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146 条记录 (耗时 0.037 秒)

    Semiconductor device
    33.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08841664B2

    公开(公告)日：2014-09-23

    申请号：US13404516

    申请日：2012-02-24

    申请人： Hitomi Sato ,  Takayuki Saito ,  Kosei Noda ,  Toru Takayama

    发明人： Hitomi Sato ,  Takayuki Saito ,  Kosei Noda ,  Toru Takayama

    IPC分类号： H01L29/10 ,  H01L29/786 ,  H01L27/108 ,  H01L29/49 ,  H01L27/115

    CPC分类号： H01L29/7869 ,  H01L27/10873 ,  H01L27/1156 ,  H01L29/4908 ,  H01L29/78603 ,  H01L29/78606

    摘要： Provided is a highly reliable semiconductor device by giving stable electric characteristics to a transistor in which a semiconductor film whose threshold voltage is difficult to control is used as an active layer. By using a silicon oxide film having a negative fixed charge as a film in contact with the active layer of the transistor or a film in the vicinity of the active layer, a negative electric field is always applied to the active layer due to the negative fixed charge and the threshold voltage of the transistor can be shifted in the positive direction. Thus, the highly reliable semiconductor device can be manufactured by giving stable electric characteristics to the transistor.

    摘要翻译： 提供了一种高可靠性的半导体器件，其通过对其中阈值电压难以控制的半导体膜用作有源层的晶体管给予稳定的电特性。 通过使用具有负固定电荷的氧化硅膜作为与晶体管的有源层或有源层附近的膜接触的膜，由于负固定，总是向有源层施加负电场 电荷和晶体管的阈值电压可以向正方向移动。 因此，可以通过给晶体管提供稳定的电特性来制造高度可靠的半导体器件。

    THERMALLY CONDUCTIVE ADHESIVE
    35.
    发明申请
    THERMALLY CONDUCTIVE ADHESIVE 有权
    热导电胶

    公开(公告)号：US20130279118A1

    公开(公告)日：2013-10-24

    申请号：US13978600

    申请日：2011-12-15

    申请人： Taichi Koyama ,  Takayuki Saito

    发明人： Taichi Koyama ,  Takayuki Saito

    IPC分类号： H05K7/20

    CPC分类号： H05K7/2039 ,  C08G59/42 ,  C08K3/08 ,  C08K2003/0806 ,  C09J9/00 ,  C09J11/04 ,  C09J163/00 ,  H01L23/3737 ,  H01L24/29 ,  H01L2224/29298 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A thermally conductive adhesive having: a thermosetting adhesive containing a curable component and a curing agent for the curable component, and a metal filler dispersed in the thermosetting adhesive uses a silver powder and a solder powder as the metal filler. The solder powder to be used has a melting temperature lower than the thermal curing temperature of the thermally conductive adhesive and produces a high-melting-point solder alloy having a melting point higher than the melting temperature of the solder powder when the solder powder is reacted with the silver powder under thermal curing conditions of the thermally conductive adhesive. A curing agent having flux activity to the metal filler is used as the curing agent.

    摘要翻译： 一种导热粘合剂，其具有：含有可固化组分的热固性粘合剂和用于可固化组分的固化剂，以及分散在热固性粘合剂中的金属填料使用银粉和焊料粉末作为金属填料。 使用的焊料粉末的熔融温度低于导热性粘合剂的热固化温度，并且当焊料粉末反应时产生熔点高于焊料粉末的熔融温度的高熔点焊料合金 在导热粘合剂的热固化条件下，银粉末。 使用对金属填充剂具有助熔活性的固化剂作为固化剂。

    Sensor structure
    37.
    发明授权
    Sensor structure 有权
    传感器结构

    公开(公告)号：US08215160B2

    公开(公告)日：2012-07-10

    申请号：US12826061

    申请日：2010-06-29

    申请人： Takayuki Saito ,  Chihiro Kobayashi ,  Takayuki Yogo

    发明人： Takayuki Saito ,  Chihiro Kobayashi ,  Takayuki Yogo

    IPC分类号： G01M15/04

    CPC分类号： G01F1/6842 ,  F02D41/187 ,  G01F5/00 ,  G01F15/02

    摘要： The present invention utilizes self-heating of electronic components to improve a humidity sensing part with low environment resistance, such as a condensation problem and the like, and also to enhance the heat radiation efficiency of electronic components. The humidity sensing part is used in an intake tube of an automobile by integrating, for example, with a heating resister type mass air flow measurement device. A humidity sensing element is mounted on an electronic circuit board in a mass air flow measurement device with the temperature thereof starting to increase immediately after a sensor has been actuated. This urges the temperature of the humidity sensing element to start increasing (being heated) immediately after the sensor has been actuated. To urge the humidity sensing element to be further heated, a base plate is composed of two types of materials, resin and metal. A part of the base plate holding an area of the electronic circuit board generating a large quantity of heat is composed of the metal. A part of the base plate corresponding to the periphery of the humidity sensing part which is to be heated is composed of the resin.

    摘要翻译： 本发明利用电子部件的自身加热来改善诸如冷凝问题等的低环境阻力的湿度感测部件，并且还提高电子部件的散热效率。 湿度检测部件通过集成例如加热电阻式质量空气流量测量装置而用在汽车的进气管中。 湿度感测元件安装在质量空气流量测量装置的电子电路板上，其温度在传感器被致动之后立即开始增加。 这促使湿度传感元件的温度在传感器启动后立即开始增加（被加热）。 为了促使湿度传感元件进一步加热，基板由树脂和金属的两种材料组成。 保持产生大量热量的电子电路板的区域的基板的一部分由金属构成。 与被加热的湿度感测部的周边对应的基板的一部分由树脂构成。

    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
    39.
    发明申请
    SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS 审中-公开
    基板加工方法和基板加工装置

    公开(公告)号：US20100325913A1

    公开(公告)日：2010-12-30

    申请号：US12821456

    申请日：2010-06-23

    申请人： Xinming WANG ,  Kazuo Yamauchi ,  Akira Kodera ,  Tsukuru Suzuki ,  Yasushi Toma ,  Takayuki Saito ,  Hirokuni Hiyama

    发明人： Xinming WANG ,  Kazuo Yamauchi ,  Akira Kodera ,  Tsukuru Suzuki ,  Yasushi Toma ,  Takayuki Saito ,  Hirokuni Hiyama

    IPC分类号： F26B7/00

    CPC分类号： F26B5/12 ,  F26B21/004 ,  H01L21/67028

    摘要： A substrate processing method dose not use or only use the least possible amount of an organic solvent, and can quickly and completely remove a liquid from a wet substrate surface without allowing the liquid to remain on the substrate surface. The substrate processing method for drying a substrate surface which is wet with a liquid, includes: removing the liquid from the substrate surface and sucking the liquid together with its surrounding gas into a gas/liquid suction nozzle, disposed opposite the substrate surface, while relatively moving the gas/liquid suction nozzle and the substrate parallel to each other; and blowing a dry gas from a dry gas supply nozzle, disposed opposite the substrate surface, toward that area of the substrate surface from which the liquid has been removed while relatively moving the dry gas supply nozzle and the substrate parallel to each other.

    摘要翻译： 不使用或仅使用尽可能少量有机溶剂的底物处理方法，并且可以快速且完全地从湿底物表面除去液体，而不会使液体残留在基材表面上。 用于干燥被液体湿润的基板表面的基板处理方法包括：从基板表面去除液体并将其周围的气体与其一起吸入与基板表面相对设置的气/液吸嘴中，同时相对 使气体/液体吸嘴和基板彼此平行移动; 并且将相对于基板表面设置的干燥气体供给喷嘴的干燥气体吹向基板表面的已被除去液体的区域，同时使干燥气体供给喷嘴和基板彼此平行地相对移动。