公开(公告)号：US20150357699A1

公开(公告)日：2015-12-10

申请号：US14762440

申请日：2014-01-27

Applicant: HITACHI CHEMICAL COMPANY, LTD.

Inventor： Hiroyuki YAMAGUCHI ,  Hajime NAKAYAMA ,  Haruo OGINO ,  Seiichi KURIHARA

IPC: H01P5/08 ,  B23K26/36 ,  H01P11/00 ,  H01P3/08 ,  H01P3/06

CPC classification number: H01P5/085 ,  H01P3/06 ,  H01P3/08 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0237 ,  H05K3/429 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09581 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10356 ,  Y10T29/49167

Abstract: A multilayer wiring plate includes a coaxial wire includes a signal line, an insulation coating and an outer peripheral conductor. An insulating layer is arranged on an inner or outer layer side. A metal film circuit is arranged by the intermediary of the insulating layer, and the metal film circuit and the outer peripheral conductor and signal line of the coaxial wire are connected. A signal line connection part that connects the signal line to the metal film circuit includes a penetration hole A that passes through the insulating layer and the outer peripheral conductor; the coaxial wire from which the outer peripheral conductor is removed inside the penetration hole A; a hole filling resin filled inside the penetration hole A; a penetration hole B that passes through the hole filling resin and the signal line; and a plated layer arranged on an inner wall of the penetration hole B.

Abstract translation: 多层布线板包括同轴线，其包括信号线，绝缘涂层和外周导体。 绝缘层设置在内层或外层一侧。 金属膜电路通过绝缘层中间布置，金属膜电路和同轴线的外周导体和信号线连接。 将信号线连接到金属膜电路的信号线连接部分包括穿过绝缘层和外周导体的穿透孔A; 在穿透孔A内除去外周导体的同轴线; 填充在穿透孔A内的孔填充树脂; 穿过孔填充树脂和信号线的穿透孔B; 以及布置在穿透孔B的内壁上的镀层。

公开(公告)号：US20150351245A1

公开(公告)日：2015-12-03

申请号：US14824210

申请日：2015-08-12

Applicant: MEDIATEK Inc.

Inventor： Nan-Jang Chen

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/498 ,  H05K1/02 ,  H01L23/367 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49827 ,  H01L24/13 ,  H01L24/16 ,  H01L24/30 ,  H01L24/32 ,  H01L24/33 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/114 ,  H05K3/222 ,  H05K2201/066 ,  H05K2201/10287 ,  H05K2201/10977 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A semiconductor package includes a substrate, a first conductive layer, a second conductive layer, a first surface mount device, a second surface mount device and a connection element. The first conductive layer is formed on the substrate and has a first pad and a second pad separated from the first pad. The second conductive layer is formed on the substrate and has a third pad and a fourth pad electrically connected with the third pad through the second conductive layer. The first surface mount device is mounted on the first pad and the third pad. The second surface mount device is mounted on the second pad and the fourth pad. The connection element electrically connects the first pad with the second pad.

Abstract translation: 半导体封装包括衬底，第一导电层，第二导电层，第一表面安装器件，第二表面安装器件和连接元件。 第一导电层形成在基板上，并具有与第一焊盘分离的第一焊盘和第二焊盘。 第二导电层形成在基板上，并具有通过第二导电层与第三焊盘电连接的第三焊盘和第四焊盘。 第一表面贴装装置安装在第一垫和第三垫上。 第二表面安装装置安装在第二垫和第四垫上。 连接元件将第一焊盘与第二焊盘电连接。

公开(公告)号：US09136701B2

公开(公告)日：2015-09-15

申请号：US13953760

申请日：2013-07-30

Applicant: CHIT SHUN CATV EQUIPMENT LIMITED

Inventor： Siu Shan Chung

IPC: H02H9/04 ,  H01T2/02 ,  H01T4/02 ,  H05K1/02 ,  H01G4/00

CPC classification number: H02H9/04 ,  H01G4/00 ,  H01G4/12 ,  H01T2/02 ,  H01T4/02 ,  H05K1/026 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10651

Abstract: A high voltage discharge protective device for an RF device having a signal port, includes a blocking capacitor arranged at the signal port of the RF device, a circuit board for mounting the blocking capacitor, and a metal conductor grounded and partially bare. The blocking capacitor includes a main body and two leads connected to the main body and secured to the circuit board. The bottom portion of the main body is bare to form an exposed portion. The exposed portion is spaced apart from the circuit board to form an interval. The metal conductor is disposed within the interval and corresponds to the exposed portion of the blocking capacitor. When the passing voltage within the blocking capacitor reaches a predetermined value, the exposed portion of the blocking capacitor sparkly discharges to the metal conductor. An RF device is also provided.

Abstract translation: 一种用于具有信号端口的RF装置的高压放电保护装置，包括布置在RF装置的信号端口处的隔离电容器，用于安装隔离电容器的电路板和接地和部分裸露的金属导体。 隔离电容器包括主体和连接到主体并且固定到电路板的两个引线。 主体的底部裸露形成露出部分。 暴露部分与电路板间隔开以形成间隔。 金属导体设置在间隔内并对应于隔离电容器的暴露部分。 当隔离电容器内的通过电压达到预定值时，阻塞电容器的暴露部分闪电放电到金属导体。 还提供RF设备。

公开(公告)号：US20150237738A1

公开(公告)日：2015-08-20

申请号：US14429070

申请日：2013-08-30

Applicant: JUMATECH GMBH

Inventor： Markus Wölfel

IPC: H05K3/10 ,  H05K1/09

CPC classification number: H05K3/10 ,  H05K1/09 ,  H05K3/103 ,  H05K3/385 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2201/1028 ,  H05K2201/10287 ,  Y10T29/302

Abstract: A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. a wire or a plate-like shaped part) that is embedded in the circuit board element. To this end, the present invention suggests that the surface of the component should be roughened, at least partially, in order to ensure a better adhesive bond with the surrounding cover layer (e.g. a prepreg made of an insulating material compound). The component surface can be roughened by chemical methods such as etching or by purely mechanical methods such as sand blasting.

Abstract translation: 一种用于制造电路板元件的方法和相应的电路板元件，通过该方法可以抑制嵌入在该电路板元件中的部件（例如线或板状成形部）的区域中的分层的风险 电路板元件。 为此，本发明提出，至少部分地，组件的表面应该被粗糙化，以确保与周围的覆盖层（例如，由绝缘材料化合物制成的预浸料）的更好的粘合剂粘结。 组分表面可以通过诸如蚀刻的化学方法或通过纯机械方法如喷砂来粗糙化。

公开(公告)号：US20150178615A1

公开(公告)日：2015-06-25

申请号：US14552504

申请日：2014-11-25

Applicant: David Finn

Inventor： David Finn

IPC: G06K19/077 ,  H01F38/14

CPC classification number: G06K19/07794 ,  G06K19/07771 ,  G06K19/07783 ,  H01F38/14 ,  H01F2038/143 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/09036 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: A dual-interface smart card having a booster antenna with coupler coil in its card body, and a metallized face plate having a window opening for the antenna module. Performance may be improved by one or more of making the window opening substantially larger than the antenna module, providing perforations through the face plate, disposing ferrite material between the face plate and the booster antenna. Additionally, by one or more of modifying contact pads on the antenna module, disposing a compensating loop under the booster antenna, offsetting the antenna module with respect to the coupler coil, arranging the booster antenna as a quasi-dipole, providing the module antenna with capacitive stubs, and disposing a ferrite element in the antenna module between the module antenna and the contact pads.

Abstract translation: 一种双接口智能卡，其具有在其卡体中具有耦合线圈的增强天线，以及具有用于天线模块的窗口的金属化面板。 可以通过将窗户开口大大地大于天线模块的一个或多个来提高性能，从而提供通过面板的穿孔，在面板和增强天线之间设置铁氧体材料。 另外，通过一个或多个修改天线模块上的接触焊盘，在增强天线之下设置补偿环路，相对于耦合线圈偏移天线模块，将增强天线布置为准偶极子，为模块天线提供 并且在天线模块中在模块天线和接触垫之间设置铁氧体元件。

公开(公告)号：US09063604B2

公开(公告)日：2015-06-23

申请号：US14000199

申请日：2013-07-06

Applicant: NANCHANG O-FILM TECH. CO., LTD.

Inventor： Fei Zhou

IPC: G06F3/045 ,  G06F3/041 ,  G06F3/044 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00

CPC classification number: G06F3/0412 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/00 ,  H05K3/107 ,  H05K2201/0326 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10287

Abstract: A touch screen manufacturing method includes the following steps: providing a glass substrate; bombarding a surface of the glass substrate by plasma to expose Si—O-groups on the surface; coating and curing a jell on the surface of the glass substrate which is bombarded by plasma, forming a base material layer, the jell is bonded to the Si—O-groups on the glass substrate during curing; embossing the base material layer by embossing mold, forming a trench on the surface of the base material layer against the glass substrate; and filling metal into the trench, and forming metal mesh as a conductive layer. A touch screen is also disclosed. Compared to the traditional process using ITO as a conductive layer, mesh shape can be one-step formed, the process is simple, and the yield rate is high. And the cost is greatly reduced using metal instead of ITO, since not etching process is used, conductive material will not be wasted, and it reduces heavy metal emission in the waste.

Abstract translation: 触摸屏制造方法包括以下步骤：提供玻璃基板; 通过等离子体轰击玻璃基板的表面以暴露表面上的Si-O-基团; 在由等离子体轰击的玻璃基板的表面上涂布和固化成凝胶，形成基材层，在固化期间将熔凝物结合到玻璃基板上的Si-O-基团; 通过压花模压压基材层，在基材层的表面上形成相对于玻璃基板的沟槽; 并将金属填充到沟槽中，并且形成金属网作为导电层。 还公开了触摸屏。 与使用ITO作为导电层的传统工艺相比，网格形状可以一步形成，工艺简单，成品率高。 使用金属代替ITO大大降低了成本，因为不使用蚀刻工艺，导电材料不会被浪费，并且减少废物中的重金属排放。

公开(公告)号：US20150163907A1

公开(公告)日：2015-06-11

申请号：US14563718

申请日：2014-12-08

Applicant: J-METRICS TECHNOLOGY CO., LTD.

Inventor： Jer-Wei CHANG

IPC: H05K1/11 ,  H05K3/10 ,  H05K3/32 ,  H05K1/18 ,  H05F3/04

CPC classification number: H05K1/11 ,  G06K9/0002 ,  G06K9/00053 ,  H01L2224/48091 ,  H01L2924/19107 ,  H05K1/0259 ,  H05K2201/09436 ,  H05K2201/10151 ,  H05K2201/10287 ,  Y10T29/49146 ,  H01L2924/00014

Abstract: A proximity sensor comprises: a package substrate; a sensing chip disposed on the package substrate and sensing a proximity message of a finger; a plurality of package bond wires connecting the package substrate to the sensing chip; a bond-wire electrode electrically connected to at least one of the sensing chip and the package substrate; and a molding compound layer covering the package substrate, the sensing chip, the package bond wires and the bond-wire electrode with a portion of the bond-wire electrode being exposed from an upper surface of the molding compound layer, which serves as a contact surface for the finger. When the finger contacts the upper surface, the finger is also directly coupled to the portion of the bond-wire electrode. A method of manufacturing such sensor is also disclosed.

Abstract translation: 接近传感器包括：封装基板; 感测芯片，设置在所述封装基板上并感测手指的接近信息; 将封装基板连接到感测芯片的多个封装接合线; 电连接到所述感测芯片和所述封装衬底中的至少一个的接合线电极; 以及覆盖所述封装基板，所述感测芯片，所述封装接合线和所述接合线电极的成型复合层，所述接合线电极的一部分从所述模塑料层的上表面露出，所述接合线用作接触 表面为手指。 当手指接触上表面时，手指也直接耦合到接合线电极的部分。 还公开了制造这种传感器的方法。

公开(公告)号：US20150144387A1

公开(公告)日：2015-05-28

申请号：US14407402

申请日：2013-06-09

Applicant: SCHNEIDER TOSHIBA INVERTER EUROPE SAS

Inventor： Jing Chen

IPC: H05K1/18 ,  H05K1/11

CPC classification number: H05K1/181 ,  H01G2/06 ,  H01G2/065 ,  H05K1/111 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4015 ,  H05K5/0239 ,  H05K7/1432 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/06 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10325 ,  H05K2201/10409 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K2201/1081 ,  H05K2201/10818 ,  H05K2201/2018 ,  H05K2201/2036

Abstract: An electrical apparatus, comprising a circuit board, and a capacitor installed on the circuit board; the capacitor is detachably installed on the circuit board. The capacitor can be conveniently detached from the circuit board; therefore, a damaged capacitor can be easily replaced with a new capacitor, saving cost by avoiding the problem in the prior art that the entire electrical apparatus is discarded or causes downtime for repairs due to a damaged capacitor.

Abstract translation: 一种电气设备，包括电路板和安装在电路板上的电容器; 电容器可拆卸地安装在电路板上。 电容器可以方便地从电路板上拆下; 因此，可以容易地用新的电容器替换损坏的电容器，通过避免现有技术中的问题，整个电气设备被丢弃或由于损坏的电容器导致维修停机，从而节省成本。

公开(公告)号：US20150021402A1

公开(公告)日：2015-01-22

申请号：US14173815

申请日：2014-02-06

Applicant: David Finn ,  Mustafa Lotya ,  Klaus Ummenhofer

Inventor： David Finn ,  Mustafa Lotya ,  Klaus Ummenhofer

IPC: G06K19/077 ,  H01Q1/22 ,  H01Q7/00

CPC classification number: G06K19/07794 ,  G06K19/07769 ,  H01F38/14 ,  H01Q1/2216 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/103 ,  H05K2201/09036 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2203/0285 ,  Y10T29/49162

Abstract: A booster antenna (BA) for a smart card comprises a card antenna (CA) component extending around a periphery of a card body (CB), a coupler coil (CC) component at a location for an antenna module (AM), and an extension antenna (EA) contributing to the inductance of the booster antenna (BA). A method of wire embedding is also disclosed, by controlling a force and ultrasonic power applied by an embedding tool at different positions on the card body (CB).

Abstract translation: 用于智能卡的增强天线（BA）包括围绕卡体（CB）的周边延伸的卡片天线（CA）部件，在天线模块（AM）的位置处的耦合线圈（CC）部件，以及 扩展天线（EA）有助于增强天线（BA）的电感。 还公开了一种通过控制由嵌入工具在卡体（CB）上的不同位置施加的力和超声功率的电线嵌入方法。

公开(公告)号：US20140355163A1

公开(公告)日：2014-12-04

申请号：US13953760

申请日：2013-07-30

Applicant: CHIT SHUN CATV EQUIPMENT LIMITED

Inventor： Siu Shan Chung

IPC: H02H9/04

CPC classification number: H02H9/04 ,  H01G4/00 ,  H01G4/12 ,  H01T2/02 ,  H01T4/02 ,  H05K1/026 ,  H05K2201/10015 ,  H05K2201/10287 ,  H05K2201/10651

Abstract: A high voltage discharge protective device for an RF device having a signal port, includes a blocking capacitor arranged at the signal port of the RF device, a circuit board for mounting the blocking capacitor, and a metal conductor grounded and partially bare. The blocking capacitor includes a main body and two leads connected to the main body and secured to the circuit board. The bottom portion of the main body is bare to form an exposed portion. The exposed portion is spaced apart from the circuit board to form an interval. The metal conductor is disposed within the interval and corresponds to the exposed portion of the blocking capacitor. When the passing voltage within the blocking capacitor reaches a predetermined value, the exposed portion of the blocking capacitor sparkly discharges to the metal conductor. An RF device is also provided.

Abstract translation: 一种用于具有信号端口的RF装置的高压放电保护装置，包括布置在RF装置的信号端口处的隔离电容器，用于安装隔离电容器的电路板和接地和部分裸露的金属导体。 隔离电容器包括主体和连接到主体并且固定到电路板的两个引线。 主体的底部裸露形成露出部分。 暴露部分与电路板间隔开以形成间隔。 金属导体设置在间隔内并对应于隔离电容器的暴露部分。 当隔离电容器内的通过电压达到预定值时，阻塞电容器的暴露部分闪电放电到金属导体。 还提供RF设备。