摘要:
The present invention relates to the field of 2D to 3D conversion, in particular discloses a method of converting 2D into 3D based on image motion information. The method comprises: S1, obtaining a depth value of each pixel of the input 2D image based on a method of motion estimation; S2, accumulating the depth value of each pixel in accordance with a luminance value of each pixel to obtain a depth image of the input 2D image; S3, reconstructing a left eye and/or a right eye image based on a reconstruction of depth image in accordance with the depth image obtained in the step of S2; S4, combining the left eye image and the right eye image obtained in the step of S4 and outputting a combined image to obtain the 3D image. In the method herein, due to the accumulation process of the depth value obtained by the motion estimation, the resulted depth image is continuous and dense, which improves the quality of the reconstructed image and the 3D visual effect.
摘要:
A variety of improved approaches for packaging integrated circuits are described. In one described approach, a multiplicity of die cavities are formed in a plastic carrier. In some preferred embodiments, the die cavities are formed by laser ablation. A multiplicity of dice are placed on the carrier, with each die being placed in an associated die cavity. Each of the dice preferably has a multiplicity of I/O bumps formed thereon. An encapsulant is applied over the carrier to form an encapsulant layer that covers the dice and fills portions of the cavities that are not occupied by the dice. In some preferred embodiments, the encapsulant is an epoxy material applied by screen printing and the dice are not physically attached to the carrier prior to the application of the encapsulant. In these embodiments, the epoxy encapsulant serves to secure the dice to the carrier.
摘要:
The invention concerns pyrazine derivatives of the Formula I or pharmaceutically-acceptable salts thereof; wherein each of n, m and R has any of the meanings defined hereinbefore in the description; processes for their preparation, pharmaceutical compositions containing them and their use in the manufacture of a medicament for use in the treatment of bone-related disorders or conditions.
摘要:
A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing. The wafer backside processing includes ion implantation, annealing, etching, sputtering and evaporation while the wafer is in the support structure. Alternative uses of the support structure are also disclosed including the fabrication of dies having metalized side walls.
摘要:
The invention concerns pyrazine derivatives of the Formula I or pharmaceutically-acceptable salts thereof; wherein each of n, m and R has any of the meanings defined hereinbefore in the description; processes for their preparation, pharmaceutical compositions containing them and their use in the manufacture of a medicament for use in the treatment of bone-related disorders or conditions.
摘要:
The present subject matter discloses a method for transmitting a text message including: receiving a text message to be transmitted, which is encoded with a first character set encoding scheme; determining whether a final receiver of the text message supports the first character set encoding scheme; and in response to the situation in which the final receiver of the text message does not support the first character set encoding scheme: converting the text message to be transmitted into an image; and transmitting the converted image. With this method, parties involved in transmission of a text message can enable convenient and efficient transmission of the text message without requiring each party involved in the transmission of the text message to satisfy specific prerequisites normally necessary for proper reproduction of the text message transmitted from an opposite party. One of the specific prerequisites is that the parties involved in the real time communication should support a specific character set encoding scheme. The subject matter further provides a device for transmitting a text message capable of implementing the method for transmitting a text message, a device for processing a text message provided with the device for transmitting a text message, and a system for transmitting a text message through the device for processing a text message.
摘要:
Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of the device, which is convenient for mounting to a printed circuit board (PCB) with solder paste.
摘要:
An inductor may include a planar ferrite core. A first group of one or more grooves is formed in a first side of the ferrite core. A second group of two or more grooves is formed in a second side of the ferrite core. The grooves in the first and second groups are oriented such that each groove in the first group overlaps with two corresponding grooves in the second group. A first plurality of vias communicates through the ferrite core between the first and second sides of the ferrite core. Each via is located where a groove in the first group overlaps with a groove in the second group. A conductive material is disposed in the first and second groups of grooves and in the vias to form an inductor coil.
摘要:
A semiconductor device package die and method of manufacture are disclosed. The device package die may comprise a device substrate having one or more front electrodes located on a front surface of the device substrate and electrically connected to one or more corresponding device regions formed within the device substrate proximate the front surface. A back conductive layer is formed on a back surface of the device substrate. The back conductive layer is electrically connected to a device region formed within the device substrate proximate a back surface of the device substrate. One or more conductive extensions are formed on one or more corresponding sidewalls of the device substrate in electrical contact with the back conductive layer, and extend to a portion of the front surface of the device substrate. A support substrate is bonded to the back surface of the device substrate.
摘要:
A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing. The wafer backside processing includes ion implantation, annealing, etching, sputtering and evaporation while the wafer is in the support structure. Alternative uses of the support structure are also disclosed including the fabrication of dies having metalized side walls.