公开(公告)号：US20090188704A1

公开(公告)日：2009-07-30

申请号：US12357693

申请日：2009-01-22

申请人： Kwang-Yong LEE ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

发明人： Kwang-Yong LEE ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

IPC分类号： H01R12/30

CPC分类号： H05K3/3494 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K1/0212 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2203/101 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

摘要翻译： 安装基板包括基板，接合焊盘和感应加热垫。 接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。 感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。 响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。 因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

公开(公告)号：US08254140B2

公开(公告)日：2012-08-28

申请号：US12357693

申请日：2009-01-22

申请人： Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

发明人： Kwang-Yong Lee ,  Jong-Gi Lee ,  Sun-Won Kang ,  Ji-Seok Hong

IPC分类号： H05K7/10

CPC分类号： H05K3/3494 ,  H01L21/565 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81222 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H05K1/0212 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2203/101 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package.

摘要翻译： 安装基板包括基板，接合焊盘和感应加热垫。 接合焊盘形成在基板上，并且粘附到焊球以将半导体芯片安装在基板上。 感应加热垫设置在接合焊盘附近，感应加热垫被施加的交变磁场感应加热以回流焊球。 响应于所施加的交变磁场的频率具有大于皮肤深度的直径的感应加热垫响应于交变磁场的低频带被选择性地感应加热。 因此，在焊球的回流处理中，可以将半导体芯片安装在安装基板上以完成半导体封装而不损坏安装基板，从而提高完成的半导体封装的可靠性。

公开(公告)号：US08420989B2

公开(公告)日：2013-04-16

申请号：US12615507

申请日：2009-11-10

申请人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong ,  Hyun jeong Woo

发明人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong ,  Hyun jeong Woo

IPC分类号： H05B6/10

CPC分类号： H05B6/36 ,  B23K1/0016 ,  B23K1/002 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/81222 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01074 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2203/101

摘要： An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

摘要翻译： 封装半导体芯片的装置包括配置为使用感应加热来回流半导体芯片的焊球的线圈。 线圈包括第一主体，平行于第一主体的第二主体，从第一主体延伸到第二主体的第三主体。 第一和第二主体相对于设置在它们之间的垂直平面是对称的。 第一和第二主体具有彼此面对的倾斜表面，并且倾斜表面彼此向下延伸。

公开(公告)号：US20100096754A1

公开(公告)日：2010-04-22

申请号：US12588477

申请日：2009-10-16

申请人： Jonggi Lee ,  SunWon Kang ,  Young Lyong Kim ,  Jongho Lee ,  Chul-Yong Jang ,  Minill Kim ,  Eunchul Ahn ,  Kwang Yong Lee ,  Seungduk Baek ,  Ji-Seok Hong

发明人： Jonggi Lee ,  SunWon Kang ,  Young Lyong Kim ,  Jongho Lee ,  Chul-Yong Jang ,  Minill Kim ,  Eunchul Ahn ,  Kwang Yong Lee ,  Seungduk Baek ,  Ji-Seok Hong

IPC分类号： H01L23/498 ,  H01L21/768

CPC分类号： H01L24/13 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/525 ,  H01L24/06 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0233 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/1191 ,  H01L2224/13012 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01083 ,  H01L2924/00012 ,  H01L2924/00

摘要： Provided is a semiconductor package, a semiconductor module and a method for fabricating the semiconductor package. The method provides a substrate including a bonding pad. The method forms a dielectric layer for exposing the bonding pad on the substrate. The method forms a redistribution line which is electrically connected to the bonding pad, on the dielectric layer. The method forms an external terminal which is electrically connected to the bonding pad without using a solder mask which limits a position of the external terminal, on the redistribution line.

摘要翻译： 提供半导体封装，半导体模块和制造半导体封装的方法。 该方法提供了包括接合焊盘的衬底。 该方法形成用于使衬底上的焊盘露出的介电层。 该方法形成在电介质层上电连接到接合焊盘的再分配线。 该方法形成外部端子，该外部端子电连接到接合焊盘，而不使用在再分配线上限制外部端子的位置的焊接掩模。

公开(公告)号：US08324522B2

公开(公告)日：2012-12-04

申请号：US12591821

申请日：2009-12-02

申请人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

发明人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC分类号： B23K3/00 ,  B23K26/00

CPC分类号： B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

摘要翻译： 提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。 回流装置可以包括线圈，支撑构件和移动构件。 线圈可以从电源接收电流，以使用感应加热方法加热焊球。 支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。 移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

公开(公告)号：US20100181293A1

公开(公告)日：2010-07-22

申请号：US12591821

申请日：2009-12-02

申请人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

发明人： Minill Kim ,  Kwang Yong Lee ,  Jonggi Lee ,  Ji-Seok Hong

IPC分类号： B23K1/00

CPC分类号： B23K1/00 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/008 ,  B23K3/0475 ,  B23K3/087 ,  B23K2101/42 ,  H01L24/75 ,  H01L24/81 ,  H05K3/3494 ,  H05K2203/101 ,  H05K2203/1509

摘要： Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

摘要翻译： 提供了一种用于进行设置到半导体芯片的焊球的回流处理的装置。 回流装置可以包括线圈，支撑构件和移动构件。 线圈可以从电源接收电流，以使用感应加热方法加热焊球。 支撑构件可以设置在线圈的前部或后部，并且可以支撑安装有半导体芯片的印刷电路板。 移动构件可以移动印刷电路板，使得印刷电路对象通过由线圈包围的内部空间。

公开(公告)号：US08552546B2

公开(公告)日：2013-10-08

申请号：US12896091

申请日：2010-10-01

申请人： In-Sang Song ,  Seok-Keun Lim ,  In-Wook Jung ,  Bong-Ken Yu ,  Sang-Wook Park ,  Ji-Seok Hong

发明人： In-Sang Song ,  Seok-Keun Lim ,  In-Wook Jung ,  Bong-Ken Yu ,  Sang-Wook Park ,  Ji-Seok Hong

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L25/0657 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/481 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/078 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips.

摘要翻译： 提供半导体封装。 半导体封装可以包括具有顺序地堆叠在衬底上的第一半导体芯片的第一半导体封装。 在示例性实施例中，第一半导体芯片可以具有级联布置，其中半导体芯片的第一侧和第二侧限定级联图案。 级联布置可以在第一方向上延伸以限定第一半导体芯片的第一侧和基板之间的空间。 半导体封装还可以包括在半导体芯片的第二面处的至少一个第一连接布线，所述至少一个第一连接布线被配置为将衬底与第一半导体芯片电连接。 此外，半导体封装还可以包括与第一半导体芯片的第一侧相邻的第一填充辅助结构。

公开(公告)号：US20120234497A1

公开(公告)日：2012-09-20

申请号：US13418795

申请日：2012-03-13

申请人： Il Young Han ,  Ho Geon Song ,  Sang Wook Park ,  Ji-Seok Hong

发明人： Il Young Han ,  Ho Geon Song ,  Sang Wook Park ,  Ji-Seok Hong

IPC分类号： B32B38/10

CPC分类号： H01L21/67092 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/799 ,  H01L24/94 ,  H01L24/96 ,  H01L24/98 ,  H01L25/0652 ,  H01L2221/6834 ,  H01L2221/68372 ,  H01L2221/68381 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/7999 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T156/11 ,  Y10T156/19 ,  H01L2224/81 ,  H01L2924/00

摘要： A debonder to manufacture a semiconductor that includes: a stage to support a carrier wafer that is attached to a chip stack assembly by a temporary adhesive layer coated on the surface of the carrier wafer; a chuck arranged above the stage to selectively secure the chip stack assembly; a lifting unit to lift the chuck from the stage; a lateral driving unit to move the chuck laterally with respect to the stage; and a controller to control the lifting unit and the lateral driving unit.

摘要翻译： 一种制造半导体的剥离器，包括：支撑通过涂覆在载体晶片的表面上的临时粘合剂层附着到芯片堆叠组件的载体晶片的载物台; 卡盘，布置在平台上方以选择性地固定芯片堆叠组件; 提升装置，用于将卡盘从舞台上抬起; 横向驱动单元，用于相对于所述平台横向移动所述卡盘; 以及控制器，用于控制提升单元和横向驱动单元。

公开(公告)号：US20110079890A1

公开(公告)日：2011-04-07

申请号：US12896091

申请日：2010-10-01

申请人： In-Sang Song ,  Seok-Keun Lim ,  In-Wook Jung ,  Bong-Ken Yu ,  Sang-Wook Park ,  Ji-Seok Hong

发明人： In-Sang Song ,  Seok-Keun Lim ,  In-Wook Jung ,  Bong-Ken Yu ,  Sang-Wook Park ,  Ji-Seok Hong

IPC分类号： H01L25/04

CPC分类号： H01L25/0657 ,  H01L23/16 ,  H01L23/3121 ,  H01L23/481 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2224/85399 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/078 ,  H01L2924/10158 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： Provided is a semiconductor package. The semiconductor package may include a first semiconductor package having first semiconductor chips sequentially stacked on a substrate. In example embodiments, the first semiconductor chips may have a cascaded arrangement in which first sides and second sides of the semiconductor chips define cascade patterns. The cascaded arrangement may extend in a first direction to define a space between the first sides of the first semiconductor chips and the substrate. The semiconductor package may also include at least one first connection wiring at the second sides of the semiconductor chips, the at least one first connection wiring being configured to electrically connect the substrate with the first semiconductor chips. In addition, the semiconductor package may further include a first filling auxiliary structure adjacent to the first sides of the first semiconductor chips.

摘要翻译： 提供半导体封装。 半导体封装可以包括具有顺序地堆叠在衬底上的第一半导体芯片的第一半导体封装。 在示例性实施例中，第一半导体芯片可以具有级联布置，其中半导体芯片的第一侧和第二侧限定级联图案。 级联布置可以在第一方向上延伸以限定第一半导体芯片的第一侧和基板之间的空间。 半导体封装还可以包括在半导体芯片的第二面处的至少一个第一连接布线，所述至少一个第一连接布线被配置为将衬底与第一半导体芯片电连接。 此外，半导体封装还可以包括与第一半导体芯片的第一侧相邻的第一填充辅助结构。