公开(公告)号：US20100144137A1

公开(公告)日：2010-06-10

申请号：US12579483

申请日：2009-10-15

Applicant: Kwang-yong LEE ,  Jong-gi Lee ,  Min-ill Kim ,  Min-seung Yoon ,  Ji-seok Hong

Inventor： Kwang-yong LEE ,  Jong-gi Lee ,  Min-ill Kim ,  Min-seung Yoon ,  Ji-seok Hong

IPC: H01L21/768

CPC classification number: H01L21/76898 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/81 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16146 ,  H01L2224/17181 ,  H01L2224/24145 ,  H01L2224/81097 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method of interconnecting semiconductor devices by using capillary motion, thereby simplifying fabricating operations, reducing fabricating costs, and simultaneously filling of through-silicon-vias (TSVs) and interconnecting semiconductor devices. The method includes preparing a first semiconductor device in which first TSVs are formed, positioning solder balls respectively on the first TSVs, performing a back-lap operation on the first semiconductor device, positioning a second semiconductor device, in which second TSVs are formed, above the first semiconductor device on which the solder balls are positioned, and performing a reflow operation such that the solder balls fill the first and second TSVs due to capillary motion.

Abstract translation: 通过使用毛细管运动来互连半导体器件的方法，从而简化了制造操作，降低了制造成本，同时填充了通过硅通孔（TSV）和互连半导体器件。 该方法包括制备其中形成第一TSV的第一半导体器件，分别将焊球定位在第一TSV上，在第一半导体器件上执行回搭操作，将形成有第二TSV的第二半导体器件定位在其中，形成第二TSV 焊球位于其上的第一半导体器件，并且执行回流操作，使得焊球由于毛细管运动而填充第一和第二TSV。

公开(公告)号：US20090193827A1

公开(公告)日：2009-08-06

申请号：US12261481

申请日：2008-10-30

Applicant: Kwang Yong Lee ,  Young Jo Park ,  Dong Han Kim ,  Jung Yong Park ,  Jae Ho Jeong

Inventor： Kwang Yong Lee ,  Young Jo Park ,  Dong Han Kim ,  Jung Yong Park ,  Jae Ho Jeong

IPC: B60H1/32 ,  F25B5/02 ,  F25B49/02

CPC classification number: B60H1/00285 ,  B60H1/323 ,  B60H2001/00307 ,  B60H2001/00942

Abstract: An internal cooling apparatus for automobiles includes a first expansion valve for spraying a coolant to a main evaporator through a high-pressure pipe, a compressor receiving the coolant evaporated in the main evaporator through a low-pressure pipe, a condenser receiving the coolant compressed in the compressor, and a plurality of sub-evaporators each being installed inside of a seat to contact an automobile passenger. One end of each of the sub-evaporators is communicated with the high-pressure pipe and the other end thereof is communicated with the low-pressure pipe such that part of the coolant sprayed through the first expansion valve is supplied to the compressor via each of the sub-evaporators.

Abstract translation: 用于汽车的内部冷却装置包括：第一膨胀阀，用于通过高压管将冷却剂喷射到主蒸发器;压缩机，其通过低压管接收在主蒸发器中蒸发的冷却剂;冷凝器，接收压缩在 压缩机和多个副蒸发器，其各自安装在座椅内部以接触汽车乘客。 每个副蒸发器的一端与高压管连通，另一端与低压管连通，使得通过第一膨胀阀喷射的冷却剂的一部分通过 副蒸发器。

公开(公告)号：US20090188704A1

公开(公告)日：2009-07-30

申请号：US12357693

申请日：2009-01-22

Applicant: Kwang-Yong LEE ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

Inventor： Kwang-Yong LEE ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

IPC: H01R12/30

CPC classification number: H05K3/3494 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K1/0212 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2203/101 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

Abstract translation: 安装基板包括基板，接合焊盘和感应加热垫。 接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。 感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。 响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。 因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

公开(公告)号：US10564759B2

公开(公告)日：2020-02-18

申请号：US13335608

申请日：2011-12-22

Applicant: Kwang-Yong Lee ,  Woo-Jin Jung ,  Beom-Soo Cho ,  Yong-Gook Park

Inventor： Kwang-Yong Lee ,  Woo-Jin Jung ,  Beom-Soo Cho ,  Yong-Gook Park

IPC: G06F3/041 ,  G06F3/048 ,  G06F3/0488

Abstract: An apparatus performs a method for providing a touch interface. The method includes receiving a touch input from a touch detection unit, detecting touch characteristics according to the touch input, and generating events different from each other according to the detected touch characteristics.

公开(公告)号：US09698066B2

公开(公告)日：2017-07-04

申请号：US15201675

申请日：2016-07-05

Applicant: Bo-Ra Lee ,  Jae-Ho Jeong ,  Nam-Gyu Baek ,  Hyo-Seok Woo ,  Hyun-Sook Yoon ,  Kwang-Yong Lee

Inventor： Bo-Ra Lee ,  Jae-Ho Jeong ,  Nam-Gyu Baek ,  Hyo-Seok Woo ,  Hyun-Sook Yoon ,  Kwang-Yong Lee

IPC: H01L21/66 ,  H01L29/423 ,  H01L27/1157 ,  H01L23/00

CPC classification number: H01L22/34 ,  H01L23/562 ,  H01L27/1157 ,  H01L27/11575 ,  H01L27/11582

Abstract: A semiconductor chip includes: a gate pattern on a substrate; an interlayer insulation layer on the gate pattern; a first wiring structure on the interlayer insulation layer; and a defect detection circuit electrically connected to the gate pattern and the first wiring structure. The first wiring structure is electrically connected to the gate pattern via a contact plug through the interlayer insulation layer. The defect detection circuit is electrically connected to the gate pattern and the first wiring structure, and the defect detection circuit is configured to detect defects in the first wiring structure and at least one of the gate pattern and the substrate.

公开(公告)号：US08772084B2

公开(公告)日：2014-07-08

申请号：US13618041

申请日：2012-09-14

Applicant: Jong-Gi Lee ,  Kwang-Yong Lee ,  Min-Ho Lee

Inventor： Jong-Gi Lee ,  Kwang-Yong Lee ,  Min-Ho Lee

IPC: H01L21/44 ,  H01L23/02

CPC classification number: H01L24/82 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/16225 ,  H01L2224/24011 ,  H01L2224/2405 ,  H01L2224/24145 ,  H01L2224/244 ,  H01L2224/24998 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

Abstract: A first semiconductor chip having a first projection electrode formed on an upper surface thereof is prepared. A second semiconductor chip having a second projection electrode is mounted on the first semiconductor chip to expose the first projection electrode. An insulating film is formed between the first projection electrode and the second projection electrode. A groove is formed in the insulating film. An interconnection configured to fill an inside of the groove and connected to the first projection electrode and the second projection electrode is formed.

Abstract translation: 制备具有形成在其上表面上的第一突起电极的第一半导体芯片。 具有第二投影电极的第二半导体芯片安装在第一半导体芯片上以暴露第一投影电极。 在第一投影电极和第二投影电极之间形成绝缘膜。 在绝缘膜中形成凹槽。 形成了用于填充凹槽内部并连接到第一突出电极和第二突起电极的互连。

公开(公告)号：US08254140B2

公开(公告)日：2012-08-28

申请号：US12357693

申请日：2009-01-22

Applicant: Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

Inventor： Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

IPC: H05K7/10

CPC classification number: H05K3/3494 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K1/0212 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2203/101 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

Abstract translation: 安装基板包括基板，接合焊盘和感应加热垫。 接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。 感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。 响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。 因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

公开(公告)号：US08051555B2

公开(公告)日：2011-11-08

申请号：US12615585

申请日：2009-11-10

Applicant: Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

Inventor： Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

IPC: B23B19/00

CPC classification number: H05K3/225 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/3025 ,  H05K3/3494 ,  H05K2203/162 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electrically connect the semiconductor chip to the circuit board. The testing unit tests the semiconductor chip, and, when the testing unit determines that the first semiconductor chip is not functioning properly, the heating unit reheats the solder connection to remove the non-functioning semiconductor chip from the circuit board.

Abstract translation: 组装装置包括芯片传送单元，加热单元，测试单元和输出单元。 芯片传送单元将第一半导体芯片安装到电路板以形成电路。 加热单元加热焊接连接以将半导体芯片电连接到电路板。 测试单元测试半导体芯片，并且当测试单元确定第一半导体芯片不能正常工作时，加热单元重新加热焊接连接以从电路板去除不起作用的半导体芯片。

公开(公告)号：US20110087816A1

公开(公告)日：2011-04-14

申请号：US12860129

申请日：2010-08-20

Applicant: Bum-hee SEO ,  Cheon-moo LEE ,  Kwang-yong LEE ,  Sang-jin LEE

Inventor： Bum-hee SEO ,  Cheon-moo LEE ,  Kwang-yong LEE ,  Sang-jin LEE

IPC: G06F13/24 ,  G06F15/00

CPC classification number: G06F1/3228 ,  G06F1/3203

Abstract: A computer system and a control method thereof, the computer system including: a processor which executes a program; a communication unit which communicates with an external device; a main body which is provided with the processor. A cover which can be opened and shut with regard to the main body; an open/shut sensor which senses whether the cover is open or shut; and a controller which interrupts an operation of the communication unit if the open/shut sensor senses that the cover is shut.

Abstract translation: 一种计算机系统及其控制方法，所述计算机系统包括：执行程序的处理器; 与外部设备通信的通信单元; 设有处理器的主体。 可以关于主体打开和关闭的盖子; 一个开/关传感器，用于检测盖子是否打开或关闭; 以及如果所述打开/关闭传感器感测到所述盖被关闭则中断所述通信单元的操作的控制器。

公开(公告)号：US20100115763A1

公开(公告)日：2010-05-13

申请号：US12615585

申请日：2009-11-10

Applicant: Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

Inventor： Minill Kim ,  Taegyeong Chung ,  Jonggi Lee ,  Kwang Yong Lee

IPC: B23P19/00

CPC classification number: H05K3/225 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/3025 ,  H05K3/3494 ,  H05K2203/162 ,  H05K2203/176 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A module apparatus includes a first unit and a second unit adjacent to the first unit. The first unit includes a chip transfer unit mounting semiconductor chips on a printed circuit board and a heat unit applying heat on a solder ball of the semiconductor chip. The second unit includes a tester testing an electrical connection state between the printed circuit board and the semiconductor chip, a bad board storage storing the printed circuit board on which a semiconductor chip determined as bad in the tester is mounted, and a board moving member moving the printed circuit board stored in the bad board storage into the first unit.

Abstract translation: 模块装置包括与第一单元相邻的第一单元和第二单元。 第一单元包括在印刷电路板上安装半导体芯片的芯片传送单元和在半导体芯片的焊球上施加热量的加热单元。 第二单元包括测试印刷电路板和半导体芯片之间的电气连接状态的测试器，存储存储安装了测试仪中确定为坏的半导体芯片的印刷电路板的坏板存储器，以及板移动部件移动 存储在坏板存储器中的印刷电路板存储到第一单元中。