利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

42 条记录 (耗时 0.047 秒)

    OPTICAL FILM CUTTING METHOD AND OPTICAL FILM
    31.
    发明申请
    OPTICAL FILM CUTTING METHOD AND OPTICAL FILM 审中-公开
    光学薄膜切割方法和光学薄膜

    公开(公告)号：US20100116800A1

    公开(公告)日：2010-05-13

    申请号：US12438234

    申请日：2007-08-20

    申请人： Kanji NISHIDA ,  Atsushi HINO ,  Takaichi AMANO ,  Kazuo KITADA

    发明人： Kanji NISHIDA ,  Atsushi HINO ,  Takaichi AMANO ,  Kazuo KITADA

    IPC分类号： B23K26/38

    CPC分类号： B23K26/38 ,  B23K26/40 ,  B23K2101/18 ,  B23K2103/16 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50

    摘要： This invention relates to an optical film cutting method which includes cutting an optical film by irradiating the optical film with a laser beam under conditions that an energy per unit length is 0.12 to 0.167 J/mm and that a continuous irradiation time is 0.1 msec or less; as well as to an optical film that is cut by the cutting method and has a size of a raised part generated on a cutting surface thereof of 30 μm or less. According to the optical film cutting method of this invention, it is possible to maintain the raised part size on the optical film cutting surface as small as possible even in the case where the laser beam has characteristics of a gaussian beam, thereby enabling prevention of bonding defect and optical defect when the optical film is incorporated into various optical panels.

    摘要翻译： 本发明涉及一种光学膜切割方法，其包括：在每单位长度的能量为0.12〜0.167J / mm，连续照射时间为0.1msec以下的条件下，用激光照射光学膜切断光学膜 ; 以及通过切割方法切割并且在其切割表面上产生的凸起部分的尺寸为30μm以下的光学膜。 根据本发明的光学膜切割方法，即使在激光束具有高斯光束的特性的情况下，也可以将光学膜切割面上的隆起部分尺寸保持在尽可能小的位置，从而能够防止接合 当光学膜被并入各种光学面板时的缺陷和光学缺陷。

    Method for producing optical member and method for producing molding die for optical member
    34.
    发明申请
    Method for producing optical member and method for producing molding die for optical member 审中-公开
    光学部件的制造方法及其制造方法

    公开(公告)号：US20080061028A1

    公开(公告)日：2008-03-13

    申请号：US11892112

    申请日：2007-08-20

    申请人： Ichiro Amino ,  Atsushi Hino ,  Hironaka Fujii ,  Noriaki Harada

    发明人： Ichiro Amino ,  Atsushi Hino ,  Hironaka Fujii ,  Noriaki Harada

    IPC分类号： B29D11/00

    CPC分类号： B29D11/00278 ,  G02B3/0031 ,  G02B3/0056

    摘要： The present invention provides a method for producing an optical member including the steps of subjecting a surface of a resin film to laser beam irradiation via a projection mask,.while sequentially moving either the resin film or the projection mask, or the both, and etching the resin film plural times to work into the shape of a lens, wherein the projection mask comprises plural light-transmitting parts or light-shielding parts having gradually different sizes; and a method for producing a molding die for the optical member. The method for producing an optical member and the method for producing a molding die for an optical member can be suitably used in, for example, a microlens sheet, a light-condensing sheet, a light-diffusing sheet, or the like.

    摘要翻译： 本发明提供了一种制造光学部件的方法，包括以下步骤：通过投影掩模对树脂膜的表面进行激光束照射，同时依次移动树脂膜或投影掩模或两者，并蚀刻 树脂膜多次工作成透镜形状，其中投影掩模包括具有逐渐不同尺寸的多个透光部分或遮光部分; 以及用于制造用于光学部件的成型模具的方法。 光学部件的制造方法以及光学部件的成形用模具的制造方法可以适用于例如微透镜片，聚光片，光漫射片等。

    Method of producing laser-processed product and adhesive sheet, for laser processing used therefor
    36.
    发明申请
    Method of producing laser-processed product and adhesive sheet, for laser processing used therefor 审中-公开
    生产激光加工产品和粘合片的方法，用于激光加工

    公开(公告)号：US20060246279A1

    公开(公告)日：2006-11-02

    申请号：US10554540

    申请日：2004-04-19

    申请人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

    发明人： Masakatsu Urairi ,  Atsushi Hino ,  Naoyuki Matsuo ,  Tomokazu Takahashi ,  Takeshi Matsumura ,  Syouji Yamamoto

    IPC分类号： B32B7/12

    CPC分类号： H05K3/0029 ,  B23K26/18 ,  H05K2203/0214 ,  Y10T156/1052 ,  Y10T428/28 ,  Y10T428/2809

    摘要： A manufacturing method of laser processed parts is characterized in that at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet (2) for laser processing, using a material having specified physical properties, and this method comprises a step of adhering the pressure-sensitive adhesive sheet (2) for laser processing to the laser beam exit side of the work (1) by way of the pressure-sensitive adhesive layer, a step of processing the work by irradiating the work with a laser beam (6) of within 2 times of the irradiation intensity for forming a through-hole in the work (1), at higher than the irradiation intensity of threshold for inducing ablation of the work (1), and a step of peeling the pressure-sensitive adhesive sheet (2) for laser processing from the work (1) after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.

    摘要翻译： 激光加工部件的制造方法的特征在于，使用具有特定物理性质的材料，至少在基材上设置作为激光加工用粘合片（2）的压敏粘合剂层，该方法 包括通过粘合剂层将用于激光加工的压敏粘合片（2）粘附到工件（1）的激光束出射侧的步骤，通过照射工件来处理工件的步骤 在用于在工件（1）中形成通孔的照射强度的2倍以内的激光束（6），高于用于引起工件（1）的烧蚀的阈值的照射强度，以及剥离步骤 用于加工后的工件（1）的激光加工用压敏粘合片（2）。 因此，可以有效地抑制由于分解物的工作表面的污染，能够容易且高生产率地制造激光加工部件。

    Flexible wiring board
    38.
    发明授权
    Flexible wiring board 失效
    柔性布线板

    公开(公告)号：US06373709B1

    公开(公告)日：2002-04-16

    申请号：US09556123

    申请日：2000-04-20

    申请人： Atsushi Hino ,  Hitoshi Ishizaka

    发明人： Atsushi Hino ,  Hitoshi Ishizaka

    IPC分类号： H05K100

    CPC分类号： B82Y25/00 ,  B82Y10/00 ,  G11B5/3903 ,  G11B5/40 ,  G11B5/455 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/486 ,  G11B2005/3996 ,  H05K1/0256 ,  H05K1/0259 ,  H05K1/0268 ,  H05K1/0293 ,  H05K1/118 ,  H05K3/28 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09972 ,  H05K2203/175

    摘要： A flexible wiring board that can bridge wires and also can prevent production of conductive foreign materials in use, to secure good performance of a magnetic head. The flexible wiring board for connecting therethrough a suspension substrate having mounted thereon a magnetic head of a hard disk drive and a control circuit substrate for actuating the magnetic head includes a short-circuit forming portion for forming a shorting portion for bridging wires to prevent electrostatic destruction of the magnetic head; and a cut for removing the shorting portion. When the flexible wiring board is cut along the cut, the shorting portion can be removed without producing conductive foreign material resulting from the cutting off of the shorting portion.

    摘要翻译： 可以桥接电线的柔性布线板，也可以防止使用中导电异物的生产，以确保磁头的良好性能。 用于通过其安装有硬盘驱动器的磁头和用于致动磁头的控制电路基板的悬置基板的柔性布线板包括短路形成部分，用于形成用于桥接电线的短路部分以防止静电破坏 的磁头; 以及用于去除短路部的切口。 当沿着切口切割柔性布线板时，可以去除短路部分而不会由于短路部分的切断而产生导电异物。

    Process for producing an anisotropic conductive film
    40.
    发明授权
    Process for producing an anisotropic conductive film 失效
    各向异性导电膜的制造方法

    公开(公告)号：US5188702A

    公开(公告)日：1993-02-23

    申请号：US872504

    申请日：1992-04-23

    申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

    发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

    IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

    CPC分类号： H01R12/714

    摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

    摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。