parts generated by formation of the groove parts (11). Moreover, the groove parts (11) are processed through electric discharge machining using a wire electrode (17) provided to the boring cutter body (5) behind the tool bit (9) in the rotating direction, thereby forming finely roughened portions (41) having more finely roughened shapes than the broken surfaces (15).

Abstract translation: 将钻头（5）插入圆孔（3）中并沿轴向转动和移动，由此通过使用设置在尖端（3）上的工具钻头（9）形成螺旋形槽部分（11） 的外周部分，并且通过破坏通过形成槽部（11）而产生的脊部的尖端而形成断裂面（15）。 此外，通过使用在工具钻头（9）的旋转方向上设置在镗刀体（5）上的线电极（17）通过放电加工来对槽部（11）进行加工，从而形成细小的粗糙部（41） 具有比破碎表面（15）更细的粗糙的形状。

公开(公告)号：US20090307632A1

公开(公告)日：2009-12-10

申请号：US12455267

申请日：2009-05-29

Applicant: Kiyoshi Hasegawa ,  Yuri Takegami ,  Taiki Hori

Inventor： Kiyoshi Hasegawa ,  Yuri Takegami ,  Taiki Hori

IPC: G06F3/048

CPC classification number: G06F1/1671 ,  G06F1/1616 ,  G06F3/0238 ,  G06F3/04817 ,  G06F3/0486 ,  G06F3/0489 ,  H04M1/7258

Abstract: An electronic apparatus includes a display portion, a plurality of first buttons, a second button, and a display controller. The display portion displays a screen. The plurality of first buttons are disposed along an outer circumference of the screen. The display controller displays icons representing functions of the plurality of first buttons at positions respectively corresponding to the plurality of first buttons along an inner circumference of the screen, and changes the functions allocated to the plurality of first buttons and the displayed icons in accordance with a press of the second button.

Abstract translation: 电子设备包括显示部分，多个第一按钮，第二按钮和显示控制器。 显示部显示画面。 多个第一按钮沿着屏幕的外周设置。 显示控制器在屏幕的内圆周上显示表示多个第一按钮的功能的图标，并且分别对应于多个第一按钮的位置分别对应于多个第一按钮，并根据 按第二个按钮。

公开(公告)号：US07413498B2

公开(公告)日：2008-08-19

申请号：US10772593

申请日：2004-02-06

Applicant: Masahiro Omata ,  Masahiko Iizumi ,  Kiyoshi Hasegawa ,  Takashi Ogino ,  Tomohiro Kondo ,  Kazuo Takeda ,  Takafumi Watanabe ,  Yoshiyuki Chida ,  Yasushi Matsushita

Inventor： Masahiro Omata ,  Masahiko Iizumi ,  Kiyoshi Hasegawa ,  Takashi Ogino ,  Tomohiro Kondo ,  Kazuo Takeda ,  Takafumi Watanabe ,  Yoshiyuki Chida ,  Yasushi Matsushita

IPC: B24B49/00 ,  B24B21/00 ,  B24B21/18

CPC classification number: B24B19/12 ,  B24B5/42 ,  B24B21/00 ,  B24B53/007

Abstract: A film feeder (FF1) feeds a film (1), a first drive (20) rotates a work (W), a second drive (30) moves the work (W) relative to the film (1), a shoe set handler (40) handles the shoe set (2) to press the film (1) against the work (W), and a deterioration delayer (C) is configured to delay an abrasivity deterioration of the film (1).

Abstract translation: 胶片馈送器（FF 1）馈送胶片（1），第一驱动器（20）旋转工件（W），第二驱动器（30）相对于胶片（1）移动工件（W） 处理器（40）处理鞋套（2）以将薄膜（1）压靠在工件（W）上，劣化延迟器（C）构造成延迟薄膜（1）的磨损性劣化。

公开(公告)号：US20070190272A1

公开(公告)日：2007-08-16

申请号：US11702060

申请日：2007-02-05

Applicant: Koichi Kanai ,  Kiyokazu Sugiyama ,  Eiji Shiotani ,  Kimio Nishimura ,  Junichi Uchiyama ,  Kiyohisa Suzuki ,  Jun Inomata ,  Daisuke Tearada ,  Akira Shimizu ,  Hidenobu Matsuyama ,  Kiyoshi Hasegawa ,  Takashi Iiya

Inventor： Koichi Kanai ,  Kiyokazu Sugiyama ,  Eiji Shiotani ,  Kimio Nishimura ,  Junichi Uchiyama ,  Kiyohisa Suzuki ,  Jun Inomata ,  Daisuke Tearada ,  Akira Shimizu ,  Hidenobu Matsuyama ,  Kiyoshi Hasegawa ,  Takashi Iiya

IPC: B05D1/08 ,  B05D1/40 ,  B31B45/00

CPC classification number: C23C4/12 ,  B05B7/224 ,  B05B13/0636 ,  C23C4/129 ,  C23C4/16 ,  C23C4/18 ,  F02F1/00 ,  F05C2253/12 ,  Y10T29/49272 ,  Y10T428/13

Abstract: A thermally sprayed coating is deposited onto a cylindrical internal surface of a base member after a rough surface has been formed on the cylindrical internal surface. The tapered surface is configured such that the internal diameter of the axial end portion is larger than the internal diameter of the remaining portions of the cylinder bore internal surface. After the tapered surface is formed, the thermally sprayed coating is honed. This method prevents exfoliation of a thermally sprayed coating at an end portion of a cylindrical internal surface in a situation where honing or another mechanical finishing process is applied to the thermally sprayed coating after the coating is formed on the cylindrical internal surface.

Abstract translation: 在圆柱形内表面上形成粗糙表面之后，将热喷涂层沉积在基底构件的圆柱形内表面上。 锥形表面被构造成使得轴向端部的内径大于缸孔内表面的其余部分的内径。 在形成锥形表面之后，热喷涂的涂层被磨削。 在圆筒形内表面上形成涂层之后，在将珩磨或其他机械精加工施加到喷镀涂层的情况下，该方法可防止圆柱形内表面的端部处的热喷涂层的剥离。

公开(公告)号：US06677219B2

公开(公告)日：2004-01-13

申请号：US09917712

申请日：2001-07-31

Applicant: Kiyoshi Hasegawa ,  Fumihiko Ooka

Inventor： Kiyoshi Hasegawa ,  Fumihiko Ooka

IPC: H01L2130

CPC classification number: H01L24/06 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract translation: 半导体封装包括具有主表面的半导体芯片和在主表面上形成的第一焊盘。 半导体封装还包括具有（a）相对的第一和第二主表面的封装衬底，（b）在第一和第二主表面之间延伸的侧表面，（c）与侧表面相邻并沿着侧表面的焊盘形成区域（ d）形成在焊盘形成区域上的第二焊盘，（e）形成在封装基板的第一主表面上的外部电极，其中封装基板的第二主表面固定到半导体芯片的主表面，并且其中 外部电极电连接到第二焊盘。 半导体封装还包括将第一焊盘电连接到第二焊盘的接合线和覆盖接合线以及第一和第二焊盘的密封材料。

公开(公告)号：US06622685B2

公开(公告)日：2003-09-23

申请号：US10181052

申请日：2002-07-12

Applicant: Hideo Takahashi ,  Minoru Chuubachi ,  Kiyoshi Hasegawa

Inventor： Hideo Takahashi ,  Minoru Chuubachi ,  Kiyoshi Hasegawa

IPC: F02F100

CPC classification number: F16J10/04 ,  C23C4/02 ,  C23C4/16 ,  F02B77/02 ,  F02F1/00

Abstract: A cylindrical surface (3) is roughed to be prepared for a spray film (11) to be formed thereon, by cutting therein rough undulations (21) in a threaded form, using a cut chip (20) leaving a groove part (21a) of a respective undulation (21) in a preset direction or cut form, for breaking or partially tearing off a ridge part (21b) of the rough undulation (21) to have a remainder of the ridge part (21b) formed with finer undulations (22).

公开(公告)号：US06584169B2

公开(公告)日：2003-06-24

申请号：US10153508

申请日：2002-05-22

Applicant: Kiyoshi Hasegawa

Inventor： Kiyoshi Hasegawa

IPC: G01N23223

CPC classification number: G01N23/223 ,  G01N2223/076

Abstract: In order to acquire typical X-ray spectra by dividing automatically dividing contained matter and regions where the density thereof differs into groups in X-ray mapping analysis, measurement starts with the spectra database empty, a designated location within the sample is irradiated with a primary beam by the primary beam control means, the sample is irradiated with the primary beam for a fixed period of time in order to acquire a measurement spectrum, the X-ray spectrum obtained through measurement and X-ray spectra in the spectra database are compared by the X-ray comparison means, the X-ray spectrum obtained through measurement is added to the database when no matching X-ray spectra exists in the database, and measurement is repeated at a designated measurement point.

公开(公告)号：US06300685B1

公开(公告)日：2001-10-09

申请号：US09358366

申请日：1999-07-21

Applicant: Kiyoshi Hasegawa ,  Fumihiko Ooka

Inventor： Kiyoshi Hasegawa ,  Fumihiko Ooka

IPC: H01L2348

CPC classification number: H01L24/06 ,  H01L23/13 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a semiconductor chip having a major surface and first pads formed on the major surface. The semiconductor package also includes a package substrate having (a) opposite first and second major surfaces, (b) a side surface extending between the first and second major surfaces, (c) a pad forming region adjacent to and along the side surface, (d) second pads formed on the pad forming region, (e) external electrodes formed on the first major surface of the package substrate, wherein the second major surface of the package substrate is fixed to the major surface of the semiconductor chip, and wherein the external electrodes are electrically connected to the second pads. The semiconductor package further includes bonding wires electrically connecting the first pads to the second pads and a sealing material covering the bonding wires and first and second pads.

Abstract translation: 半导体封装包括具有主表面的半导体芯片和在主表面上形成的第一焊盘。 半导体封装还包括具有（a）相对的第一和第二主表面的封装衬底，（b）在第一和第二主表面之间延伸的侧表面，（c）与侧表面相邻并沿着侧表面的焊盘形成区域（ d）形成在焊盘形成区域上的第二焊盘，（e）形成在封装基板的第一主表面上的外部电极，其中封装基板的第二主表面固定到半导体芯片的主表面，并且其中 外部电极电连接到第二焊盘。 半导体封装还包括将第一焊盘电连接到第二焊盘的接合线和覆盖接合线以及第一和第二焊盘的密封材料。