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    Method of manufacturing a semiconductor device
    27.
    发明授权
    Method of manufacturing a semiconductor device 失效
    制造半导体器件的方法

    公开(公告)号：US5508232A

    公开(公告)日：1996-04-16

    申请号：US386808

    申请日：1995-02-06

    申请人： Tetsuya Ueda ,  Kazunari Michii ,  Yutaka Koyama ,  Naoto Ueda

    发明人： Tetsuya Ueda ,  Kazunari Michii ,  Yutaka Koyama ,  Naoto Ueda

    IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50

    CPC分类号： H01L21/565 ,  H01L23/49537 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10T29/49121

    摘要： In a method of manufacturing a semiconductor device, overlaid on a first lead frame including a die pad supported by a plurality of die pad suspending leads is a second lead frame having connecting leads wherein the first and second lead frames are disposed on a first molding die such that the die pad and inner lead portions of the inner leads of the second lead frame are accommodated within a first cavity of the first molding die while offset portions of the die pad suspending leads are disposed outside of the first cavity. A second molding die is clamped onto the first molding die to define a resin molding chamber which is then filled with a molten resin to form a package. After removing the package from the first and second molding dies, the offset portions are cut away from the package while cutting the connecting leads to a predetermined length. A semiconductor chip as large as permissible can be embedded within a semiconductor device of a standard size while ensuring high quality and improved reliability of the semiconductor device.

    摘要翻译： 在制造半导体器件的方法中，覆盖在包括由多个管芯焊盘悬挂引线支撑的管芯焊盘的第一引线框架上的是具有连接引线的第二引线框架，其中第一引线框架和第二引线框架设置在第一成型模具 使得第二引线框架的内引线的管芯焊盘和内引线部分容纳在第一成型模具的第一腔内，同时将芯片垫悬挂引线的偏移部分设置在第一腔体的外部。 将第二成型模具夹在第一模具上以限定树脂模制室，然后用熔融树脂填充以形成包装。 在从第一和第二模具中取出包装之后，将连接引线切割成​​预定长度，将偏移部分从包装中切出。 可以将尺寸大的半导体芯片嵌入到标准尺寸的半导体器件中，同时确保半导体器件的高品质和可靠性。

    Semiconductor device
    30.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US5220196A

    公开(公告)日：1993-06-15

    申请号：US787127

    申请日：1991-11-04

    申请人： Kazunari Michii ,  Haruo Shimamoto ,  Masataka Takehara

    发明人： Kazunari Michii ,  Haruo Shimamoto ,  Masataka Takehara

    IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50

    CPC分类号： H01L24/50 ,  H01L23/49572 ,  H01L23/49838 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/30107

    摘要： A semiconductor device includes an insulating substrate; a semiconductor chip on which plural electrodes including at least one ground electrode and at least one power source electrode are disposed; plural leads supported by an obverse surface of the insulating substrate, the plural leads being connected to corresponding electrodes on the semiconductor chip; at least one grounding conductor plate on a reverse surface of the insulating substrate; and at least one power source conductor plate on the reverse surface of the insulating substrate. This semiconductor device includes grounding contact holes for electrically connecting the grounding conductor plate to a ground lead coupled to the ground electrode on the semiconductor chip; power source contact holes for electrically connecting the power source conductor plate to a power source lead coupled to the power source electrode on the semiconductor chip; and a package body encapsulating the semiconductor chip and an end of each of the leads so that the other end of each of the leads is exposed outside the package body.

    摘要翻译： 半导体器件包括绝缘衬底; 设置有包括至少一个接地电极和至少一个电源电极的多个电极的半导体芯片; 多个引线由绝缘基板的正面支撑，多个引线连接到半导体芯片上的相应电极; 绝缘基板的背面上的至少一个接地导体板; 以及在绝缘基板的背面上的至少一个电源导体板。 该半导体器件包括用于将接地导体板电连接到耦合到半导体芯片上的接地电极的接地引线的接地接触孔; 电源接触孔，用于将电源导体板电连接到耦合到半导体芯片上的电源电极的电源引线; 以及封装体，其封装半导体芯片和每个引线的端部，使得每个引线的另一端暴露在封装主体的外部。