公开(公告)号：US20070148467A1

公开(公告)日：2007-06-28

申请号：US11614505

申请日：2006-12-21

Applicant: Michael St. Lawrence ,  Murali Sethumadhavan ,  Ani Shere

Inventor： Michael St. Lawrence ,  Murali Sethumadhavan ,  Ani Shere

IPC: B32B9/04

CPC classification number: H05K1/0373 ,  B82Y10/00 ,  H01L23/3735 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/068 ,  Y10T428/31504 ,  H01L2924/00

Abstract: A thermal management circuit material comprises an electrically conductive layer; a dielectric layer comprising a polymer matrix and a thermally conductive, electrically non-conductive particulate filler, wherein the dielectric layer is disposed on and in at least partial contact with the electrically conductive layer, and wherein the circuit material has a thermal conductivity of greater than or equal to about 1 watt per meter-degree Kelvin.

Abstract translation: 热管理电路材料包括导电层; 介电层，其包含聚合物基质和导热的不导电的颗粒填料，其中所述电介质层设置在所述导电层上并至少部分地与所述导电层接触，并且其中所述电路材料具有大于 或等于约1瓦/米开尔文。

公开(公告)号：US06611065B2

公开(公告)日：2003-08-26

申请号：US09987396

申请日：2001-11-14

Applicant: Motohide Takeichi ,  Junji Shinozaki

Inventor： Motohide Takeichi ,  Junji Shinozaki

IPC: H01L2329

CPC classification number: H05K3/323 ,  H01L21/563 ,  H01L23/295 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3511 ,  H05K1/189 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0248 ,  H05K2201/0251 ,  H05K2201/10674 ,  Y10T428/24008 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating filler dispersed therein is used for connecting a film-like flexible circuit board and a bare IC chip. The aspect ratio of the flaky or fibrous insulating filler is no less than 20.

公开(公告)号：US06530147B1

公开(公告)日：2003-03-11

申请号：US09708131

申请日：2000-11-07

Applicant: David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe

Inventor： David R. Haas ,  Chengzeng Xu ,  Mavyn McAuliffe

IPC: H05K300

CPC classification number: H05K3/4673 ,  H05K1/0373 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T442/2008 ,  Y10T442/2049 ,  Y10T442/2475 ,  Y10T442/2762 ,  Y10T442/2861 ,  Y10T442/2926

Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.

Abstract translation: 本发明涉及包含无纺布填料和树脂材料的电子基片。 本发明还包括由本发明的电子基板制造的电子产品，其包括但不限于预浸料，金属包覆层压板以及带和不带通孔的印刷线路板。 本发明还包括一种制造印刷的叠层电路板的方法，包括在预浸料坯中形成预浸料并形成至少一个通孔的步骤。

公开(公告)号：US06368698B1

公开(公告)日：2002-04-09

申请号：US09573977

申请日：2000-05-19

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: B32B300

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

Abstract translation: 印刷电路板由至少一种包含至少50重量％的丙烯酸纤维的无纺布片材或纤维网层制成，任何平衡物基本上不导电的纤维，填料和粘合剂。 片材或纤维网优选通过泡沫方法制成，并且可以含有60-80％的直链聚丙烯腈纤维和40-20％的原纤化（纸浆）纤维。 纤维网或片材优选通过热压延来压缩，使其具有约0.1-1克/立方厘米的密度; 并且网或片可以具有介于约20-120克/平方米之间的基重。 幅材或片材还可以具有1-40％的基本上不导电的有机或无机粘合剂，或者可以是基本上不含粘合剂的。 使用这些非织造网或片的层制成的印刷电路板是常规的，包括预浸材料，导电电路元件和电子元件，并且与机织玻璃和非织造芳族聚酰胺产品相比具有改进的性能， 包括改进的纤维固结，易于板的构建，以及改善的MD / CD比和稳定性。

公开(公告)号：US06258203B1

公开(公告)日：2001-07-10

申请号：US09399775

申请日：1999-09-21

Applicant: Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

Inventor： Kay Rokman ,  Rod Komlenic ,  Kelly Rennels ,  Hakan Sabel

IPC: D04H500

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D21F11/002 ,  D21H13/18 ,  D21H13/22 ,  D21H13/24 ,  D21H13/26 ,  D21H13/40 ,  D21H25/005 ,  D21H25/04 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T442/2008 ,  Y10T442/2738 ,  Y10T442/608 ,  Y10T442/632 ,  Y10T442/637

Abstract: A printed circuit board is made from at least one non-woven sheet or web layer comprising at least 50% by weight acrylic fibers, with any balance substantially electrically non-conductive fibers, filler, and binder. The sheet or web is preferably made by the foam process, and may contain 60-80% straight polyacrylonitrile fibers and 40-20% fibrillated (pulp) ones. The web or sheet is preferably compressed by thermal calendering so that it has a density of about 0.1-1 grams per cubic centimeter; and the web or sheet may have a basis weight of between about 20-120 grams per square meter. The web or sheet may also have a 1-40% of substantially electrically non-conductive organic or inorganic binder, or may be substantially binder free. A printed circuit board made using the layers of these non-woven webs or sheets is otherwise conventional, including a pre-preg material, electrically conductive circuit elements, and electronics, and has improved properties compared to woven glass and non-woven aramid products, including improved fiber consolidation, easy board construction, and improved MD/CD ratio and stability.

公开(公告)号：US6042936A

公开(公告)日：2000-03-28

申请号：US936045

申请日：1997-09-23

Applicant: Ulrich W. Kempf

Inventor： Ulrich W. Kempf

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/16 ,  B32B9/00

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  H05K1/0366 ,  H05K1/0373 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进用于制造表面贴装集成电路的高性能电路板。

公开(公告)号：US5972811A

公开(公告)日：1999-10-26

申请号：US90789

申请日：1998-06-04

Applicant: Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Doris I. Hand ,  Vincent R. Landi ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/08 ,  C08J5/10 ,  C08J5/24 ,  C08K3/00 ,  C08K3/10 ,  C08K3/22 ,  C08K3/24 ,  C08K3/34 ,  C08K3/38 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K5/06 ,  C08K5/3417 ,  C08K7/00 ,  C08K7/02 ,  C08K7/14 ,  C08K7/16 ,  C08K7/20 ,  C08L9/00 ,  C08L21/00 ,  C08L27/18 ,  C08L47/00 ,  C08L53/00 ,  C08L53/02 ,  C08L77/10 ,  H01B3/30 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/2934 ,  Y10T442/2992 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3455

Abstract: An electrical substrate material is presented comprising a thermosetting matrix of polybutadiene or polyisoprene and a co-curable second resin distinct from the first resin. A peroxide cure initiator and/or crosslinking agent may optionally be added. The presence of a very high surface area particulate filler, preferably fumed silica, is also preferred, in that its presence results in a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. The composition of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated onto one or both opposed surfaces to a metal conductive foil such as copper.

Abstract translation: 提供了一种电气基材材料，其包含聚丁二烯或聚异戊二烯的热固性基质和不同于第一树脂的可共固化的第二树脂。 可以任选地加入过氧化物固化引发剂和/或交联剂。 存在非常高的表面积的颗粒填料，优选热解法二氧化硅也是优选的，因为其存在导致预浸料，其具有非常小的粘性，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 本发明的组合物特别适用于制造用于微波和数字电路的电路基板，通常将热固性组合物的形式层压在诸如铜的金属导电箔的一个或两个相对的表面上。

公开(公告)号：US5571609A

公开(公告)日：1996-11-05

申请号：US322890

申请日：1994-10-13

Applicant: Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

Inventor： Michael E. St. Lawrence ,  Vincent R. Landi ,  Doris I. Hand ,  Robert H. Walker ,  Samuel Gazit ,  Raymond R. Miskiavitch

IPC: C08J5/24 ,  C08K3/00 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/00 ,  C08K5/02 ,  C08K7/00 ,  C08K7/14 ,  C08L9/00 ,  C08L21/00 ,  C08L53/00 ,  C08L53/02 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  B32B7/00

CPC classification number: C08J5/24 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K5/0066 ,  C08K7/14 ,  C08L9/00 ,  H05K1/032 ,  H05K1/0366 ,  H05K1/0373 ,  C08J2309/00 ,  C08L15/00 ,  C08L23/04 ,  C08L53/00 ,  C08L7/00 ,  C08L9/02 ,  C08L9/06 ,  H05K1/0203 ,  H05K1/162 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T442/3431 ,  Y10T442/3569

Abstract: An electrical substrate material is presented which comprises a thermosetting matrix which includes a polybutadiene or polyisoprene resin and an unsaturated butadiene or isoprene containing polymer in an amount of 25 to 50 vol. %; a woven glass fabric in an amount of 10 to 40 vol. %; a particulate, preferably ceramic filler in an amount of from 5 to 60 vol. %; a flame retardant and a peroxide cure initiator. A preferred composition has 18% woven glass, 41% particulate filler and 30% thermosetting matrix. The foregoing component ratios and particularly the relatively high range of particulate filler is an important feature of this invention in that this filled composite material leads to a prepreg which has very little tackiness and can therefore be easily handled by operators. This low tackiness feature allows for the use of conventional automated layup processing, including foil cladding, using one or more known roll laminators. While the prepreg of this invention is tack-free enough to be handled relatively easily by hand, it is also tacky enough to be tacked to itself using a roll laminator (e.g., nip roller) at room temperature. In addition, another important feature of this invention is the low amount of glass fabric filler relative to the higher range of particulate filler which leads to improved (lower) CTE in the Z axis or thickness direction, improved electrical performance (e.g., dissipation factor), lower cost and the ability to tailor dielectric constant through appropriate selection of particulate fillers.

Abstract translation: 提供了一种电气基材材料，其包括热固性基质，其包含聚丁二烯或聚异戊二烯树脂和含量为25至50体积％的不饱和丁二烯或含异戊二烯的聚合物。 ％; 10〜40体积％的编织玻璃织物。 ％; 粒度为5至60体积％的陶瓷填料。 ％; 阻燃剂和过氧化物固化引发剂。 优选的组合物具有18％的玻璃织物，41％的颗粒填料和30％的热固性基质。 上述组分比，特别是颗粒填料的相对高范围是本发明的重要特征，因为该填充的复合材料导致具有非常小的粘性的预浸料，因此可以容易地由操作者处理。 这种低粘性特征允许使用一种或多种已知的辊式层压机来使用常规的自动铺层处理，包括箔包层。 虽然本发明的预浸料无粘性足以用手相对容易地处理，但是它也是粘性足以在室温下使用辊式层压机（例如夹辊）粘合到其自身上。 另外，本发明的另一个重要特征是玻璃织物填料相对于较高范围的颗粒填料的含量较低，这导致在Z轴或厚度方向上改进（降低）CTE，改善了电性能（例如耗散因子） 更低的成本和通过适当选择颗粒填料来调整介电常数的能力。

公开(公告)号：US5308565A

公开(公告)日：1994-05-03

申请号：US14028

申请日：1993-02-05

Applicant: Christian K. Weber ,  Michael G. Minnick

Inventor： Christian K. Weber ,  Michael G. Minnick

IPC: C08G59/40 ,  C08J5/24 ,  C08L63/00 ,  C08L71/12 ,  H05K1/03 ,  B29C67/12

CPC classification number: H05K1/0373 ,  C08J5/24 ,  C08L63/00 ,  C08L71/123 ,  C08L71/12 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0251

Abstract: Broadly, the present invention comprises a solventless process wherein blends of thermoset polyphenylene oxide and triallylcyanurates can be processed into fiber reinforced laminates, and especially laminates prepared by the Wiggins Teape process. One aspect of the present inventive process comprises blending the polyphenylene powder with a liquid epoxy material, optionally with flame retardants and catalysts, preferably in a high shear mixer at elevated temperature, e.g. in the range of about 100.degree.-130.degree. C. The resultant upstaged or partially-cured blend is sufficiently solidified to be granulated into a powder for Wiggins Teape processing or, optionally, conventional press processing into a fiber reinforced laminates. Resin systems thus-prepared exhibit both improved solderability resistance and improved resistance to organic solvents when compared to thermoplastic systems.

Abstract translation: 概括地说，本发明包括一种无溶剂方法，其中热固性聚苯醚和三烯丙基氰脲酸酯的共混物可以加工成纤维增强层压材料，特别是通过Wiggins Teape方法制备的层压材料。 本发明方法的一个方面包括将聚亚苯基粉末与液体环氧材料共混，任选地使用阻燃剂和催化剂，优选在高剪切混合器中，例如高温下。 在约100-130℃的范围内。所得的上述或部分固化的共混物充分固化，以造粒成用于Wiggins Teape加工的粉末，或任选地，常规的压制加工成纤维增强层压材料。 如此制备的树脂体系与热塑性体系相比表现出改进的耐焊接性和改善的耐有机溶剂性。

公开(公告)号：US5198295A

公开(公告)日：1993-03-30

申请号：US704303

申请日：1991-05-22

Applicant: David J. Arthur ,  Gwo S. Swei ,  Allen F. Horn, III

Inventor： David J. Arthur ,  Gwo S. Swei ,  Allen F. Horn, III

IPC: C04B26/08 ,  C04B35/14 ,  C04B41/45 ,  C08K9/02 ,  C08K9/04 ,  C08K9/06 ,  H01B3/44 ,  H01L23/14 ,  H05K1/03 ,  H05K1/05 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4626 ,  C04B26/08 ,  C04B35/14 ,  C04B41/4584 ,  C08K9/02 ,  C08K9/04 ,  C08K9/06 ,  H01B3/445 ,  H01L23/145 ,  H05K1/0373 ,  H01L2924/0002 ,  H05K1/034 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/068 ,  H05K3/389 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/2982 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/3154 ,  Y10T428/31544

Abstract: A composite material is presented comprised of a ceramic filled fluoropolymer wherein the ceramic is coated with a titanate and/or zirconate and the ceramic has a volume % fraction of between about 45-50.

Abstract translation: 提出了一种复合材料，其由陶瓷填充的含氟聚合物组成，其中陶瓷涂覆有钛酸盐和/或锆酸盐，陶瓷的体积％分数在约45-50之间。