公开(公告)号：US08387674B2

公开(公告)日：2013-03-05

申请号：US12054097

申请日：2008-03-24

申请人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

发明人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

IPC分类号： B29C65/00

CPC分类号： H01L25/50 ,  H01L21/67051 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/8301 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01094 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T156/14 ,  H01L2924/00

摘要： The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

公开(公告)号：US20090317214A1

公开(公告)日：2009-12-24

申请号：US12435861

申请日：2009-05-05

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Ming-che Ho ,  Chien-Ling Hwang ,  Jui-Pin Hung

IPC分类号： H01L21/00 ,  H01L21/677 ,  H01L21/67 ,  B65D81/26 ,  F25B29/00

CPC分类号： H01L21/67772 ,  H01L21/67017 ,  Y10S414/135

摘要： A semiconductor manufacturing system, an interface system, a carrier, and a method for providing an ambient controlled environment is disclosed. The semiconductor manufacturing system comprises a plurality of process chambers; at least one interface system, wherein the interface system includes a first ambient control element; at least one carrier, wherein the carrier comprises a second ambient control element; and a control module coupled to the plurality of process chambers, the at least one interface system, and the at least one carrier.

摘要翻译： 公开了一种半导体制造系统，接口系统，载体和用于提供环境受控环境的方法。 半导体制造系统包括多个处理室; 至少一个接口系统，其中所述接口系统包括第一环境控制元件; 至少一个载体，其中载体包括第二环境控制元件; 以及耦合到所述多个处理室，所述至少一个接口系统和所述至少一个载体的控制模块。

公开(公告)号：US20080295412A1

公开(公告)日：2008-12-04

申请号：US11755508

申请日：2007-05-30

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

IPC分类号： E06B7/16 ,  H01L21/00

CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

公开(公告)号：US08109407B2

公开(公告)日：2012-02-07

申请号：US11755508

申请日：2007-05-30

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Jui-Pin Hung ,  Ming-Shih Yeh

IPC分类号： B65D45/28 ,  B65D53/06

CPC分类号： H01L21/67373 ,  H01L21/67376 ,  H01L21/67389

摘要： An apparatus includes an enclosure and a door configured to seal the enclosure. The door includes a plate. A rotational apparatus is disposed over the plate. At least one first member with a first arm extends from a first rib of the first member. At least one second member with a second arm extends from a second rib of the second member. The first and second arms are connected to the rotational apparatus. At least one corner member has a first edge. The first edge has a shape corresponding to a shape of a corner of the frame. The corner member is connected to a first end of the third arm. A second end of the third arm is connected to the rotational apparatus. A sealing material is disposed along a first longitudinal side of the first rib and a second longitudinal side of the second rib.

摘要翻译： 一种装置包括外壳和构造成密封外壳的门。 门包括一个板。 旋转装置设置在板上。 具有第一臂的至少一个第一构件从第一构件的第一肋延伸。 具有第二臂的至少一个第二构件从第二构件的第二肋延伸。 第一和第二臂连接到旋转装置。 至少一个角部件具有第一边缘。 第一边缘具有与框架的角部的形状对应的形状。 角部件连接到第三臂的第一端。 第三臂的第二端连接到旋转装置。 密封材料沿着第一肋的第一纵向侧面和第二肋的第二纵向侧面设置。

公开(公告)号：US20080298933A1

公开(公告)日：2008-12-04

申请号：US11754789

申请日：2007-05-29

申请人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

发明人： Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Fu-Kang Tien ,  Jui-Pin Hung

IPC分类号： H01L21/00

CPC分类号： H01L21/67017 ,  H01L21/67393 ,  H01L21/67772

摘要： An apparatus includes a first enclosure, a first door, at least one first valve, at least one inlet diffuser and at least one substrate holder. The first enclosure has a first opening. The first door is configured to seal the first opening. The first valve is coupled to the first enclosure. The inlet diffuser is coupled to the first valve and configured to provide a first gas with a temperature substantially higher than a temperature of an environment around the first enclosure. Each substrate holder disposed within the first enclosure supports at least one substrate.

摘要翻译： 一种装置包括第一外壳，第一门，至少一个第一阀，至少一个入口扩散器和至少一个基板支架。 第一个外壳具有第一个开口。 第一个门被配置为密封第一个开口。 第一阀联接到第一外壳。 入口扩散器联接到第一阀并且被配置为提供具有基本上高于围绕第一外壳的环境的温度的温度的第一气体。 设置在第一外壳内的每个衬底保持器支撑至少一个衬底。

公开(公告)号：US08946742B2

公开(公告)日：2015-02-03

申请号：US12897124

申请日：2010-10-04

申请人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

发明人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC分类号： H01L33/00 ,  H01L21/768 ,  H01L21/683 ,  H01L23/48 ,  H01L33/48 ,  H01L33/64 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L23/00 ,  H01L33/62

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.

摘要翻译： 具有上述通孔硅衬底（或通孔）的基板消除了对导电凸块的需要。 流程非常简单，成本效益高。 所描述的结构将单独的TSV，再分配层和导电凸块结构组合成单个结构。 通过组合单独的结构，产生具有高散热能力的低电阻电连接。 此外，具有通过硅插头（或通孔或沟槽）的基板还允许将多个芯片封装在一起。 通过硅沟槽可围绕一个或多个芯片，以在制造期间提供防止铜扩散到相邻器件的保护。 此外，具有相似或不同功能的多个芯片可以集成在TSV基板上。 通过具有不同图案的硅插头可以在半导体芯片下使用以改善散热并解决制造问题。

公开(公告)号：US08507940B2

公开(公告)日：2013-08-13

申请号：US12879584

申请日：2010-09-10

申请人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

发明人： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC分类号： H01L33/00

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2933/0066 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The package substrates with through silicon plugs (or vias) described above provide lateral and vertical heat dissipation pathways for semiconductor chips that require thermal management. Designs of through silicon plugs (TSPs) with high duty ratios can most effectively provide heat dissipation. TSP designs with patterns of double-sided combs can provide high duty ratios, such as equal to or greater than 50%. Package substrates with high duty ratios are useful for semiconductor chips that generate large amount of heat. An example of such semiconductor chip is a light-emitting diode (LED) chip.

摘要翻译： 具有上述通孔硅封装（或通孔）的封装衬底为需要热管理的半导体芯片提供侧向和垂直散热​​路径。 具有高占空比的通过硅插头（TSP）的设计可以最有效地提供散热。 具有双面梳状图案的TSP设计可以提供等于或大于50％的高占空比。 具有高占空比的封装衬底对于产生大量热量的半导体芯片是有用的。 这种半导体芯片的例子是发光二极管（LED）芯片。

公开(公告)号：US20090142903A1

公开(公告)日：2009-06-04

申请号：US12054097

申请日：2008-03-24

申请人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

发明人： Chen-Hua Yu ,  Jui-Pin Hung ,  Weng-Jin Wu ,  Jean Wang ,  Wen-Chih Chiou

IPC分类号： H01L21/30 ,  B29C65/00

CPC分类号： H01L25/50 ,  H01L21/67051 ,  H01L24/28 ,  H01L24/75 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/8301 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01094 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/19042 ,  Y10T156/14 ,  H01L2924/00

摘要： The present disclosure provides a bonding apparatus. The bonding apparatus includes a cleaning module designed for cleaning chips; and a chip-to-wafer bonding chamber configured to receive the chips from the cleaning module and designed for bonding the chips to a wafer.

摘要翻译： 本公开提供了一种接合装置。 接合装置包括设计用于清洁芯片的清洁模块; 以及芯片到晶片接合室，其被配置为从所述清洁模块接收所述芯片并被设计用于将所述芯片接合到晶片。

公开(公告)号：US08629043B2

公开(公告)日：2014-01-14

申请号：US13298014

申请日：2011-11-16

申请人： Chung Yu Wang ,  Jui-Pin Hung ,  Chih-Hao Chen ,  Chun-Hsing Su ,  Yi-Chao Mao ,  Kung-Chen Yeh ,  Yi-Lin Tsai ,  Ying-Tz Hung ,  Chin-Fu Kao ,  Shih-Yi Syu ,  Chin-Chuan Chang ,  Hsien-Wen Liu ,  Long Hua Lee

发明人： Chung Yu Wang ,  Jui-Pin Hung ,  Chih-Hao Chen ,  Chun-Hsing Su ,  Yi-Chao Mao ,  Kung-Chen Yeh ,  Yi-Lin Tsai ,  Ying-Tz Hung ,  Chin-Fu Kao ,  Shih-Yi Syu ,  Chin-Chuan Chang ,  Hsien-Wen Liu ,  Long Hua Lee

IPC分类号： H01L21/78

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/11002 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2924/00

摘要： A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.

摘要翻译： 一种方法包括在包括多个管芯的复合晶片上执行切割，其中当执行切割步骤时，复合晶片结合在载体上。 在切割步骤之后，将复合晶片安装在带上。 然后将载体从复合晶片和第一带去粘合。

公开(公告)号：US07981212B2

公开(公告)日：2011-07-19

申请号：US11391563

申请日：2006-03-29

申请人： Fu-Kang Tien ,  Jui-Pin Hung

发明人： Fu-Kang Tien ,  Jui-Pin Hung

IPC分类号： C30B1/04

CPC分类号： H01L21/67115 ,  Y10T117/10 ,  Y10T117/1004 ,  Y10T117/1008

摘要： A flash lamp annealing device comprises a heater plate, a loader, a lamp set and a control circuit. The heater plate heats a wafer to a predetermined temperature. The wafer is loaded on the loader disposed on the heater plate. The lamp set has one or a plurality of lamps to provide the wafer with a power. The control circuit is coupled to the lamp set to control the flash time of the lamp set.

摘要翻译： 闪光灯退火装置包括加热板，装载器，灯组和控制电路。 加热板将晶片加热至预定温度。 将晶片装载在设置在加热板上的装载机上。 灯组具有一个或多个灯以提供晶片的功率。 控制电路耦合到灯组以控制灯组的闪光时间。