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    Methods for forming through-wafer interconnects and structures resulting therefrom
    31.
    发明申请
    Methods for forming through-wafer interconnects and structures resulting therefrom 有权
    用于形成贯穿晶片互连和由此产生的结构的方法

    公开(公告)号：US20070048994A1

    公开(公告)日：2007-03-01

    申请号：US11219132

    申请日：2005-09-01

    Applicant: Mark Tuttle

    Inventor： Mark Tuttle

    IPC: H01L21/44

    CPC classification number: H01L23/5384 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16146 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K7/06 ,  H01L2924/014 ,  H01L2224/05552

    Abstract: The present invention relates to methods for forming through-wafer interconnects in semiconductor substrates and the resulting structures. In one embodiment, a method for forming a through-wafer interconnect includes providing a substrate having a pad on a surface thereof, depositing a passivation layer over the pad and the surface of the substrate, and forming an aperture through the passivation layer and the pad using a substantially continuous process. An insulative layer is deposited in the aperture followed by a conductive layer and a conductive fill. In another embodiment of the invention, a semiconductor device is formed including a first interconnect structure that extends through a conductive pad and is electrically coupled with the conductive pad while a second interconnect structure is formed through another conductive pad while being electrically isolated therefrom. Semiconductor devices and assemblies produced with the methods are also disclosed.

    Abstract translation: 本发明涉及在半导体衬底中形成贯穿晶片互连的方法以及所得到的结构。 在一个实施例中，用于形成贯通晶片互连的方法包括提供在其表面上具有焊盘的衬底，在焊盘和衬底的表面上沉积钝化层，以及通过钝化层和焊盘形成孔 使用基本上连续的过程。 绝缘层沉积在孔中，随后是导电层和导电填料。 在本发明的另一实施例中，形成半导体器件，其包括延伸穿过导电焊盘并与导电焊盘电耦合的第一互连结构，而第二互连结构通过另一个导电焊盘形成，同时与之电绝缘。 还公开了使用该方法制造的半导体器件和组件。

    Integrated circuits with contemporaneously formed array electrodes and logic interconnects
    33.
    发明申请
    Integrated circuits with contemporaneously formed array electrodes and logic interconnects 审中-公开
    具有同时形成的阵列电极和逻辑互连的集成电路

    公开(公告)号：US20060099797A1

    公开(公告)日：2006-05-11

    申请号：US11315731

    申请日：2005-12-22

    Applicant: Mirmajid Seyyedy ,  Glen Hush ,  Mark Tuttle ,  Terry Vollman

    Inventor： Mirmajid Seyyedy ,  Glen Hush ,  Mark Tuttle ,  Terry Vollman

    IPC: H01L21/4763 ,  H01L21/336 ,  H01L21/8242

    CPC classification number: H01L27/228 ,  G11C5/06 ,  G11C11/14 ,  H01L27/105 ,  H01L27/10882 ,  H01L27/10897

    Abstract: The invention relates to interconnects for an integrated circuit memory device. Embodiments of the invention include processes to fabricate interconnects for memory devices in relatively few steps. Embodiments of the invention further include memory devices with metallization layers having unequal pitch dimensions in different areas of the chip, thereby permitting simultaneous fabrication of array electrodes and electrical interconnects in different areas of the chip. This reduces the number of fabrication steps used to make interconnects, thereby speeding up fabrication and reducing production costs.

    Abstract translation: 本发明涉及用于集成电路存储器件的互连。 本发明的实施例包括以相对较少的步骤制造用于存储器件的互连的工艺。 本发明的实施例还包括具有在芯片的不同区域中具有不等间距尺寸的金属化层的存储器件，从而允许在芯片的不同区域中同时制造阵列电极和电互连。 这减少了用于制造互连的制造步骤的数量，从而加快制造并降低生产成本。

    Packaged microelectronic imagers and methods of packaging microelectronic imagers
    34.
    发明申请
    Packaged microelectronic imagers and methods of packaging microelectronic imagers 审中-公开
    封装的微电子成像器和包装微电子成像器的方法

    公开(公告)号：US20050231626A1

    公开(公告)日：2005-10-20

    申请号：US11146783

    申请日：2005-06-07

    Applicant: Mark Tuttle ,  William Hiatt

    Inventor： Mark Tuttle ,  William Hiatt

    IPC: H01L23/02 ,  H01L27/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225

    CPC classification number: H01L27/14625 ,  B33Y80/00 ,  H01L27/14618 ,  H01L27/14636 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A microelectronic imager comprising an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include (a) a microelectronic die with an image sensor and a plurality of external contacts electrically coupled to the image sensor and (b) a first referencing element fixed to the imaging unit. The optics unit can include an optic member and a second referencing element fixed to the optics unit. The second referencing element is releasably seated with the first referencing element at a preset position in which the optic member is situated at a desired location relative to the image sensor.

    Abstract translation: 一种包括成像单元和附接到成像单元的光学单元的微电子成像器，以及用于封装微电子成像器的方法。 在一个实施例中，成像单元可以包括（a）具有图像传感器和电耦合到图像传感器的多个外部触点的微电子管芯和（b）固定到成像单元的第一参考元件。 光学单元可以包括光学构件和固定到光学单元的第二参考元件。 第二参考元件可释放地与第一参考元件一起位于预定位置，在该位置，光学元件位于相对于图像传感器的期望位置处。

    Electronic Communication Devices, Methods Of Forming Electrical Communication Devices, And Communications Methods
    40.
    发明申请
    Electronic Communication Devices, Methods Of Forming Electrical Communication Devices, And Communications Methods 有权
    电子通信设备，形成电气通信设备的方法和通信方法

    公开(公告)号：US20070290862A1

    公开(公告)日：2007-12-20

    申请号：US11846905

    申请日：2007-08-29

    Applicant: Mark Tuttle

    Inventor： Mark Tuttle

    IPC: G08B13/14

    CPC classification number: G06K7/0008 ,  G06K19/07749 ,  G06K19/07771 ,  G06K19/07786

    Abstract: The present invention provides electronic communication devices, methods of forming electrical communication devices, and communications methods. An electronic communication device adapted to receive electronic signals includes: a housing comprising a substrate and an encapsulant; an integrated circuit provided within the housing and comprising transponder circuitry operable to communicate an identification signal responsive to receiving a polling signal; an antenna provided within the housing and being coupled with the transponder circuitry; and a ground plane provided within the housing and being spaced from the antenna and configured to shield some of the electronic signals from the antenna and reflect others of the electronic signals towards the antenna. A method of forming an electronic signal communication device includes providing a substrate having a support surface; providing a conductive layer adjacent at least a portion of the support surface; providing a dielectric layer over the conductive layer; providing an antenna over the dielectric layer; coupling an integrated circuit with the antenna; and encapsulating the antenna, the dielectric layer, and the integrated circuit using a flowable encapsulant.

    Abstract translation: 本发明提供电子通信设备，形成电通信设备的方法和通信方法。 适于接收电子信号的电子通信设备包括：壳体，包括衬底和密封剂; 设置在所述外壳内的集成电路，包括响应于接收到轮询信号而传送识别信号的应答器电路; 设置在壳体内并与应答器电路耦合的天线; 以及设置在壳体内并与天线间隔开并被配置为将一些电子信号与天线隔离并将其它电子信号反射向天线的接地平面。 一种形成电子信号通信装置的方法包括提供具有支撑表面的基板; 提供邻近所述支撑表面的至少一部分的导电层; 在所述导电层上提供介电层; 在电介质层上提供天线; 将集成电路与天线耦合; 并使用可流动的密封剂封装天线，电介质层和集成电路。

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