公开(公告)号：US20090094825A1

公开(公告)日：2009-04-16

申请号：US12175732

申请日：2008-07-18

申请人： Yasutomo MAEHARA ,  Kenji Iida ,  Tomoyuki Abe ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

发明人： Yasutomo MAEHARA ,  Kenji Iida ,  Tomoyuki Abe ,  Shin Hirano ,  Takashi Nakagawa ,  Hideaki Yoshimura ,  Seigo Yamawaki ,  Norikazu Ozaki

IPC分类号： H05K3/02

CPC分类号： H05K3/427 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0094 ,  H05K3/061 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4611 ,  H05K3/4691 ,  H05K2201/0347 ,  H05K2201/09581 ,  H05K2201/0959 ,  H05K2201/0969 ,  H05K2201/09809 ,  H05K2203/1178 ,  H05K2203/135 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step.

摘要翻译： 制造基板的方法包括以下步骤：在基底构件中形成通孔; 电镀所述基底构件以便用镀层涂覆所述通孔的内表面; 在基底上施加光刻胶; 对光致抗蚀剂进行光学曝光和显影，以形成至少覆盖通孔的平面区域的抗蚀剂图案; 以及蚀刻形成在所述基底构件的表面上的导电层。 形成抗蚀剂图形，以将导电层暴露出距通孔边缘规定距离的区域，并且规定的长度比蚀刻导电层的侧面的距离长 步。

公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US20060114750A1

公开(公告)日：2006-06-01

申请号：US11287301

申请日：2005-11-28

申请人： Kenji Iida ,  Fumiaki Miyahara ,  Kunio Koike ,  Eisaku Shimizu

发明人： Kenji Iida ,  Fumiaki Miyahara ,  Kunio Koike ,  Eisaku Shimizu

IPC分类号： G04B19/30

CPC分类号： G04G9/08 ,  G04C3/146 ,  G04C10/00 ,  G04G21/04 ,  G04R20/08 ,  G04R60/10

摘要： A timepiece includes pointers, motors for driving the pointers, a pointer position detector for detecting the positions of the pointers, a control unit, an electricity storage unit as a power supply, and a voltage detector for detecting the power supply voltage. The control unit controls the pointer position detection by means of the pointer position detector on the basis of the power supply voltage detected by the voltage detector. Therefore, the pointer position detector can be halted when the power supply voltage decreases to less than a specific voltage, and the pointer position detector can be driven while the power supply voltage is low.

摘要翻译： 手表包括指针，用于驱动指针的电动机，用于检测指针位置的指针位置检测器，控制单元，作为电源的蓄电单元，以及用于检测电源电压的电压检测器。 控制单元基于由电压检测器检测到的电源电压，通过指针位置检测器控制指针位置检测。 因此，当电源电压降低到小于特定电压时，可以停止指针位置检测器，并且可以在电源电压低的情况下驱动指针位置检测器。

公开(公告)号：US20050099528A1

公开(公告)日：2005-05-12

申请号：US10813634

申请日：2004-03-31

申请人： Atsuo Soma ,  Kenji Iida ,  Satoru Matsumiya ,  Toshio Hiraishi ,  Hiroyuki Katsurai

发明人： Atsuo Soma ,  Kenji Iida ,  Satoru Matsumiya ,  Toshio Hiraishi ,  Hiroyuki Katsurai

IPC分类号： H04M1/725 ,  H04N5/225 ,  H04N5/232 ,  H04N5/222

CPC分类号： H04N5/23241 ,  H04N5/2256 ,  H04N5/23293

摘要： A mobile terminal device with a camera is provided which can secure emitted light brightness of a camera light unit and save power consumption of the device. During photographing, when the driving power of the camera light unit is increased, driving power for an illumination unit is decreased so that the increase of the total power consumption of the camera light unit and illumination unit can be minimized. In addition, the camera lamp unit and illumination unit are driven by respective driving circuits that share a power supply unit.

摘要翻译： 提供具有相机的移动终端装置，其可以确保照相机灯单元的发射光亮度并节省设备的功率消耗。 在拍摄期间，当照相机灯单元的驱动功率增加时，照明单元的驱动功率降低，从而可以使照相机单元和照明单元的总功耗的增加最小化。 此外，相机灯单元和照明单元由共享电源单元的相应驱动电路驱动。

公开(公告)号：US06696751B2

公开(公告)日：2004-02-24

申请号：US09776631

申请日：2001-02-06

申请人： Atsunori Kajiki ,  Kenji Iida

发明人： Atsunori Kajiki ,  Kenji Iida

IPC分类号： H01L23495

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01083 ,  H01L2224/45099 ,  H01L2924/00

摘要： In conventional semiconductor devices, customarily, it is sought to position the mounting region of a semiconductor element in the center of a package, and hence the dimensions of the package are increased unnecessarily, but the object of the present invention is to avoid unnecessary increasing of the package dimensions, without impairing the required functions of the semiconductor device. Unnecessary increasing of package dimensions is avoided by providing a semiconductor device comprising a package having a semiconductor element mounting region, a first region containing the aforementioned mounting region, and a second region partially adjoining the periphery of the above-described first region.

摘要翻译： 在传统的半导体器件中，通常寻求将半导体元件的安装区域定位在封装的中心，因此不必要地增加封装的尺寸，但是本发明的目的是避免不必要的增加 封装尺寸，而不损害半导体器件的所需功能。 通过提供包括具有半导体元件安装区域的封装，包含上述安装区域的第一区域和与上述第一区域的外围部分相邻的第二区域的半导体器件，避免了封装尺寸的不必要的增加。

公开(公告)号：US06184476B2

公开(公告)日：2001-02-06

申请号：US08878198

申请日：1997-06-18

申请人： Yasuhito Takahashi ,  Yasunaga Kurokawa ,  Kenji Iida ,  Masaru Sumi ,  Yuichiro Ohta ,  Toshiro Katsube ,  Kazuo Nakano ,  Norikazu Ozaki ,  Hiroyuki Katayama

发明人： Yasuhito Takahashi ,  Yasunaga Kurokawa ,  Kenji Iida ,  Masaru Sumi ,  Yuichiro Ohta ,  Toshiro Katsube ,  Kazuo Nakano ,  Norikazu Ozaki ,  Hiroyuki Katayama

IPC分类号： H01R1204

CPC分类号： H05K3/4644 ,  H05K1/0293 ,  H05K3/027 ,  H05K3/048 ,  H05K3/064 ,  H05K3/108 ,  H05K3/243 ,  H05K3/28 ,  H05K3/388 ,  H05K2201/09736 ,  H05K2203/107 ,  H05K2203/175 ,  Y10T29/4902 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A thin multi-layer circuit board having alternately stacked wiring pattern layers, including a top wiring pattern layer and insulating layers on an insulating plate-like substrate. The wiring pattern layers are electronically connected through vias in the insulating layers to form a predetermined circuit pattern by said wiring pattern layers. A metallic barrier layer is formed on the top wiring pattern layer, except at an exclusion zone of the metallic barrier layer. An electronic part-mounting pad layer and a remodeling pad layer are formed on the metallic barrier layer. The remodeling pad layer is arranged adjacent the electronic part-mounting pad layer, with the exclusion zone therebetween.

摘要翻译： 一种薄的多层电路板，具有交替堆叠的布线图案层，其包括顶部布线图案层和绝缘板状基板上的绝缘层。 布线图案层通过绝缘层中的通孔电连接，以通过所述布线图案层形成预定的电路图案。 除了在金属阻挡层的排除区域之外，在顶部布线图案层上形成金属阻挡层。 在金属阻挡层上形成电子部件安装垫层和重塑垫层。 重塑垫层布置在电子部件安装垫层附近，其间具有排除区域。

公开(公告)号：USD382331S

公开(公告)日：1997-08-12

申请号：US45661

申请日：1995-10-26

申请人： Kenji Iida ,  Takayuki Sawada

设计人： Kenji Iida ,  Takayuki Sawada

公开(公告)号：USD376603S

公开(公告)日：1996-12-17

申请号：US47203

申请日：1995-11-29

申请人： Kenji Iida

设计人： Kenji Iida

公开(公告)号：US09252410B2

公开(公告)日：2016-02-02

申请号：US12717181

申请日：2010-03-04

申请人： Akihiro Kosaki ,  Masaaki Iwabe ,  Kenji Iida ,  Shinsuke Azuma ,  Shigeyuki Ogasawara

发明人： Akihiro Kosaki ,  Masaaki Iwabe ,  Kenji Iida ,  Shinsuke Azuma ,  Shigeyuki Ogasawara

IPC分类号： H02G5/00 ,  H01M2/10 ,  H01M2/20 ,  H01M10/42 ,  F16L13/00 ,  F16C1/10 ,  F16C1/26 ,  F16L3/10 ,  H01R25/14 ,  H01M10/0525 ,  H01M10/34

CPC分类号： H01M2/1083 ,  F16C1/105 ,  F16C1/262 ,  F16L3/1041 ,  F16L13/00 ,  H01M2/10 ,  H01M2/1005 ,  H01M2/1022 ,  H01M2/1077 ,  H01M2/20 ,  H01M2/202 ,  H01M10/0525 ,  H01M10/345 ,  H01M10/425 ,  H01R25/14 ,  Y02T10/7011

摘要： A power storage apparatus includes a power storage module having a plurality of power storage elements which are aligned in one direction; a device placed adjacently to the power storage module in the direction of the alignment of the power storage elements; a high-voltage cable used in charge and discharge of the power storage module; and a support structure configured to support the high-voltage cable at a plurality of points to position the high-voltage cable along a reference path. The high-voltage cable is configured to electrically connect an electrode terminal of the power storage module to the device. The electrode terminal is one of two electrode terminals of the power storage module and is located on a farther side of the power storage module from the device.

摘要翻译： 一种蓄电装置，具备：具有多个沿一个方向排列的蓄电元件的蓄电模块; 与所述蓄电模块在所述蓄电元件的对准方向相邻设置的装置; 用于蓄电模块充放电的高压电缆; 以及支撑结构，其被配置为在多个点处支撑所述高压电缆以将所述高压电缆沿着参考路径定位。 高电压电缆被配置为将蓄电模块的电极端子电连接到装置。 电极端子是蓄电模块的两个电极端子之一，并且位于蓄电模块的远离装置的一侧。

公开(公告)号：US20130288120A1

公开(公告)日：2013-10-31

申请号：US13880509

申请日：2012-07-06

申请人： Kenji Iida ,  Yusuke Tomita ,  Kiyomi Imagawa ,  Shigeo Kiba

发明人： Kenji Iida ,  Yusuke Tomita ,  Kiyomi Imagawa ,  Shigeo Kiba

IPC分类号： C09J179/08 ,  H01M4/62 ,  C09J7/02

CPC分类号： H01M4/622 ,  A61K6/0017 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/16 ,  C08L79/08 ,  C09J7/22 ,  C09J7/35 ,  C09J179/08 ,  H01G9/2077 ,  H01L23/293 ,  H01L23/295 ,  H01L31/0481 ,  H01L51/448 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0346 ,  H05K2201/0154 ,  Y02E10/50 ,  Y10T428/2804 ,  Y10T428/2896 ,  A61K6/0023 ,  C08L33/08 ,  A61K6/0026 ,  H01L2924/00014 ,  H01L2924/00

摘要： To provide a resin composition that contains a solvent-soluble polyimide and can provide a film exhibiting high viscoelasticity and flexibility at high temperatures. To attain this, a polyimide resin composition is provided that includes a polyimide having a polycondensation unit of a tetracarboxylic acid dianhydride and a diamine, wherein the tetracarboxylic acid dianhydride includes an (α1) tetracarboxylic acid dianhydride represented by general formula (1), or the diamine includes an (β1) aromatic diamine represented by general formula (2), the diamine includes an (β2) aliphatic diamine represented by general formula (3) or (4), a total amour of the (α1) tetracarboxylic acid dianhydride and the (β1) aromatic diamine is 5 to 49 mol % with respect to a total amount of the tetracarboxylic acid dianhydride and the diamine, and an amine equivalent of the polyimide is 4,000 to 20,000.

摘要翻译： 提供含有溶剂可溶性聚酰亚胺的树脂组合物，能够提供在高温下表现出高粘弹性和柔软性的膜。 为了实现这一点，提供了一种聚酰亚胺树脂组合物，其包括具有四羧酸二酐的缩聚单元和二胺的聚酰亚胺，其中四羧酸二酐包括由通式（1）表示的（α1）四羧酸二酐，或 二胺包括由通式（2）表示的（β1）芳族二胺，二胺包括由通式（3）或（4）表示的（β2）脂族二胺，（α1）四羧酸二酐和 （β1）芳香族二胺相对于四羧酸二酐和二胺的总量为5〜49摩尔％，聚酰亚胺的胺当量为4,000〜20,000。