公开(公告)号：US07952028B2

公开(公告)日：2011-05-31

申请号：US12747434

申请日：2009-01-20

申请人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

发明人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

IPC分类号： H01R4/62

CPC分类号： C22C5/02 ,  B21C37/047 ,  B23K35/0261 ,  B23K35/0272 ,  B23K35/24 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C22F1/08 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/4849 ,  H01L2224/4851 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2225/06562 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/01004 ,  H01L2924/01203 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2224/48465 ,  H01L2924/20751 ,  H01L2924/01001 ,  H01L2924/20655 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/20654 ,  H01L2924/20656 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/2075 ,  H01L2924/20754

摘要： A high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearity and loop height stability are excellent. This bonding wire for a semiconductor device includes a core material made of a conductive metal, and a skin layer formed on the core material and containing a metal different from the core material as a main component; wherein a relationship between an average size (a) of crystal grains in the skin layer on a wire surface along a wire circumferential direction and an average size (b) of crystal grains in the core material on a normal cross section, the normal cross section being a cross section normal to a wire axis, satisfies an inequality of a/b≦0.7.

摘要翻译： 适用于半球安装技术的高性能接合线，例如堆叠芯片接合，变薄和细间距安装，其中可以抑制在球和弹簧故障的直立位置处的钢丝倾斜（倾斜）并且循环线性和 回路高度稳定性非常好。 这种半导体器件用接合线包括由导电性金属构成的芯材以及形成在芯材上并含有以芯材为主要成分的金属的表层， 其中，沿着线周向的线表面上的表层中的晶粒的平均尺寸（a）与正常截面上的芯材中的晶粒的平均尺寸（b）之间的关系，正交截面 作为与线轴垂直的横截面，满足a / b＆nlE的不等式; 0.7。

公开(公告)号：US20100294532A1

公开(公告)日：2010-11-25

申请号：US12669662

申请日：2008-12-02

申请人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

发明人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

IPC分类号： H01B9/02

CPC分类号： C22C5/04 ,  B23K35/0222 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C5/02 ,  C22C5/06 ,  C22C9/00 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4851 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/859 ,  H01L2924/00011 ,  H01L2924/00015 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3861 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01005 ,  H01L2924/01015 ,  H01L2924/01083 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/20652 ,  H01L2924/20656 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/00014 ,  H01L2924/01202 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/0104 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01001 ,  H01L2924/20658 ,  H01L2924/20654 ,  H01L2224/48824 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/2075 ,  H01L2924/01049 ,  H01L2924/01006

摘要： It is an object of the present invention to provide a highly-functional bonding wire which has good wire-surface nature, loop linearity, stability of loop heights, and stability of a wire bonding shape, and which can cope with semiconductor packaging technologies, such as thinning, achievement of a fine pitch, achievement of a long span, and three-dimensional packaging. A semiconductor-device bonding wire comprises a core member formed of an electrically-conductive metal, and a skin layer mainly composed of a face-centered cubic metal different from the core member and formed thereon. The percentage of orientations in crystalline orientations in the lengthwise direction in the surface of the skin layer is greater than or equal to 50%.

摘要翻译： 本发明的目的是提供一种具有良好的线表面性质，环线性，环高度稳定性和引线接合形状的稳定性的高功能性接合线，并且能够应对半导体封装技术，例如 细化，实现细节，实现长距离，立体包装。 半导体器件接合线包括由导电金属形成的芯部件和主要由与芯部件不同的面心立方金属形成的表皮层。 在表皮层表面的长度方向的结晶取向中的<100>取向的百分比大于或等于50％。

公开(公告)号：US20100282495A1

公开(公告)日：2010-11-11

申请号：US12747434

申请日：2009-01-20

申请人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

发明人： Tomohiro Uno ,  Keiichi Kimura ,  Takashi Yamada

IPC分类号： H01B5/00

CPC分类号： C22C5/02 ,  B21C37/047 ,  B23K35/0261 ,  B23K35/0272 ,  B23K35/24 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  C22C9/00 ,  C22F1/08 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/4312 ,  H01L2224/4321 ,  H01L2224/43825 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/45176 ,  H01L2224/45565 ,  H01L2224/45572 ,  H01L2224/456 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/45676 ,  H01L2224/48011 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/4848 ,  H01L2224/4849 ,  H01L2224/4851 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85186 ,  H01L2224/85203 ,  H01L2224/85207 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2225/06562 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/20752 ,  H01L2924/3025 ,  H01L2924/01004 ,  H01L2924/01203 ,  H01L2224/45655 ,  H01L2224/45657 ,  H01L2224/45671 ,  H01L2224/45666 ,  H01L2924/01204 ,  H01L2924/01202 ,  H01L2224/48465 ,  H01L2924/20751 ,  H01L2924/01001 ,  H01L2924/20655 ,  H01L2924/20652 ,  H01L2924/20653 ,  H01L2924/20654 ,  H01L2924/20656 ,  H01L2924/00 ,  H01L2224/48824 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/2075 ,  H01L2924/20754

摘要： An object of the present invention is to provide a high-performance bonding wire that is suitable for semiconductor mounting technology, such as stacked chip bonding, thinning, and fine pitch mounting, where wire lean (leaning) at an upright position of a ball and spring failure can be suppressed and loop linearity and loop height stability are excellent. This bonding wire for a semiconductor device includes a core material made of a conductive metal, and a skin layer formed on the core material and containing a metal different from the core material as a main component; wherein a relationship between an average size (a) of crystal grains in the skin layer on a wire surface along a wire circumferential direction and an average size (b) of crystal grains in the core material on a normal cross section, the normal cross section being a cross section normal to a wire axis, satisfies an inequality of a/b≦0.7.

摘要翻译： 本发明的目的是提供一种适用于半导体安装技术的高性能接合线，例如层叠芯片接合，变薄和细间距安装，其中，在钢的直立位置上的钢丝倾斜（倾斜） 可以抑制弹簧故障，并且环路线性和环路高度稳定性优异。 这种半导体器件用接合线包括由导电性金属构成的芯材以及形成在芯材上并含有以芯材为主要成分的金属的表层， 其中，沿着线周向的线表面上的表层中的晶粒的平均尺寸（a）与正常截面上的芯材中的晶粒的平均尺寸（b）之间的关系，正交截面 作为与线轴垂直的横截面，满足a / b＆nlE的不等式; 0.7。

公开(公告)号：US08965146B2

公开(公告)日：2015-02-24

申请号：US13381298

申请日：2010-07-09

申请人： Takashi Goh ,  Yoshiyuki Doi ,  Shinji Mino ,  Ken Tsuzuki ,  Hiroshi Yamazaki ,  Takashi Yamada

发明人： Takashi Goh ,  Yoshiyuki Doi ,  Shinji Mino ,  Ken Tsuzuki ,  Hiroshi Yamazaki ,  Takashi Yamada

IPC分类号： G02F1/035 ,  G02F1/03 ,  G02F1/225 ,  G02B6/12

CPC分类号： G02F1/0327 ,  G02B2006/12142 ,  G02B2006/12159 ,  G02F1/225 ,  G02F2201/126 ,  G02F2203/20 ,  G02F2203/21

摘要： In a nest MZI modulator in which each arm includes a child MZI, the power consumption is reduced. The hybrid integrated-type nest MZI modulator of the embodiment 1a is configured so that, instead of placing a relative phase adjusting section in a parent MZI, a bias electrode Bias 90° in which an electric field is applied in the same direction to the polarization direction in both of the upper and lower arms is placed in each child MZI (see FIG. 4B). The bias electrode Bias 90° provided in each child MZI constitute the entirety of a relative phase adjusting section. The optical signals are subjected to a phase change after the output from the child MZI (see FIG. 1A), because such relative phase adjusting section can subject the optical signals of the upper and lower arms of the child MZI to a shift change in the same direction, respectively.

摘要翻译： 在其中每个臂包括儿童MZI的巢MZI调制器中，功耗降低。 实施例1a的混合集成型嵌套MZI调制器被配置为使得不是将相对相位调整部分放置在母MZI中，而是将偏置电极偏置90°，其中向与极化相同的方向施加电场 将上臂和下臂两者的方向放置在每个子MZI中（参见图4B）。 每个子MZI中设置的偏置电极偏置90°构成相对相位调整部的整体。 在从子MZI（参见图1A）的输出之后，光信号经受相变，因为这种相对相位调整部分可以使子MZI的上臂和下臂的光信号在 相同方向。

公开(公告)号：US20140015496A1

公开(公告)日：2014-01-16

申请号：US13933458

申请日：2013-07-02

申请人： Tadao Nishiguchi ,  Takashi Yamada ,  Hideyuki Yasugi ,  Masayuki Hanatani ,  Yusaku Ido

发明人： Tadao Nishiguchi ,  Takashi Yamada ,  Hideyuki Yasugi ,  Masayuki Hanatani ,  Yusaku Ido

IPC分类号： H02J7/00

CPC分类号： H02J7/007 ,  H02J7/022 ,  H02M1/42 ,  H02M3/33507 ,  H02M2001/007 ,  H02M2001/4291 ,  Y02B40/90 ,  Y02B70/12 ,  Y02B70/126

摘要： A charging device has an AC power supply input part that rectifies an AC voltage, a power factor correction part that converts a rectified voltage outputted from the AC power supply input part into a DC intermediate voltage, a power conversion part that converts the intermediate voltage outputted from the power factor correction part into a charge voltage, and supplies the charge voltage to a secondary battery, an input voltage acquisition unit that acquires the rectified voltage outputted from the AC power supply input part, an output voltage acquisition unit that acquires the charge voltage outputted from the power conversion part, and a storage part in which the rectified voltage, the charge voltage, and a target intermediate voltage correlated with the rectified voltage and charge voltage are stored.

摘要翻译： 充电装置具有对交流电压进行整流的交流电源输入部，将从交流电源输入部输出的整流电压转换为直流中间电压的功率因数校正部，转换输出的中间电压的功率转换部 从功率因数校正部变为充电电压，并将充电电压提供给二次电池，获取从交流电源输入部输出的整流电压的输入电压获取单元，获取充电电压的输出电压获取单元 以及存储与整流电压和充电电压相关的整流电压，充电电压和目标中间电压的存储部。

公开(公告)号：US20130334879A1

公开(公告)日：2013-12-19

申请号：US13917089

申请日：2013-06-13

申请人： Yusaku Ido ,  Takashi Yamada ,  Tadao Nishiguchi ,  Hideyuki Yasugi ,  Masayuki Hanatani

发明人： Yusaku Ido ,  Takashi Yamada ,  Tadao Nishiguchi ,  Hideyuki Yasugi ,  Masayuki Hanatani

IPC分类号： B60R16/033

CPC分类号： B60R16/033 ,  B60L1/00 ,  B60L1/003 ,  B60L1/14 ,  B60L11/1805 ,  B60L11/1816 ,  B60L11/1824 ,  B60L11/1868 ,  B60L2210/10 ,  B60L2210/30 ,  Y02T10/7005 ,  Y02T10/7066 ,  Y02T10/7072 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/92 ,  Y02T90/121 ,  Y02T90/127 ,  Y02T90/14

摘要： A vehicle power-supply control device has a battery charger that converts an externally-supplied AC voltage into a DC voltage used to charge a vehicle high-voltage battery, a low-voltage power generator that converts the DC voltage output from the battery charger into a DC voltage used to drive a vehicle auxiliary machine, and a controller that controls the battery charger and the low-voltage power generator. The battery charger includes a power factor correction circuit that corrects a power factor of the AC voltage and a first DC/DC converter that generates a predetermined DC voltage based on an output of the power factor correction circuit. The low-voltage power generator includes a second DC/DC converter that steps down the DC voltage output from the battery charger and a synchronous rectifier that rectifies an output of the second DC/DC converter in synchronization with a switching operation of the second DC/DC converter.

摘要翻译： 车辆电源控制装置具有将外部供给的交流电压转换成用于对车辆用高压电池充电的直流电压的电池充电器，将从电池充电器输出的直流电压转换为低压电力的低压发电机 用于驱动车辆辅助机器的DC电压，以及控制电池充电器和低压发电机的控制器。 电池充电器包括校正AC电压的功率因数的功率因数校正电路和基于功率因数校正电路的输出产生预定DC电压的第一DC / DC转换器。 低压发电机包括：第二DC / DC转换器，其降低从电池充电器输出的直流电压;以及同步整流器，其与第二DC / DC转换器的开关操作同步地整流第二DC / DC转换器的输出; DC转换器。

公开(公告)号：US20120307589A1

公开(公告)日：2012-12-06

申请号：US13577381

申请日：2010-12-21

申请人： Toshihiro Hanada ,  Takashi Yamada

发明人： Toshihiro Hanada ,  Takashi Yamada

IPC分类号： B01F5/06

CPC分类号： B01F5/0646 ,  B01F3/0861 ,  B01F5/0647 ,  B01F5/0656 ,  B01F5/0657 ,  B01F2003/0896

摘要： A fluid mixer includes a main flow path comprised of a first flow path and a second flow path, spiral flow paths formed around the second flow path in shapes substantially concentric with the second flow path and offset in position from each other in a circumferential direction, the spiral flow paths having first ends communicated with the first flow path, branch flow paths branched from a plurality of locations of the second flow path in a flow direction, the branch flow paths being communicated with the spiral flow paths at a plurality of locations of the spiral flow paths in the flow direction, a fluid inlet at an open end of either of the first flow path and the second flow path, and a fluid outlet at an open end of the other of the first flow path and the second flow path.

摘要翻译： 流体混合器包括由第一流动路径和第二流动路径构成的主流路，围绕第二流动路径形成的大致与第二流动路径同心的形状和在圆周方向上彼此偏移的形状的螺旋流动路径， 所述螺旋流路具有与所述第一流路连通的第一端，在流动方向上从所述第二流路的多个位置分支的分支流路，所述分支流路与所述螺旋流路连通，所述多个位置 在流动方向上的螺旋流动路径，在第一流动路径和第二流动路径中的任一个的开口端处的流体入口以及在第一流动路径和第二流动路径中的另一个的开口端处的流体出口 。

公开(公告)号：US08112190B2

公开(公告)日：2012-02-07

申请号：US12109369

申请日：2008-04-25

申请人： Takashi Yamada

发明人： Takashi Yamada

IPC分类号： B60L3/00

CPC分类号： B63H21/213 ,  B63H20/00 ,  B63H21/22

摘要： A boat control system detects a wire break status in a duplicated communication system. A hull of a boat is provided with a main remote control side ECU and a subremote control side ECU, and the subremote control side ECU communicates with an engine side ECU via the main remote control side ECU. Both of the remote control side ECUs are provided with storage buffers in which communication status confirmation data transmitted between nodes is stored. A broken wire detection section of the engine side ECU starts a determination when a system is started, and broken wire detection sections of both of the remote control side ECUs start a determination when communication status confirmation data is received from another node. Data indicating that communication is in an abnormal status is stored as an initial value in a main remote control data storage buffer.

摘要翻译： 船控系统检测重复通信系统中的断线状态。 船体具有主遥控侧ECU和副遥控侧ECU，副翼控制侧ECU经由主遥控侧ECU与发动机侧ECU通信。 两个遥控侧ECU都设置有存储缓冲器，其中存储有节点之间传输的通信状态确认数据。 发动机侧ECU的断线检测部在系统起动时开始判定，并且当从另一节点接收到通信状态确认数据时，两个遥控侧ECU的断线检测部开始判定。 指示通信处于异常状态的数据作为初始值存储在主遥控数据存储缓冲器中。

公开(公告)号：US20110310058A1

公开(公告)日：2011-12-22

申请号：US13203457

申请日：2010-02-25

申请人： Takashi Yamada ,  Tomotake Aono

发明人： Takashi Yamada ,  Tomotake Aono

IPC分类号： G06F3/041

CPC分类号： G06F3/04845 ,  G06F3/0414 ,  G06F3/0482 ,  G06F3/0488 ,  G06F3/04883

摘要： An object display device is disclosed. An object display device includes a display unit, a detection unit and a control unit. The display unit is configured to display an object. The detection unit is configured to detect a location and a load of a pressing to the display unit. The control unit can control a movement of the object based on conditions of first and second pressings.

摘要翻译： 公开了一种物体显示装置。 目标显示装置包括显示单元，检测单元和控制单元。 显示单元被配置为显示对象。 检测单元被配置为检测对显示单元的按压的位置和负载。 控制单元可以基于第一和第二按压的条件来控制物体的移动。

公开(公告)号：US20110274603A1

公开(公告)日：2011-11-10

申请号：US13142354

申请日：2010-01-26

申请人： Akira Kohara ,  Yoshiro Hirasawa ,  Takashi Yamada

发明人： Akira Kohara ,  Yoshiro Hirasawa ,  Takashi Yamada

IPC分类号： B01D53/94 ,  B01J29/04 ,  B01J21/12 ,  B01J21/06 ,  B01J21/08

CPC分类号： B01D53/945 ,  B01D2255/1023 ,  B01D2255/1025 ,  B01D2255/2042 ,  B01D2255/2092 ,  B01D2255/407 ,  B01D2258/014 ,  B01J23/002 ,  B01J23/63 ,  B01J35/0006 ,  B01J35/002 ,  B01J2523/00 ,  F01N2370/02 ,  F01N2510/06 ,  Y02A50/2324 ,  Y02T10/22 ,  B01J2523/25 ,  B01J2523/31 ,  B01J2523/3712 ,  B01J2523/48 ,  B01J2523/824 ,  B01J2523/828

摘要： An exhaust gas purification catalyst, which is suitable as a Three Way Catalyst for efficiently purifying carbon monoxide (CO), hydrocarbons (HC), and nitrogen oxides (NOx) in exhaust gas discharged from a gasoline automobile, an exhaust gas purification apparatus using the same and an exhaust gas purification method.It is provided by an exhaust gas purification catalyst, wherein catalyst components for purifying hydrocarbons (HC), carbon monoxide (CO) and nitrogen oxides (NOx) contained in exhaust gas are coated onto a honeycomb type structure as a catalyst composition layer, characterized in that the catalyst components comprise an activated metal (A), a heat resistant inorganic oxide (B) and a cerium-zirconium composite oxide (c) containing a pyrochlore phase in a crystal structure, in the same catalyst composition layer, and the activated metal (A) is a palladium and a rhodium and does not contain a platinum.

摘要翻译： 一种废气净化催化剂，其适合作为用于有效地净化从汽油车辆排出的废气中的一氧化碳（CO），烃（HC）和氮氧化物（NOx））的三元催化剂，使用 相同的废气净化方法。 由废气净化催化剂提供，其中将用于净化废气中的烃（HC），一氧化碳（CO）和氮氧化物（NOx））的催化剂组分涂覆到作为催化剂组合物层的蜂窝型结构上，其特征在于 催化剂组分包含在同一催化剂组合物层中的在晶体结构中含有烧绿石相的活化金属（A），耐热无机氧化物（B）和铈锆复合氧化物（c），活化金属 （A）是钯和铑，不含铂。