METHOD FOR IN-SITU CLEANING OF DEPOSITION SYSTEMS
    25.
    发明申请
    METHOD FOR IN-SITU CLEANING OF DEPOSITION SYSTEMS 审中-公开
    沉积物系统的现场清洁方法

    公开(公告)号:US20110079251A1

    公开(公告)日:2011-04-07

    申请号:US12749087

    申请日:2010-03-29

    IPC分类号: B08B5/00

    CPC分类号: C23C16/4405

    摘要: A method for in-situ cleaning of a deposition system is disclosed. The method includes providing a deposition system with portions of the deposition system deposited with at least a group III element or a compound of a group III element. Halogen containing fluid is introduced into the deposition system. The halogen containing fluid is permitted to react with the group III element to form a halide. The halide in solid state is converted to a gaseous state. The halide in gaseous state is purged out of the deposition system.

    摘要翻译: 公开了一种用于原位清洗沉积系统的方法。 该方法包括为沉积系统提供沉积有至少III族元素或III族元素的化合物的沉积系统的部分。 将含卤素的流体引入沉积系统。 允许含卤素的流体与III族元素反应形成卤化物。 固态卤化物转化为气态。 气态卤化物从沉积系统中排出。

    Crack free multilayered devices, methods of manufacture thereof and articles comprising the same
    27.
    发明授权
    Crack free multilayered devices, methods of manufacture thereof and articles comprising the same 有权
    无裂纹多层器件及其制造方法及其制品

    公开(公告)号:US08222057B2

    公开(公告)日:2012-07-17

    申请号:US12861614

    申请日:2010-08-23

    IPC分类号: H01L21/00

    摘要: Disclosed herein is an article comprising a substrate; an interlayer comprising aluminum nitride, gallium nitride, boron nitride, indium nitride or a solid solution of aluminum nitride, gallium nitride, boron nitride and/or indium nitride; the interlayer being directly disposed upon the substrate and in contact with the substrate; where the interlayer comprises a columnar film and/or nanorods and/or nanotubes; and a group-III nitride layer disposed upon the interlayer; where the group-III nitride layer completely covers a surface of the interlayer that is opposed to a surface in contact with the substrate; the group-III nitride layer being free from cracks.

    摘要翻译: 本文公开了包含基材的制品; 包括氮化铝,氮化镓,氮化硼,氮化铟或氮化铝,氮化镓,氮化硼和/或氮化铟的固溶体的中间层; 所述中间层直接设置在所述基板上并与所述基板接触; 其中中间层包括柱状膜和/或纳米棒和/或纳米管; 和设置在中间层上的III族氮化物层; 其中III族氮化物层完全覆盖与衬底接触的表面相对的中间层的表面; III族氮化物层没有裂纹。

    METHOD OF FORMING LED STRUCTURES
    30.
    发明申请
    METHOD OF FORMING LED STRUCTURES 审中-公开
    形成LED结构的方法

    公开(公告)号:US20110027973A1

    公开(公告)日:2011-02-03

    申请号:US12842883

    申请日:2010-07-23

    申请人: Jie Su Olga Kryliouk

    发明人: Jie Su Olga Kryliouk

    IPC分类号: H01L21/20

    摘要: One embodiment of fabricating a p-down light emitting diode (LED) structure comprises depositing a high crystal quality p type contact layer, depositing an active region on top of the p type contact layer, and depositing an n type contact layer on top of the active region using a hydride vapor phase epitaxy (HVPE) process. The high crystal quality p type contact layer is deposited at high temperature to ensure the high crystal quality of the p type film. The n type contact layer is formed on top of the active region in a HVPE chamber at a low temperature to prevent thermal damage to the quantum wells in the active region below the n type contact layer. The processing chamber used to form the p type contact layer is a separate processing chamber than the processing chamber used to form the n type contact layer.

    摘要翻译: 制造p-down发光二极管(LED)结构的一个实施例包括沉积高质量p型接触层,在p型接触层的顶部上沉积有源区,以及在n型接触层的顶部沉积n型接触层 活性区域使用氢化物​​气相外延(HVPE)工艺。 高品质p型接触层在高温下沉积以确保p型膜的高晶体质量。 n型接触层在HVPE室中的有源区域的顶部形成在低温下,以防止在n型接触层下面的有源区域中的量子阱的热损伤。 用于形成p型接触层的处理室是与用于形成n型接触层的处理室不同的处理室。