公开(公告)号：US20030198020A1

公开(公告)日：2003-10-23

申请号：US10457122

申请日：2003-06-09

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H05K007/20

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613 ,  H01L2924/00

Abstract: A high density vertical surface mount package and thermal carrier therefore including a heat sink.

Abstract translation: 因此，高密度垂直表面安装封装和热载体包括散热器。

公开(公告)号：US06627822B2

公开(公告)日：2003-09-30

申请号：US09893307

申请日：2001-06-27

Applicant: James Daniel Jackson ,  Terrance J. Dishongh ,  Damion T. Searls

Inventor： James Daniel Jackson ,  Terrance J. Dishongh ,  Damion T. Searls

IPC: H05K116

CPC classification number: H05K3/3415 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/014 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/1059 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2224/05599

Abstract: A electronic assembly is disclosed and claimed. The electronic assembly includes a first substrate and a second substrate. A plurality of power connections are coupled between the first substrate and the second substrate and a multiplicity of signal connections separate from the plurality of power connections are also coupled between the first substrate and the second substrate. Each of the plurality of power connections have a substantially different size and shape compared to each of the multiplicity of signal connections.

Abstract translation: 公开并要求保护电子组件。 电子组件包括第一基板和第二基板。 多个电源连接耦合在第一基板和第二基板之间，并且与多个电源连接分离的多个信号连接也耦合在第一基板和第二基板之间。 与多个信号连接中的每一个相比，多个电源连接中的每一个具有基本上不同的大小和形状。

公开(公告)号：US06570484B2

公开(公告)日：2003-05-27

申请号：US10242980

申请日：2002-09-13

Applicant: Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

Inventor： Michio Miyazaki ,  Haruyuki Takeuchi ,  Tadao Bekku

IPC: H01C710

CPC classification number: H01C1/01 ,  H01C1/014 ,  H01C1/1406 ,  H05K1/0201 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/062 ,  H05K2201/10378 ,  H05K2201/10643 ,  H05K2201/10659 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A thermistor with positive resistance-to-temperature characteristic used in a overcurrent protection circuit has electrodes on mutually opposite main surfaces and is mounted to a substrate having electrically conductive members such that deterioration of its voltage resistance due to heat emission can be controlled. A spacer with smaller thermal conductivity than the substrate and penetrated by a conductor piece with a small cross-sectional area is inserted between solder materials connecting to one of the thermistor electrodes. The other electrode is contacted by an elongated connecting member through its sectional surface transverse to its longitudinal direction such that the cross-sectional area of electrical conduction is reduced.

公开(公告)号：US20010040287A1

公开(公告)日：2001-11-15

申请号：US09734662

申请日：2000-12-13

Inventor： Takahiro Hosomi

IPC: H01L023/48 ,  H01L021/58 ,  H01L021/60

CPC classification number: H01L23/13 ,  H01L23/49805 ,  H01L23/49816 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/15162 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10659 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00

Abstract: A surface mount package is composed of a package body and first and second terminals. The package body has first and second surfaces intersecting with each other. Also, the package body has an installing portion for an element to be installed. The first terminal is connected to the first surface, and the second terminal is connected to the second surface.

Abstract translation: 表面安装封装由封装体和第一和第二端子组成。 包装体具有彼此相交的第一和第二表面。 此外，包装体具有用于要安装的元件的安装部。 第一端子连接到第一表面，并且第二端子连接到第二表面。

公开(公告)号：US06271480B1

公开(公告)日：2001-08-07

申请号：US09073854

申请日：1998-05-07

Applicant: Yukio Yamaguti ,  Hironobu Ikeda

Inventor： Yukio Yamaguti ,  Hironobu Ikeda

IPC: H01L2348

CPC classification number: H05K3/303 ,  H01L23/32 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/308 ,  H05K3/3415 ,  H05K3/3421 ,  H05K2201/10545 ,  H05K2201/10659 ,  H05K2201/10704 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/53174 ,  H01L2924/00

Abstract: The electronic device is provide that includes a body having an underside; a plurality of conducting members for transferring electronic signals; and at least two alignment pins mounted perpendicularly on the underside. Each of the alignment pins has a flexible portion that is more easily bendable than the other portions.

Abstract translation: 该电子装置的设置包括具有下侧的主体; 用于传送电子信号的多个导电构件; 以及垂直安装在下侧上的至少两个对准销。 每个对准销具有比其他部分更容易弯曲的柔性部分。

公开(公告)号：US6115254A

公开(公告)日：2000-09-05

申请号：US441525

申请日：1999-11-16

Applicant: Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

Inventor： Larry D. Kinsman ,  Jerry M. Brooks ,  Walter L. Moden

IPC: H01L23/367 ,  H01L23/433 ,  H05K1/02 ,  H05K3/30 ,  H05K7/20

CPC classification number: H05K3/303 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/09709 ,  H05K2201/10454 ,  H05K2201/10659 ,  H05K2201/10696 ,  Y02P70/613

Abstract: A high density vertical surface mount package and thermal carrier therefor including a heat sink.

公开(公告)号：US5923538A

公开(公告)日：1999-07-13

申请号：US646037

申请日：1996-05-07

Applicant: Emily Hawthorne

Inventor： Emily Hawthorne

IPC: H01L23/16 ,  H01L23/32 ,  H01L23/367 ,  H01L23/495 ,  H05K1/02 ,  H01R5/09 ,  H05K7/02

CPC classification number: H01L23/3675 ,  H01L23/16 ,  H01L23/32 ,  H01L23/49572 ,  H01L24/50 ,  H01L2224/50 ,  H01L2924/14 ,  H05K1/0203 ,  H05K2201/10568 ,  H05K2201/10659 ,  Y10T29/49121 ,  Y10T29/4913

Abstract: A Tape-Automated-Bonding (TAB) package includes a resilient polyimide layer that supports a metal leadframe. A microelectronic circuit die is mounted in a hole in the polyimide layer and interconnected with inner leads of the leadframe. The TAB package is adhered to a support member having spacers that abut against the surface of a printed circuit board (PCB) on which the package is to be mounted and provide a predetermined spacing between the leadframe and the surface. Outer leads that protrude from the leadframe are bent into a shape so as extend, in their free state, toward the surface at least as far as the spacers. The package and support member assembly is placed on the PCB surface, and the combination of the weight of the assembly, the resilience of the leads and the preset standoff height enable the leads to resiliently deform so that the spacers abut against the surface and the leads conformably engage with the surface for soldering or other ohmic connection to conjugate bonding pads on the surface. The support member can be formed with lead retainers around which the leads extend to form loops that resiliently and conformably engage with the surface as the assembly is lowered thereon. The support member maintains coplanarity, adds weight to the package, pre-sets the standoff to protect the formed outer leads during surface mounting and enables the package to be shipped without a separate carrier.

Abstract translation: 胶带自动键合（TAB）封装包括支撑金属引线框架的弹性聚酰亚胺层。 微电子电路管芯安装在聚酰亚胺层的孔中并与引线框的内引线相互连接。 TAB封装被粘附到具有间隔件的支撑构件上，所述间隔件抵靠在其上将要安装封装件的印刷电路板（PCB）的表面，并且在引线框架和表面之间提供预定间隔。 从引线框突出的外引线弯曲成一种形状，以便在其自由状态下至少与间隔物一样延伸。 封装和支撑构件组件放置在PCB表面上，并且组件的重量，引线的弹性和预设的间隔高度的组合使得引线能够弹性变形，使得间隔件抵靠表面和引线 顺应地与表面接合以进行焊接或其他欧姆连接以在表面上共轭接合焊盘。 支撑构件可以形成有引线保持器，引线延伸到所述引线保持器，当所述组件降低时，所述引线延伸以形成与所述表面弹性和顺应地接合的环。 支撑构件保持共面性，增加了包装的重量，预先设定了间隔，以在表面安装期间保护形成的外引线，并使得包装在没有单独载体的情况下运输。

公开(公告)号：US5861669A

公开(公告)日：1999-01-19

申请号：US488673

申请日：1995-06-07

Applicant: Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

Inventor： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC: H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC classification number: H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract translation: 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US5808357A

公开(公告)日：1998-09-15

申请号：US487539

申请日：1995-06-07

Applicant: Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

Inventor： Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

IPC: H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H01L23/48

CPC classification number: H05K1/0243 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/10287 ,  H05K2201/10477 ,  H05K2201/10659 ,  H05K2201/10689

Abstract: A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor parts which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode ads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

Abstract translation: 半导体器件包括具有第一表面，第二表面和暴露于基板的第一和第二表面的至少一个导体部分的基板，设置在基板的第一表面上的半导体芯片， 电极焊盘，多个引线，将引线和导体部分电连接到半导体芯片的对应的电极焊盘中的多个接合线，以及封装半导体芯片，部分引线的树脂封装，以及 基板，使得导体部分在基板的第二表面处露出。

公开(公告)号：US5801923A

公开(公告)日：1998-09-01

申请号：US818511

申请日：1997-03-14

Applicant: Randolph G. Nichols

Inventor： Randolph G. Nichols

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K1/141 ,  H05K3/341 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0263 ,  H05K1/113 ,  H05K2201/09781 ,  H05K2201/10659 ,  H05K2201/10689 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K3/3426 ,  H05K3/368 ,  Y02P70/613

Abstract: A multichip module is attached to a printed wire circuit board using three conductive mounting feet that are vapor phase soldered to conductive feet on the module's substrate and to conductive feet on the printed wiring circuit board that are connected to a ground plane on the board.

Abstract translation: 多芯片模块使用三个导电安装脚连接到印刷线路板上，导电安装脚气相焊接到模块基板上的导电脚和印刷线路板上的与板上的接地平面连接的导电脚。