公开(公告)号：US20140093990A1

公开(公告)日：2014-04-03

申请号：US14102600

申请日：2013-12-11

申请人： TSMC Solid State Lighting Ltd.

发明人： Yung-Chang Chen ,  Hsin-Hsien Wu ,  Ming Shing Lee ,  Huai-En Lai ,  Fu-Wen Liu ,  Andy Wu

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  H01L24/24 ,  H01L24/82 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2933/0066 ,  H01L2924/00

摘要： An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.

摘要翻译： 光发射器包括在封装晶片上的发光二极管（LED），透明绝缘体以及LED管芯与封装晶片上的一个或多个接触焊盘之间的一个或多个透明电连接器。 透明绝缘体沉积在封装晶圆上，并使用光刻法或丝网印刷法连接LED芯片。 使用物理气相沉积，化学气相沉积，旋涂，喷涂或丝网印刷沉积透明电连接器，并且可以使用光刻工艺和蚀刻来图案化。

公开(公告)号：US20140077152A1

公开(公告)日：2014-03-20

申请号：US13616299

申请日：2012-09-14

申请人： Zhen-Yu Li ,  Hon-Way Lin ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo

发明人： Zhen-Yu Li ,  Hon-Way Lin ,  Chung-Pao Lin ,  Hsing-Kuo Hsia ,  Hao-Chung Kuo

IPC分类号： H01L33/06

CPC分类号： H01L33/06 ,  B82Y20/00 ,  F21K9/00 ,  F21S6/00 ,  F21V3/049 ,  F21V7/22 ,  F21V29/74 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L21/02458 ,  H01L21/02507 ,  H01L33/0025 ,  H01L33/12 ,  H01L33/145 ,  H01L33/32 ,  H01S5/0014 ,  H01S5/3407 ,  H01S5/34333

摘要： The present disclosure involves an illumination apparatus. The illumination apparatus includes an n-doped semiconductor compound layer, a p-doped semiconductor compound layer spaced apart from the n-doped semiconductor compound layer, and a multiple-quantum-well (MQW) disposed between the first semiconductor compound layer and the second semiconductor compound layer. The MQW includes a plurality of alternating first and second layers. The first layers of the MQW have substantially uniform thicknesses. The second layers have graded thicknesses with respect to distances from the p-doped semiconductor compound layer. A subset of the second layers located most adjacent to the p-doped semiconductor compound layer is doped with a p-type dopant. The doped second layers have graded doping concentration levels that vary with respect to distances from the p-doped semiconductor layer.

摘要翻译： 本公开涉及一种照明装置。 照明装置包括n掺杂半导体化合物层，与n掺杂半导体化合物层间隔开的p掺杂半导体化合物层和设置在第一半导体化合物层和第二半导体化合物层之间的多量子阱（MQW） 半导体复合层。 MQW包括多个交替的第一和第二层。 MQW的第一层具有基本均匀的厚度。 第二层相对于与p掺杂半导体化合物层的距离具有渐变厚度。 位于与p掺杂半导体化合物层最相邻的第二层的子集中掺杂有p型掺杂剂。 掺杂的第二层具有相对于从p掺杂半导体层的距离而变化的渐变掺杂浓度水平。

公开(公告)号：US08659033B2

公开(公告)日：2014-02-25

申请号：US13267701

申请日：2011-10-06

申请人： Chen-Hua Yu ,  Wen-Chih Chiou ,  Ding-Yuan Chen ,  Chia-Lin Yu ,  Hung-Ta Lin

发明人： Chen-Hua Yu ,  Wen-Chih Chiou ,  Ding-Yuan Chen ,  Chia-Lin Yu ,  Hung-Ta Lin

IPC分类号： H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00

CPC分类号： H01L33/22 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/06 ,  H01L33/24 ,  H01L33/32

摘要： A light-emitting diode (LED) device is provided. The LED device has raised semiconductor regions formed on a substrate. LED structures are formed over the raised semiconductor regions such that bottom contact layers and active layers of the LED device are conformal layers. The top contact layer has a planar surface. In an embodiment, the top contact layers are continuous over a plurality of the raised semiconductor regions while the bottom contact layers and the active layers are discontinuous between adjacent raised semiconductor regions.

摘要翻译： 提供了一种发光二极管（LED）装置。 LED装置已经凸起形成在基板上的半导体区域。 在凸起的半导体区域上形成LED结构，使得LED器件的底部接触层和有源层是保形层。 顶部接触层具有平坦的表面。 在一个实施例中，顶部接触层在多个凸起的半导体区域上是连续的，而底部接触层和有源层在相邻凸起的半导体区域之间是不连续的。

公开(公告)号：US20140021483A1

公开(公告)日：2014-01-23

申请号：US14038881

申请日：2013-09-27

申请人： TSMC Solid State Lighting Ltd.

发明人： Jung-Tang Chu ,  Ching-Hua Chiu ,  Hung-Wen Huang ,  Yea-Chen Lee ,  Hsing-Kuo Hsia

IPC分类号： H01L33/32

CPC分类号： H01L33/32 ,  H01L21/02458 ,  H01L21/02488 ,  H01L21/0254 ,  H01L21/02639 ,  H01L21/0265 ,  H01L33/0075 ,  H01L33/0079 ,  H01L33/12 ,  H01L33/16 ,  H01L33/30 ,  H01L33/325

摘要： A seed layer for growing a group 111-V semiconductor structure 1s embedded in a dielectric material on a carrier substrate. After the group 111-V semiconductor structure is grown, the dielectric material is removed by wet etch to detach the carrier substrate. The group 111-V semiconductor structure includes a thick gallium nitride layer of at least 100 microns or a light-emitting structure.

摘要翻译： 种子层，用于生长嵌入在载体基底上的电介质材料中的基团111-V半导体结构1s。 在组111-V半导体结构生长之后，通过湿蚀刻去除电介质材料以分离载体衬底。 组111-V半导体结构包括至少100微米的厚氮化镓层或发光结构。

公开(公告)号：US08610161B2

公开(公告)日：2013-12-17

申请号：US13253797

申请日：2011-10-05

申请人： Yung-Chang Chen ,  Hsin-Hsien Wu ,  Ming Shing Lee ,  Huai-En Lai ,  Fu-Wen Liu ,  Andy Wu

发明人： Yung-Chang Chen ,  Hsin-Hsien Wu ,  Ming Shing Lee ,  Huai-En Lai ,  Fu-Wen Liu ,  Andy Wu

IPC分类号： H01L33/42

CPC分类号： H01L33/58 ,  H01L24/24 ,  H01L24/82 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2933/0066 ,  H01L2924/00

摘要： An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.

摘要翻译： 光发射器包括在封装晶片上的发光二极管（LED），透明绝缘体以及LED管芯与封装晶片上的一个或多个接触焊盘之间的一个或多个透明电连接器。 透明绝缘体沉积在封装晶圆上，并使用光刻法或丝网印刷法连接LED芯片。 使用物理气相沉积，化学气相沉积，旋涂，喷涂或丝网印刷沉积透明电连接器，并且可以使用光刻工艺和蚀刻来图案化。

公开(公告)号：US08604498B2

公开(公告)日：2013-12-10

申请号：US12732437

申请日：2010-03-26

申请人： Hsin-Chieh Huang ,  Chao-Hsiung Wang

发明人： Hsin-Chieh Huang ,  Chao-Hsiung Wang

IPC分类号： H01L33/00

CPC分类号： H01L33/502 ,  H01L27/153 ,  H01L33/0079 ,  H01L33/382 ,  H01L33/504 ,  H01L33/508 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A photonic device generates light from a full spectrum of lights including white light. The device includes two or more LEDs grown on a substrate, each generating light of a different wavelength and separately controlled. A light-emitting structure is formed on the substrate and apportioned into the two or more LEDs by etching to separate the light-emitting structure into different portions. At least one of the LEDs is coated with a phosphor material so that different wavelengths of light are generated by the LEDs while the same wavelength of light is emitted from the light-emitting structure.

公开(公告)号：US08598617B2

公开(公告)日：2013-12-03

申请号：US13557272

申请日：2012-07-25

申请人： Chih-Kuang Yu ,  Chyi Shyuan Chern ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

发明人： Chih-Kuang Yu ,  Chyi Shyuan Chern ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

IPC分类号： H01L33/00

CPC分类号： H01L25/0753 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0079 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/73267 ,  H01L2924/01029 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2933/0033 ,  H01L2924/00

摘要： An LED array comprises a growth substrate and at least two separated LED dies grown over the growth substrate. Each of LED dies sequentially comprise a first conductive type doped layer, a multiple quantum well layer and a second conductive type doped layer. The LED array is bonded to a carrier substrate. Each of separated LED dies on the LED array is simultaneously bonded to the carrier substrate. The second conductive type doped layer of each of separated LED dies is proximate to the carrier substrate. The first conductive type doped layer of each of LED dies is exposed. A patterned isolation layer is formed over each of LED dies and the carrier substrate. Conductive interconnects are formed over the patterned isolation layer to electrically connect the at least separated LED dies and each of LED dies to the carrier substrate.

摘要翻译： LED阵列包括生长衬底和在生长衬底上生长的至少两个分离的LED管芯。 每个LED管芯依次包括第一导电型掺杂层，多量子阱层和第二导电型掺杂层。 LED阵列结合到载体衬底。 LED阵列上的每个分离的LED管芯同时结合到载体衬底。 每个分离的LED管芯的第二导电型掺杂层靠近载体衬底。 每个LED管芯的第一导电型掺杂层被暴露。 在每个LED管芯和载体衬底上形成图案化隔离层。 导电互连形成在图案化的隔离层上，以将至少分离的LED管芯和每个LED管芯电连接到载体衬底。

公开(公告)号：US08587018B2

公开(公告)日：2013-11-19

申请号：US13167878

申请日：2011-06-24

申请人： Shouli Steve Hsia ,  Chih-Kuang Yu ,  Ken Wen-Chien Fu ,  Hung-Yi Kuo ,  Hung-Chao Kao ,  Ming-Feng Wu ,  Fu-Chih Yang

发明人： Shouli Steve Hsia ,  Chih-Kuang Yu ,  Ken Wen-Chien Fu ,  Hung-Yi Kuo ,  Hung-Chao Kao ,  Ming-Feng Wu ,  Fu-Chih Yang

IPC分类号： H01L33/00

CPC分类号： H01L33/0008 ,  H01L27/15 ,  H01L33/0004 ,  H01L33/005 ,  H01L33/62

摘要： A light emitting diode (LED) structure comprises a first dopant region, a dielectric layer on top of the first dopant region, a bond pad layer on top of a first portion the dielectric layer, and an LED layer having a first LED region and a second LED region. The bond pad layer is electrically connected to the first dopant region. The first LED region is electrically connected to the bond pad layer.

摘要翻译： 发光二极管（LED）结构包括第一掺杂区域，位于第一掺杂区域顶部的电介质层，介电层第一部分顶部的接合焊盘层，以及具有第一LED区域和 第二LED区域。 接合焊盘层电连接到第一掺杂区域。 第一LED区域电连接到接合焊盘层。

公开(公告)号：US20130215613A1

公开(公告)日：2013-08-22

申请号：US13399027

申请日：2012-02-17

申请人： Yi-Tsuo Wu

发明人： Yi-Tsuo Wu

IPC分类号： F21V29/00 ,  F21V17/12 ,  F21V25/00 ,  F21V21/00

CPC分类号： F21V29/70 ,  F21K9/20 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H01L2924/00014

摘要： The present disclosure involves a lighting apparatus. The lighting apparatus includes a thermally-conductive substrate. The thermally-conductive substrate may include a substrate. The lighting apparatus also includes a printed circuit board (PCB). The PCB is located besides the thermally-conductive substrate. The PCB and the thermally-conductive substrate have different material compositions. The lighting apparatus also includes a photonic device located over the thermally-conductive substrate. The photonic device may include a light-emitting diode (LED) die. The photonic device is thermally coupled to the thermally-conductive substrate. The photonic device is electrically coupled to the printed circuit board. The lighting apparatus also includes a thermal dissipation structure. The thermal dissipation structure is thermally coupled to the thermally-conductive substrate.

摘要翻译： 本公开涉及一种照明装置。 照明装置包括导热基板。 导热基板可以包括基板。 照明装置还包括印刷电路板（PCB）。 PCB位于导热基板之外。 PCB和导热基板具有不同的材料组成。 照明装置还包括位于导热基板上方的光子装置。 光子器件可以包括发光二极管（LED）裸片。 光子器件热耦合到导热衬底。 光子器件电耦合到印刷电路板。 照明装置还包括散热结构。 散热结构热耦合到导热基板。

公开(公告)号：US20130157395A1

公开(公告)日：2013-06-20

申请号：US13767994

申请日：2013-02-15

申请人： TSMC Solid State Lighting Ltd.

发明人： Chung Yu Wang

IPC分类号： H01L33/64

CPC分类号： H01L33/64 ,  H01L24/17 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16235 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15156 ,  H01L2924/15788 ,  H01L2924/18161 ,  H01L2924/00

摘要： A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.

摘要翻译： 封装系统包括具有通过衬底的至少一个第一导热结构的衬底。 至少一个第二导热结构设置在所述至少一个第一导热结构上。 至少一个发光二极管（LED）设置在所述至少一个第二导热结构上。