公开(公告)号：US08551752B2

公开(公告)日：2013-10-08

申请号：US13057418

申请日：2009-08-07

申请人： Seigo Oe ,  Hiroshi Sato ,  Teruhiko Ide

发明人： Seigo Oe ,  Hiroshi Sato ,  Teruhiko Ide

IPC分类号： C12N9/12

CPC分类号： C12N9/1247

摘要： Disclosed is a T7 RNA polymerase mutant having improved thermal stability and/or specific activity in comparison with wild-type T7-like bacteriophage RNA polymerase, wherein at least one amino acid residue corresponding to at least one of the amino acid residues selected from the group at least consisting of glutamine at position 768, lysine at position 179 and valine at position 685 of the amino acid sequence that composes wild-type T7 RNA polymerase shown in SEQ ID NO: 6, is substituted with another amino acid.

摘要翻译： 公开了与野生型T7样噬菌体RNA聚合酶相比具有改进的热稳定性和/或比活性的T7RNA聚合酶突变体，其中至少一个氨基酸残基对应于选自下组的氨基酸残基 由构成SEQ ID NO：6所示的野生型T7RNA聚合酶的氨基酸序列的768位的谷氨酰胺，179位的赖氨酸和685位的缬氨酸被另一个氨基酸取代。

公开(公告)号：US08501914B2

公开(公告)日：2013-08-06

申请号：US12540501

申请日：2009-08-13

申请人： Yutaka Kanda ,  Hiroshi Sato ,  Tsuyoshi Yamada ,  Akifumi Kato ,  Mitsuo Satoh

发明人： Yutaka Kanda ,  Hiroshi Sato ,  Tsuyoshi Yamada ,  Akifumi Kato ,  Mitsuo Satoh

IPC分类号： A61K38/16 ,  C12P21/02

CPC分类号： C07K14/745 ,  A61K38/00 ,  C12P21/005

摘要： A pharmaceutical agent for treating a disease such as inflammatory diseases, blood coagulation diseases associated with deficiency of Protein S has been required. The present invention provides a Protein S composition comprising recombinant Protein S molecules having complex type N-glycoside-linked sugar chains, wherein the Protein S has a higher binding activity to a receptor for advanced glycation end products (hereinafter referred to as “RAGE”) than native Protein S present in healthy human blood, and also has a higher ratio of sugar chains in which fucose is not bound to the complex type N-glycoside-linked sugar chains bound to Protein S than native Protein S present in healthy human blood.

摘要翻译： 需要用于治疗诸如炎性疾病，与蛋白S缺乏相关的血液凝固疾病等疾病的药剂。 本发明提供了包含具有复合型N-糖苷连接的糖链的重组蛋白S分子的蛋白S组合物，其中蛋白S与晚期糖基化终产物的受体（以下称为“RAGE”）具有较高的结合活性， 比存在于健康人血液中的天然蛋白S高，并且与健康人血液中存在的天然蛋白S相比，岩藻糖与其与蛋白S结合的复合型N-糖苷连接的糖链不结合的糖链的比例更高。

公开(公告)号：USD682931S1

公开(公告)日：2013-05-21

申请号：US29419678

申请日：2012-05-01

申请人： Yuji Aoki ,  Hiroshi Sato ,  Masahiro Karasawa

设计人： Yuji Aoki ,  Hiroshi Sato ,  Masahiro Karasawa

公开(公告)号：USD682929S1

公开(公告)日：2013-05-21

申请号：US29419338

申请日：2012-04-27

申请人： Yuji Aoki ,  Hiroshi Sato ,  Masahiro Karasawa

设计人： Yuji Aoki ,  Hiroshi Sato ,  Masahiro Karasawa

公开(公告)号：US08445807B2

公开(公告)日：2013-05-21

申请号：US13233303

申请日：2011-09-15

申请人： Koichi Hashizume ,  Masakazu Yoshimoto ,  Nobuyuki Washio ,  Yoichiro Kimoto ,  Hiroshi Sato ,  Isao Izui

发明人： Koichi Hashizume ,  Masakazu Yoshimoto ,  Nobuyuki Washio ,  Yoichiro Kimoto ,  Hiroshi Sato ,  Isao Izui

IPC分类号： B23H7/08 ,  B23H1/04 ,  B23H1/06

CPC分类号： B21C1/003 ,  B21C9/00 ,  B23H7/08 ,  Y10T428/12903

摘要： A wire material having a copper-zinc alloy layer, which is formed by action of thermal diffusion, and a zinc layer on its circumference surface is subjected to processes, including from a step of drawing the wire material to a step of reducing the diameter of the product, to reliably crash the copper-zinc alloy layer into particles. The particles are embedded in the circumference surface of a core to integrate the diffusion alloy layer and zinc layer with the core and prevent the diffusion alloy layer and zinc layer from falling off from the core. In addition, in order to cover cracks formed in the copper-zinc alloy layer during wire drawing with a zinc thin film, wire drawing is performed at temperatures appropriate for maintaining good malleability and ductility of zinc.

摘要翻译： 对具有由热扩散作用形成的铜 - 锌合金层和其周面上的锌层的线材进行处理，其中包括从将线材拉丝至减小直径的步骤 该产品可以将铜 - 锌合金层可靠地碰撞成颗粒。 将颗粒嵌入芯的圆周表面，使扩散合金层和锌层与芯体结合，防止扩散合金层和锌层从芯脱落。 此外，为了覆盖用锌薄膜拉丝时在铜 - 锌合金层中形成的裂纹，在适于维持锌的良好延展性和延展性的温度下进行拉丝。

公开(公告)号：US20120217556A1

公开(公告)日：2012-08-30

申请号：US13459839

申请日：2012-04-30

申请人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Toshiaki Morita ,  Kazuya Takahashi ,  Munehisa Kishimoto ,  Shigeru Ishii ,  Toshinori Hirashima ,  Yasushi Takahashi ,  Toshiyuki Hata ,  Hiroshi Sato ,  Keiichi Ookawa

发明人： Ryoichi Kajiwara ,  Masahiro Koizumi ,  Toshiaki Morita ,  Kazuya Takahashi ,  Munehisa Kishimoto ,  Shigeru Ishii ,  Toshinori Hirashima ,  Yasushi Takahashi ,  Toshiyuki Hata ,  Hiroshi Sato ,  Keiichi Ookawa

IPC分类号： H01L29/78

CPC分类号： H01L23/49555 ,  H01L21/4814 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/97 ,  H01L29/7833 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/29011 ,  H01L2224/29015 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/73253 ,  H01L2224/75251 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83138 ,  H01L2224/83191 ,  H01L2224/83825 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/84801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10253 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H05K3/3426 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2224/29139 ,  H01L2924/3512 ,  H01L2224/48 ,  H01L2924/00012

摘要： A semiconductor device featuring a semiconductor chip having a first main surface and a second, opposing main surface and including a MOSFET having source and gate electrodes formed on the first main surface and a drain electrode thereof formed on the second main surface, first and second conductive members acting as lead terminals for the source and gate electrodes, respectively, are disposed over the first main surface, each of the first and second conductive members has a part overlapped with the chip in a plan view, a sealing body sealing the chip and parts of the first and second conductive members such that a part of the first conductive member is projected outwardly from a first side surface of the sealing body and parts of the first and second conductive members are projected outwardly from the opposing second side surface of the sealing body in a plan view.

摘要翻译： 一种具有半导体芯片的半导体器件，具有第一主表面和第二相对的主表面，并且包括形成在第一主表面上的源极和栅电极的MOSFET，以及形成在第二主表面上的漏电极，第一和第二导电 作为源电极和栅电极的引线端子的部件分别设置在第一主表面上，第一和第二导电部件中的每一个在平面图中与芯片重叠，密封体密封芯片和部件 的第一和第二导电构件，使得第一导电构件的一部分从密封体的第一侧表面向外突出，并且第一和第二导电构件的部分从密封体的相对的第二侧表面向外突出 在平面图中。

公开(公告)号：US08253247B2

公开(公告)日：2012-08-28

申请号：US12756208

申请日：2010-04-08

申请人： Noriko Numata ,  Hiroshi Sato ,  Toru Ueguri

发明人： Noriko Numata ,  Hiroshi Sato ,  Toru Ueguri

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L29/7813 ,  H01L23/4824 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/544 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/77 ,  H01L24/78 ,  H01L24/84 ,  H01L24/85 ,  H01L24/97 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/42376 ,  H01L29/456 ,  H01L29/66719 ,  H01L29/7811 ,  H01L2223/54486 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/37124 ,  H01L2224/40091 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48132 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49171 ,  H01L2224/73219 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/78 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00012

摘要： In a method for manufacturing a semiconductor device involving the step of bonding a metallic ribbon to a pad of a semiconductor chip, breakage of the metallic ribbon is to be prevented while ensuring the bonding strength even when the metallic ribbon becomes thin with reduction in size of the semiconductor chip. In bonding an Al ribbon to a pad of a semiconductor chip by bringing a pressure bonding surface of a wedge tool into pressure contact with the Al ribbon while applying ultrasonic vibration to the ribbon positioned over the pad, recesses 10a are formed beforehand at both end portions respectively of the wedge tool lest both end portions in the width direction of the Al ribbon bonded to the pad should contact the pressure bonding surface of the wedge tool.

摘要翻译： 在涉及将金属带接合到半导体芯片的焊盘的步骤的半导体器件的制造方法中，即使当金属带变薄时，也可以确保金属带的断裂，同时确保接合强度，同时尺寸减小 半导体芯片。 通过使楔形工具的压接面与Al带压接，同时对位于焊盘上的带施加超声波振动，将Al带接合到半导体芯片的焊盘，在两端部预先形成有凹部10a 分别与楔形工具接合的Al带的宽度方向上的两个端部应接触楔形工具的压接表面。

公开(公告)号：US08239894B2

公开(公告)日：2012-08-07

申请号：US11177363

申请日：2005-07-11

申请人： Shingo Utsuki ,  Kazuto Nishizawa ,  Daisuke Inaishi ,  Ko Kusanagi ,  Hiroshi Sato ,  Daisuke Sato ,  Kenichi Moriwaki ,  Satoshi Kanda ,  Yuji Ishimura ,  Shimon Sakai ,  Masahiro Urano

发明人： Shingo Utsuki ,  Kazuto Nishizawa ,  Daisuke Inaishi ,  Ko Kusanagi ,  Hiroshi Sato ,  Daisuke Sato ,  Kenichi Moriwaki ,  Satoshi Kanda ,  Yuji Ishimura ,  Shimon Sakai ,  Masahiro Urano

IPC分类号： G06F3/00 ,  G06F13/00 ,  G06F3/048 ,  H04N5/445

CPC分类号： H04N5/44543 ,  G06F3/0485 ,  H04N5/44591 ,  H04N21/4312 ,  H04N21/4622 ,  H04N21/47 ,  H04N21/482 ,  H04N21/84

摘要： A graphical user interface is disclosed which achieves an easy search for a desired item upon scrolling. A plurality of representation images individually representing different selection object items are displayed in an array along one direction of a display screen. A noticed representation image selected from among the representation images is displayed emphatically at a fixed position on the display screen, and explanation information of the noticed representation image is displayed in the proximity of the noticed representation image. If a scrolling information for the array of representation images is issued, then scrolling is executed such that explanation information also of the representation images other than the noticed representation image is displayed. Further, a bar display including a mark representing the position and the group of the noticed representation image in the array of representation images is displayed together.

摘要翻译： 公开了一种图形用户界面，其在滚动时实现对期望项目的容易搜索。 分别表示不同选择对象项目的多个表示图像以显示屏幕的一个方向在阵列中显示。 在显示屏幕上的固定位置处强调地显示从表示图像中选择的注意到的表示图像，并且在注意到的表示图像附近显示注意的表示图像的说明信息。 如果发出用于表示图像数组的滚动信息，则执行滚动，使得显示除了被注意的表示图像之外的表示图像的说明信息。 此外，一起显示包括表示图像阵列中的注意的表示图像的位置和组的标记的标记。

公开(公告)号：US20120122289A1

公开(公告)日：2012-05-17

申请号：US13356812

申请日：2012-01-24

申请人： Kenji Matsumoto ,  Hitoshi Itoh ,  Hiroshi Sato

发明人： Kenji Matsumoto ,  Hitoshi Itoh ,  Hiroshi Sato

IPC分类号： H01L21/02

CPC分类号： H01L21/31604 ,  H01L21/3145 ,  H01L28/40

摘要： Provided is a semiconductor device manufacturing method for a capacitor having a dielectric film which can be formed into a thin film, can be formed at a low temperature, and has a readily controllable property. The manufacturing method includes: forming, on a conductor for serving as one electrode of a capacitor, a manganese oxide film for serving as a dielectric film of the capacitor; and forming, on the manganese oxide film, a conductive film for serving as the other electrode of the capacitor.

摘要翻译： 提供一种具有可形成为薄膜的电介质膜的电容器的半导体器件制造方法，可以在低温下形成，并具有容易控制的特性。 制造方法包括：在用作电容器的一个电极的导体上形成用作电容器的电介质膜的氧化锰膜; 在氧化锰膜上形成用作电容器的另一个电极的导电膜。

公开(公告)号：US08111869B2

公开(公告)日：2012-02-07

申请号：US12515112

申请日：2006-11-17

申请人： Minoru Horigome ,  Hiroshi Sato ,  Takuei Nagasawa ,  Hiroya Oizumi

发明人： Minoru Horigome ,  Hiroshi Sato ,  Takuei Nagasawa ,  Hiroya Oizumi

IPC分类号： H04R1/00 ,  H04R9/06 ,  H04R11/02

CPC分类号： H04R9/043 ,  H04R2307/207 ,  H04R2499/13

摘要： A speaker device includes a damper allowing high linearity. The speaker device includes a vibration body including a damper and a voice coil bobbin (bobbin), and a magnetic circuit having a plate. The damper has a first member arranged opposite the plate, and a second member projecting on a side of the plate from the first member. The first member has a movable part elastically supporting the bobbin. The movable part is a flat plate, and behaves with respect to a bent part provided between the movable part and the second member with movement of the bobbin in an acoustic radiation direction and reverse. Therefore, when a constant force is given to the damper via the voice coil, a displacement of the damper with respect to a rest position can be substantially similar in such a case that the damper behaves in the acoustic radiation direction and the reverse.

摘要翻译： 扬声器装置包括允许高线性度的阻尼器。 扬声器装置包括具有阻尼器和音圈管架（绕线管）的振动体和具有板的磁路。 阻尼器具有与板相对设置的第一构件和从第一构件突出于板的一侧的第二构件。 第一构件具有弹性地支撑线轴的可动部。 可移动部分是平板，并且相对于设置在可移动部分和第二部件之间的弯曲部分，在线轴在声辐射方向和相反方向上运动。 因此，当通过音圈向阻尼器施加恒定的力时，阻尼器相对于静止位置的位移在阻尼器在声辐射方向和相反方向上的行为的情况下可以基本相似。