公开(公告)号：US20140377996A1

公开(公告)日：2014-12-25

申请号：US14320428

申请日：2014-06-30

Applicant: Pulse Electronics, Inc.

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R13/66 ,  H01R13/7193 ,  H01R12/70

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US08824165B2

公开(公告)日：2014-09-02

申请号：US13185573

申请日：2011-07-19

Applicant: Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

Inventor： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC: H05K5/02

CPC classification number: H05K1/181 ,  H01F27/027 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract translation: 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US08764493B2

公开(公告)日：2014-07-01

申请号：US13437856

申请日：2012-04-02

Applicant: Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R13/66

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US08587904B2

公开(公告)日：2013-11-19

申请号：US12588797

申请日：2009-10-28

Applicant: Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

Inventor： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

IPC: G11B5/48 ,  G11B13/08

CPC classification number: G11B13/04 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  H05K2203/0361

Abstract: A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

Abstract translation: 具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接 头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。

公开(公告)号：US20130001709A1

公开(公告)日：2013-01-03

申请号：US13172604

申请日：2011-06-29

Applicant: Chia-Ming Liu

Inventor： Chia-Ming Liu

IPC: H01L29/84 ,  H01L21/60

CPC classification number: H05K1/181 ,  B81C1/0023 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1461 ,  H05K1/0201 ,  H05K3/3431 ,  H05K2201/10083 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/00

Abstract: A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip, and a micromachined sensor formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound is located between the MEMS die and the Analog ASIC chip. One or more solder balls electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board.

Abstract translation: 感测单元封装尺寸减小，热感测能力更强。 示例性封装包括具有多个电迹线的印刷电路板，专用集成电路（Analog ASIC）芯片，以及形成在微机电系统（MEMS））芯片上的微机械传感器。 模拟ASIC芯片电气和机械连接到印刷电路板。 MEMS管芯与印刷电路板的仅一部分电迹线直接电连通，并且机械和热连接到模拟ASIC芯片。 导热化合物位于MEMS管芯和模拟ASIC芯片之间。 一个或多个焊球将模拟ASIC芯片电连接到印刷电路板，并且一个或多个焊迹迹线将MEMS管芯电连接到印刷电路板。

公开(公告)号：US08289675B2

公开(公告)日：2012-10-16

申请号：US12616533

申请日：2009-11-11

Applicant: Daniel Devoe ,  Alan Devoe ,  Lambert Devoe

Inventor： Daniel Devoe ,  Alan Devoe ,  Lambert Devoe

IPC: H01G4/228

CPC classification number: H01G4/232 ,  H01G4/30 ,  H01G4/38 ,  H05K1/0231 ,  H05K1/181 ,  H05K3/3421 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10636 ,  H05K2201/10946 ,  Y02P70/611

Abstract: A capacitor device mountable on a plane of a substrate includes an electrically conductive bottom plate adapted to be mounted substantially parallel to, and in electrical contact at the plane of the substrate and a first multilayer capacitor having substantially parallel first and second electrode plates oriented substantially perpendicular to the bottom plate with the first electrode plates being electrically connected to the bottom plate. An electrically conductive top lead frame overlaps with, and is electrically isolated from, the bottom plate. The top lead frame electrically connected to the second electrode plates and adapted to be electrically connected at the plane of the substrate. The bottom lead frame may have a corrugated shape, where the corrugated shape provides compliance between the first multilayer capacitor and the substrate. A portion of the top lead frame may contact at least a portion of a side of the first multilayer capacitor.

Abstract translation: 可安装在基板的平面上的电容器装置包括导电底板，其适于基本平行于基板平行并且与基板平面电接触;以及第一多层电容器，其具有基本上平行的第一和第二电极板， 到底板，其中第一电极板电连接到底板。 导电顶部引线框架与底板重叠并与底板电隔离。 顶引线框架电连接到第二电极板并且适于在基板的平面处电连接。 底部引线框架可以具有波纹形状，其中波纹形状提供了第一层叠电容器和基板之间的柔顺性。 顶部引线框架的一部分可以接触第一层叠电容器的一侧的至少一部分。

公开(公告)号：US08194353B2

公开(公告)日：2012-06-05

申请号：US12591102

申请日：2009-11-09

Applicant: Tetsuya Ohsawa ,  Toshiki Naito

Inventor： Tetsuya Ohsawa ,  Toshiki Naito

IPC: G11B5/48

CPC classification number: H05K1/189 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  G11B5/4866 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10727

Abstract: A suspension board with circuit includes a conductive pattern, a board main body portion, an auxiliary portion folded back with respect to the board main body portion, a slider disposed on a side of the suspension board with circuit which is closer to the board main body portion, and mounting thereon a magnetic head, and a light emitting element disposed on a side of the suspension board with circuit which is closer to the auxiliary portion. The conductive pattern includes a first conductive pattern including first and second terminals connected to an external circuit and the magnetic head, and second conductive pattern including third and fourth terminals connected to the external circuit and light emitting element. Both of the first and second terminal are disposed on the board main body portion. The third and fourth terminals are disposed on the board main body portion and on the auxiliary portion respectively.

Abstract translation: 具有电路的悬挂板包括导电图案，板主体部分，相对于板主体部分折回的辅助部分，设置在悬挂板侧面的滑块，该滑块更靠近板主体 并安装在磁头上的发光元件和配置在靠近辅助部分的电路的悬挂板侧的发光元件。 导电图案包括第一导电图案，包括连接到外部电路和磁头的第一和第二端子，以及包括连接到外部电路和发光元件的第三和第四端子的第二导电图案。 第一端子和第二端子都设置在板主体部分上。 第三和第四端子分别设置在板主体部分和辅助部分上。

公开(公告)号：US20110235290A1

公开(公告)日：2011-09-29

申请号：US13133283

申请日：2009-11-25

Applicant: Volker Luhr ,  Markus-Alexander Schweiker ,  Rene Kloetzig ,  Andrea Voeth

Inventor： Volker Luhr ,  Markus-Alexander Schweiker ,  Rene Kloetzig ,  Andrea Voeth

IPC: H05K5/00 ,  H05K3/36 ,  H05K7/10

CPC classification number: H05K7/1417 ,  H05K3/301 ,  H05K3/306 ,  H05K3/3421 ,  H05K3/366 ,  H05K5/006 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10537 ,  H05K2201/1059 ,  H05K2201/10606 ,  Y10T29/49126

Abstract: The invention relates to an electrical circuit assembly (1), particularly for a control device of a motor vehicle, having a first circuit board (2), at least one second circuit board (3) and at least one holder (4) for holding the second circuit board (3) on the first circuit board (2), producing an electrical contact (6) between the first (2) and the second (3) circuit boards. According to the invention, the second circuit board (3) is preassembled on the holder (4) and the preassembled unit (5), comprising the second circuit board (3) and holder (4), is connected to the first circuit board (2), wherein the holder (4) and the second circuit board (3) are arranged crosswise, particularly at a right angle, to the first circuit board (2). The invention furthermore relates to a control device and to a method for producing an electrical circuit assembly (1).

Abstract translation: 本发明涉及一种特别用于机动车辆的控制装置的电路组件（1），其具有第一电路板（2），至少一个第二电路板（3）和至少一个保持器（4），用于保持 所述第一电路板（2）上的所述第二电路板（3）在所述第一电路板（2）和所述第二电路板（3）之间产生电触点（6）。 根据本发明，第二电路板（3）预先组装在保持器（4）上，并且包括第二电路板（3）和保持器（4）的预组装单元（5）连接到第一电路板 2），其中保持器（4）和第二电路板（3）与第一电路板（2）横向地，特别是以直角布置。 本发明还涉及一种控制装置和一种用于制造电路组件（1）的方法。

公开(公告)号：US20110090648A1

公开(公告)日：2011-04-21

申请号：US12971671

申请日：2010-12-17

Applicant: Da-Jung CHEN ,  Chau-Chun WEN ,  Chun-Tiao LIU

Inventor： Da-Jung CHEN ,  Chau-Chun WEN ,  Chun-Tiao LIU

IPC: H05K7/00 ,  H05K7/20 ,  H05K9/00

CPC classification number: H05K1/18 ,  H01F27/027 ,  H01F27/29 ,  H01L23/24 ,  H01L23/3121 ,  H01L23/552 ,  H01L23/645 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/181 ,  H05K3/30 ,  H05K3/3421 ,  H05K9/00 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  Y10T29/49071 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract translation: 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US20100277878A1

公开(公告)日：2010-11-04

申请号：US12840589

申请日：2010-07-21

Applicant: Takanori SEKIDO

Inventor： Takanori SEKIDO

IPC: H05K7/00

CPC classification number: H05K1/189 ,  H04N1/02815 ,  H04N2201/02462 ,  H04N2201/02477 ,  H04N2201/02481 ,  H04N2201/02485 ,  H04N2201/02491 ,  H05K3/4691 ,  H05K2201/09036 ,  H05K2201/10537 ,  H05K2203/167

Abstract: There is provided a mounting structure in which, it is possible to regulate positions of mounting components, or in other words, an angle of bending of the circuit board, without using any jigs etc., and it is possible to dispose mounting components at arbitrary positions without inhibiting small-sizing of the mounting structure and of a product in which the mounting structure is installed.A mounting structure (10) having a circuit board (11) which can be bent, inside a casing, includes an angle maintaining means which regulates an angle of bending θ of the circuit board (11) as well as maintains a state of contact by bringing in mutual contact mounting components (12 and 13) which are mounted on the circuit board (11) or by bringing the mounting components which are mounted on the circuit board (11) in contact with the circuit board (11), at the time of bending the circuit board (11).

Abstract translation: 提供了一种安装结构，其中可以在不使用任何夹具等的情况下调节安装部件的位置，或换句话说，电路板的弯曲角度，并且可以将安装部件布置在任意位置 而不会妨碍安装结构的小尺寸和安装结构的产品。 具有可在壳体内弯曲的电路板（11）的安装结构（10）包括调节弯曲角度的角度保持装置; 并且通过引入安装在电路板（11）上的相互接触的安装部件（12和13）或通过使安装在电路板（11）上的安装部件 （11）在电路板（11）弯曲时与电路板（11）接触。