公开(公告)号：US07199359B2

公开(公告)日：2007-04-03

申请号：US11526168

申请日：2006-09-21

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01J5/02

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。

公开(公告)号：US07059040B1

公开(公告)日：2006-06-13

申请号：US09764196

申请日：2001-01-16

Applicant: Steven Webster ,  Thomas P. Glenn ,  Roy Dale Hollaway

Inventor： Steven Webster ,  Thomas P. Glenn ,  Roy Dale Hollaway

IPC: H05K3/20

CPC classification number: H01L27/14618 ,  G02B7/02 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14632 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/19041 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49787 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of forming an optical module includes mounting an image sensor to a base of a substrate and bonding a lens housing to a sidewall of the substrate. A mounting surface of the lens housing includes a locking feature having a horizontal surface and a vertical surface. The sidewall of the substrate includes a joint surface. To bond the lens housing to the sidewall of the substrate, a bond is formed between the horizontal surface of the locking feature of the lens housing and the joint surface of the sidewall. Further, a bond is formed between the vertical surface of the locking feature of the lens housing and an interior surface of the sidewall.

Abstract translation: 一种形成光学模块的方法包括将图像传感器安装到基底的基底上，并将透镜外壳粘合到基底的侧壁上。 透镜壳体的安装表面包括具有水平表面和垂直表面的锁定特征。 基板的侧壁包括接合表面。 为了将透镜壳体粘合到基板的侧壁，在透镜壳体的锁定特征的水平表面和侧壁的接合表面之间形成结合。 此外，在透镜壳体的锁定特征的垂直表面和侧壁的内表面之间形成结合。

公开(公告)号：US06943429B1

公开(公告)日：2005-09-13

申请号：US09803084

申请日：2001-03-08

Applicant: Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

IPC: B23K26/00 ,  H01L23/12 ,  H01L23/544 ,  H01L27/01 ,  H01L27/04

CPC classification number: H01L23/544 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A marked wafer includes a front-side surface and a back-side surface. A vertical scribe line and a horizontal scribe line are on the front-side surface of the wafer. A back-side alignment mark is located at an intersection of the vertical scribe line and the horizontal scribe line. The back-side alignment mark extends from the front-side surface to the back-side surface of the wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.

Abstract translation: 标记的晶片包括前侧表面和后侧表面。 垂直刻划线和水平划线位于晶片的正面上。 背面对准标记位于垂直划线和水平划线的交点处。 背面对准标记从晶片的前侧表面延伸到背面。 背面对准标记用于对准从后侧表面对晶片进行单片化的锯。

公开(公告)号：US20050186071A1

公开(公告)日：2005-08-25

申请号：US10783147

申请日：2004-02-20

Applicant: John Franz ,  David Vaughn ,  Steven Webster

Inventor： John Franz ,  David Vaughn ,  Steven Webster

IPC: F04D27/02 ,  G05D7/00

CPC classification number: F04D27/008

Abstract: A rotary flow inducing device having a rotary flow inducing blade and a protection mechanism including a trigger to move the protection mechanism between an operational flow configuration and a protective no-flow configuration with respect to the rotary flow inducing blade.

Abstract translation: 一种旋转引流装置，具有旋转引流叶片和保护机构，该保护机构包括用于使保护机构在相对于旋转引流叶片的操作流动结构和保护性无流动结构之间移动的触发器。

公开(公告)号：US06672773B1

公开(公告)日：2004-01-06

申请号：US09751536

申请日：2000-12-29

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: G02B638

CPC classification number: G02B6/30

Abstract: A method and apparatus for connecting optical fibers to waveguides and other optical elements are disclosed. In one embodiment, an optical fiber is modified so as to have opposing orthogonal tapered sidewalls that taper toward a tip of the fiber. An optical connector for the fiber includes a base having a receiving section and a waveguide formed therein. The receiving section is a flared channel having opposing orthogonal tapered sidewalls and a horizontal bottom surface perpendicular to the sidewalls. The waveguide is optically accessible at a narrow inner end of the channel. The angle of taper of the sidewalls of the channel matches the angle of taper of the sidewalls of the optical fiber. When the optical fiber is inserted into the open end of the channel and is moved toward the narrow inner end of the channel, the sidewalls of the fiber and channel come into contact with each other. In addition, a bottom surface of the fiber rests on the horizontal bottom surface of the channel. The tip of the fiber is positioned adjacent to the waveguide in precise alignment along the x, y, and z axes. The optical fiber is thereby positioned for optical communication through the waveguide with another optical fiber, a light source, or a light receiving element positioned at an opposite end of the waveguide.

Abstract translation: 公开了一种将光纤连接到波导和其它光学元件的方法和装置。 在一个实施例中，光纤被修改为具有朝向纤维的尖端逐渐变细的相对的正交锥形侧壁。 用于光纤的光学连接器包括具有形成在其中的接收部分和波导的基座。 接收部分是具有相对的正交锥形侧壁和垂直于侧壁的水平底表面的扩口通道。 波导在通道的窄内端处是光学可访问的。 通道的侧壁的锥度角与光纤的侧壁的锥度角相匹配。 当光纤插入通道的开口端并朝向通道的窄内端移动时，光纤和通道的侧壁彼此接触。 此外，纤维的底面位于通道的水平底面上。 纤维的尖端沿着x，y和z轴精确对准地定位在波导附近。 因此，光纤被定位成通过波导与另一个光纤，光源或位于波导的相对端的光接收元件进行光通信。

公开(公告)号：US06670698B1

公开(公告)日：2003-12-30

申请号：US10068717

申请日：2002-02-05

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L23495

CPC classification number: H05K3/325 ,  H01L23/04 ,  H01L24/48 ,  H01L24/72 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10719 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A packaged electronic device includes connection contacts that are formed on the contact pads on the second surface of the substrate. In contrast to the prior art, the connection contacts are not solder contacts but are formed of nickel/aluminum plated copper and are therefore harder and less malleable and subject to deformation than prior art solder balls. The connection contacts are formed to align with, and contact, attachment pads formed on the motherboard or other system component. A tension device is then used to mechanically attach the packaged electronic device of the invention to the motherboard.

Abstract translation: 封装的电子器件包括形成在衬底的第二表面上的接触焊盘上的连接触头。 与现有技术相比，连接触点不是焊接触点，而是由镀镍/镀铝的铜形成，因此比现有技术的焊球更硬，更不可塑并且变形。 连接触点被形成为与形成在母板或其他系统部件上的附接焊盘对准并接触。 然后使用张紧装置将本发明的包装电子装置机械地附接到母板。

公开(公告)号：US06661080B1

公开(公告)日：2003-12-09

申请号：US09895996

申请日：2001-06-28

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L23544

CPC classification number: H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2223/54453

Abstract: A structure includes holes formed in a layer of tape. The holes are aligned over active areas on chips formed in a wafer. A custom vacuum chuck with a plurality of suction ports is aligned on the tape such that the suction ports contact only the tape and not the hole portions. Flats of the custom vacuum chuck are formed so that a perimeter of the flats contacts, and rests on, the tape. In addition, the flats of the custom vacuum chuck are formed so that the flats cover the entire active area on the first surface of each of the chips. Consequently, the combination of the custom vacuum chuck and the single layer of tape form a protective cavity over the active areas of the chips during singulation from the wafer.

Abstract translation: 一种结构包括形成在一层胶带中的孔。 孔在芯片上形成的芯片上的有效区域对准。 具有多个吸入口的定制真空吸盘对准在带上，使得吸入口仅接触带而不是孔部分。 定制的真空卡盘的平面形成为使得平面的周边接触并搁置在带上。 此外，定制真空卡盘的平面形成为使得平面覆盖每个芯片的第一表面上的整个有效区域。 因此，定制真空吸盘和单层带的组合在从晶片分离过程中在芯片的有效区域上形成保护腔。

公开(公告)号：US06638789B1

公开(公告)日：2003-10-28

申请号：US09670500

申请日：2000-09-26

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2144

CPC classification number: H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: To form a micromachine package, a bead is applied to the rear surface of a controller chip. The controller chip is positioned above an active area in a front surface of a micromachine chip. The bead is attached to the front surface of the micromachine chip to attach the controller chip to the micromachine chip. Once the controller chip is attached to the micromachine chip, the bead and controller chip form an enclosure around the micromachine area. This enclosure protects the micromachine area from the ambient environment. Bond pads on a front surface of the controller chip are then wirebonded to leads of a leadframe or substrate.

Abstract translation: 为了形成微机械组件，将一珠子施加到控制器芯片的后表面。 控制器芯片位于微机械芯片前表面的有效区域上方。 珠子连接到微机械芯片的前表面以将控制器芯片附接到微机械芯片。 一旦控制器芯片连接到微机械芯片，珠和控制器芯片就形成围绕微机械区域的外壳。 该外壳保护微机械区域免受周围环境的影响。 然后将控制器芯片的前表面上的接合焊盘引线接合到引线框架或基板的引线。

公开(公告)号：US06586826B1

公开(公告)日：2003-07-01

申请号：US09881344

申请日：2001-06-13

Applicant: Thomas P. Glenn ,  Steven M. Anderson ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven M. Anderson ,  Steven Webster

IPC: H01L2302

CPC classification number: H01L23/13 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15331 ,  H01L2924/181 ,  H05K1/119 ,  H05K1/144 ,  H05K3/062 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4614 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/167 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Integrated circuit packages that may be easily stacked one on top of the other are disclosed. The package includes a molded plastic body having metal-coated interconnection posts on both its upper and lower surfaces. An integrated circuit is mounted on the upper surface. Metal traces on the upper surface electrically connect each bonding pad on the integrated circuit to a one of a plurality of groups of four interconnection posts on the upper surface. Vias through the substrate electrically connect each group of four posts on the upper surface to an interconnection post on the lower surface of the package. Two or more packages can be stacked and electrically connected by wedging the lower posts of a top package between each group of four posts on the upper surface of a lower package. The lower posts of the lower package may be soldered to a conventional printed circuit board, or may be mounted on a mounting substrate that also has corresponding groups of four interconnection posts.

Abstract translation: 公开了可以容易地堆叠在另一个之上的集成电路封装。 该包装包括在其上表面和下表面上具有金属涂覆的互连柱的模制塑料体。 集成电路安装在上表面。 上表面上的金属迹线将集成电路上的每个接合焊盘电连接到上表面上的多组四个互连柱中的一组。 通过衬底的通孔将上表面上的每组四个柱电连接到封装的下表面上的互连柱。 可以通过将下封装的上表面上的每组四个支柱之间的顶部封装的下部柱楔入来堆叠并电连接两个或更多个封装。 下部封装的下部管柱可以焊接到传统的印刷电路板上，或者可以安装在也具有相应组的四个互连柱的安装基板上。

公开(公告)号：US06577013B1

公开(公告)日：2003-06-10

申请号：US09655439

申请日：2000-09-05

Applicant: Thomas P. Glenn ,  Steven Webster ,  Vincent DiCaprio

Inventor： Thomas P. Glenn ,  Steven Webster ,  Vincent DiCaprio

IPC: H01L2348

CPC classification number: H01L24/10 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/481 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Chip-size semiconductor packages (“CSPs”) containing multiple stacked dies are disclosed. The dies are mounted on one another in a stack such that corresponding ones of the vias in the respective dies are coaxially aligned. An electrically conductive wire or pin is in each set of aligned vias and soldered to corresponding ones of the terminal pads. The pins include portions protruding from the stack of dies that serve as input-output terminals of the package. Heat spreaders can be interleaved between the stacked dies to enhance heat dissipation from the package.

Abstract translation: 公开了包含多个堆叠管芯的芯片尺寸半导体封装（“CSP”）。 模具以堆叠方式彼此安装，使得各个模具中的相应的通路同轴对准。 导电线或引脚位于每组对准的通孔中，并焊接到对应的端子焊盘。 引脚包括从用作封装的输入 - 输出端子的管芯堆叠突出的部分。 散热器可以在堆叠的管芯之间交错以增强封装的散热。