公开(公告)号：US06856017B2

公开(公告)日：2005-02-15

申请号：US09442038

申请日：1999-11-17

申请人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

发明人： Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Seiichi Orimo ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L23/04

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.

摘要翻译： 一种包括芯片的装置和密封芯片的树脂封装，树脂封装具有位于树脂封装的安装侧表面上的树脂突起。 金属膜分别设置在树脂突起上。 连接部件电连接芯片的电极焊盘和金属膜。

公开(公告)号：US5804468A

公开(公告)日：1998-09-08

申请号：US561421

申请日：1995-11-21

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

IPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/433 ,  H01L23/495 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60

CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

摘要翻译： 一种半导体装置的半导体器件的制造方法，其中半导体器件被封装在其中，包括基底，并且在基底的表面上形成金属膜。 半导体芯片形成在金属膜上。 形成在半导体芯片上的焊盘通过导线连接到金属膜。 在金属膜上形成密封层。 导线形成在玻璃层上。 在金属膜上形成连接层，并含有导电粒子。 连接层与用于电源系统的引线接触并将金属膜连接到引线。

公开(公告)号：US06573121B2

公开(公告)日：2003-06-03

申请号：US09809105

申请日：2001-03-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2144

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts. Outer circumference surfaces of the resin package are upright surfaces defined by cutting.

公开(公告)号：US06376921B1

公开(公告)日：2002-04-23

申请号：US09192201

申请日：1998-11-16

申请人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

发明人： Yoshiyuki Yoneda ,  Ryuji Nomoto ,  Toshiyuki Motooka ,  Kazuto Tsuji ,  Junichi Kasai ,  Toshimi Kawahara ,  Hideharu Sakoda ,  Kenji Itasaka ,  Terumi Kamifukumoto

IPC分类号： H01L2328

CPC分类号： H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/19043 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/85 ,  H01L2924/01004 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding downward from a mounting surface of the resin package, metallic film portions provided to the resin projections, and connecting members electrically connecting the semiconductor elements to the metallic film parts.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的树脂封装，从树脂封装的安装表面向下突出的树脂突起，设置在树脂突起上的金属膜部分和将半导体元件电连接到金属膜的连接构件 部分。

公开(公告)号：US5656550A

公开(公告)日：1997-08-12

申请号：US611007

申请日：1996-03-05

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Masaki Waki

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Masaki Waki

IPC分类号： H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L21/60

CPC分类号： H01L24/49 ,  H01L21/565 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  Y10T29/49121

摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device has a semiconductor chip, a lead member having a lead portion and an outer connecting terminal connected integrally to the lead portion, the lead portion electrically connected to the semiconductor chip, the lead portion extending outwardly from the semiconductor chip, the outer connecting terminal extending downwardly from the lead portion, a sealing resin sealing the semiconductor chip and the lead portion, a bottom face of the semiconductor chip and a bottom face of the lead portion being exposed from the sealing resin, and an insulating member covering the bottom face of the semiconductor chip and the bottom face of the lead portion. Also, the semiconductor device has a semiconductor chip having a predetermined number of electrode pads, a predetermined number of leads electrically connected to the electrode pads, each of the leads having a projecting terminal portion formed by bending the lead, and a resin portion sealing the semiconductor chip and the leads, wherein the terminal portions are exposed from one face of the resin portion.

摘要翻译： 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件具有半导体芯片，具有引线部分的引线部分和与引线部分整体连接的外部连接端子，引线部分电连接到半导体芯片，引线部分从半导体芯片向外延伸，外部连接 从所述引线部分向下延伸的端子，密封所述半导体芯片和所述引线部分的密封树脂，所述半导体芯片的底面和所述引线部分的底面从所述密封树脂露出;以及绝缘构件， 和半导体芯片的底面。 此外，半导体器件具有预定数量的电极焊盘的半导体芯片，与电极焊盘电连接的预定数量的引线，每个引线具有通过弯曲引线形成的突出端子部分和密封 半导体芯片和引线，其中端子部分从树脂部分的一个面露出。

公开(公告)号：US5808357A

公开(公告)日：1998-09-15

申请号：US487539

申请日：1995-06-07

申请人： Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

发明人： Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

IPC分类号： H01L23/31 ,  H01L23/433 ,  H05K1/02 ,  H01L23/48

CPC分类号： H05K1/0243 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/49 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/10287 ,  H05K2201/10477 ,  H05K2201/10659 ,  H05K2201/10689

摘要： A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor parts which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode ads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

摘要翻译： 半导体器件包括具有第一表面，第二表面和暴露于基板的第一和第二表面的至少一个导体部分的基板，设置在基板的第一表面上的半导体芯片， 电极焊盘，多个引线，将引线和导体部分电连接到半导体芯片的对应的电极焊盘中的多个接合线，以及封装半导体芯片，部分引线的树脂封装，以及 基板，使得导体部分在基板的第二表面处露出。

公开(公告)号：US5497032A

公开(公告)日：1996-03-05

申请号：US213720

申请日：1994-03-16

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Michio Sono ,  Ichiro Yamaguchi ,  Toshio Hamano ,  Yoshihiro Kubota ,  Michio Hayakawa ,  Yoshihiko Ikemoto ,  Yukio Saigo ,  Naomi Miyaji

IPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/433 ,  H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/29 ,  H01L24/49 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The semiconductor chip is formed on the metallic film. A pad formed on the semiconductor chip is connected to the metallic film by a wire. A sealing layer is formed on the metallic film. Leads are formed on the glass layer. A connecting layer is formed on the metallic film and contains electrically conductive particles. The connecting layer is in contact with a lead for a power supply system and connecting the metallic film to the lead.

摘要翻译： 具有密封半导体器件的封装的半导体器件包括基底，并且在基底的表面上形成金属膜。 半导体芯片形成在金属膜上。 形成在半导体芯片上的焊盘通过导线连接到金属膜。 在金属膜上形成密封层。 导线形成在玻璃层上。 在金属膜上形成连接层，并含有导电粒子。 连接层与用于电源系统的引线接触并将金属膜连接到引线。

公开(公告)号：US06271583B1

公开(公告)日：2001-08-07

申请号：US09097668

申请日：1998-06-16

申请人： Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

发明人： Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Kazuto Tsuji

IPC分类号： H01L2348

CPC分类号： H05K1/0243 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/10287 ,  H05K2201/10477 ,  H05K2201/10659 ,  H05K2201/10689 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device includes a substrate having a first surface, a second surface and at least one conductor part which are exposed at both the first and second surfaces of the substrate, a semiconductor chip provided on the first surface of the substrate and having a plurality of electrode pads, a plurality of leads, a plurality of bonding-wires electrically connecting the leads and the conductor parts to corresponding ones of the electrode pads of the semiconductor chip, and a resin package encapsulating the semiconductor chip, a part of the leads, and the substrate so that the conductor parts are exposed at the second surface of the substrate.

摘要翻译： 半导体器件包括具有第一表面，第二表面和暴露于基板的第一和第二表面的至少一个导体部分的基板，设置在基板的第一表面上的半导体芯片， 电极焊盘，多个引线，将引线和导体部分电连接到半导体芯片的对应的电极焊盘的多个接合线以及封装半导体芯片的树脂封装，引线的一部分和 基板，使得导体部分在基板的第二表面处露出。

公开(公告)号：US6159770A

公开(公告)日：2000-12-12

申请号：US192445

申请日：1998-11-16

申请人： Masafumi Tetaka ,  Shinichiro Maki ,  Nobuo Ohyama ,  Seiichi Orimo ,  Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Akihiro Shigeno ,  Ryoichi Yokoyama ,  Fumitoshi Fujisaki ,  Masao Fukunaga ,  Kazuto Tsuji ,  Terumi Kamifukumoto ,  Kenji Itasaka ,  Masanori Onodera

发明人： Masafumi Tetaka ,  Shinichiro Maki ,  Nobuo Ohyama ,  Seiichi Orimo ,  Hideharu Sakoda ,  Yoshiyuki Yoneda ,  Akihiro Shigeno ,  Ryoichi Yokoyama ,  Fumitoshi Fujisaki ,  Masao Fukunaga ,  Kazuto Tsuji ,  Terumi Kamifukumoto ,  Kenji Itasaka ,  Masanori Onodera

IPC分类号： H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31 ,  H01L25/10 ,  H01L29/06 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H01L21/44 ,  H01L21/50 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L24/85 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85365 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10161 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.

摘要翻译： 提供了一种制造半导体器件的方法，其包括树脂封装，密封半导体元件和外部连接端子，分别形成在树脂封装上的树脂突起和设置在树脂突起上的金属膜部分。 半导体元件安装到具有位于与树脂突起的位置对应的位置的凹部的引线框架上，金属膜部件设置在凹部中。 半导体元件电连接到金属膜部件。 密封半导体元件和栅极部分的树脂封装与树脂封装件一体形成。 引线框架被蚀刻，使得树脂封装件与金属层部件一起与引线框架分离。 树脂封装件附接到设置在框架上的胶带并用作载体。

公开(公告)号：US6025650A

公开(公告)日：2000-02-15

申请号：US961243

申请日：1997-10-30

申请人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Yoshiyuki Yoneda ,  Hideharu Sakoda ,  Ryuuji Nomoto ,  Eiji Watanabe ,  Seiichi Orimo ,  Masanori Onodera ,  Junichi Kasai

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495 ,  H01L23/48 ,  H01L29/41

CPC分类号： H01L21/6835 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/49 ,  H01L2221/68377 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01043 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165

摘要： This invention relates to a semiconductor device in which a plurality of outer terminals are arranged in a lattice formation on a flat surface. The semiconductor device comprises a semiconductor chip having a plurality of pads, a resin portion sealing said semiconductor chip and a terminal portion in which a prescribed number of pole terminals electrically connected to said pads provided in said semiconductor chip are provided, said pole terminals being exposed from said resin portion. According to the invention, a cost for production is reduced and a reliability and electrical characteristics can be improved.

摘要翻译： 本发明涉及一种半导体器件，其中多个外部端子以平坦表面的格子状排列。 半导体器件包括具有多个焊盘的半导体芯片，密封所述半导体芯片的树脂部分和设置有电连接到设置在所述半导体芯片中的所述焊盘的规定数量的极端子的端子部分，所述极端子露出 从所述树脂部分。 根据本发明，生产成本降低，并且可以提高可靠性和电气特性。