公开(公告)号：US20090109024A1

公开(公告)日：2009-04-30

申请号：US11988131

申请日：2005-06-30

申请人： Karl Weidner ,  Anton Wimmer

发明人： Karl Weidner ,  Anton Wimmer

IPC分类号： G08B21/00

CPC分类号： H05K1/0275 ,  G06F21/86 ,  H05K1/0268 ,  H05K1/0284 ,  H05K1/144 ,  H05K2201/10151

摘要： A circuit which is to be protected contains a substrate which includes a recoiling area is surrounded by protruding areas. A hardware protection system is provided as half-shells and includes conductor structures arranged on and/or in the substrate to detect access to the circuit which is protected.

摘要翻译： 要被保护的电路包含一个衬底，该衬底包括一个反冲区域被突出区域包围。 硬件保护系统被提供为半壳，并且包括布置在衬底上和/或衬底中的导体结构，以检测对被保护电路的访问。

公开(公告)号：US20080128710A1

公开(公告)日：2008-06-05

申请号：US11816186

申请日：2005-12-21

申请人： Karl Weidner ,  Robert Weinke

发明人： Karl Weidner ,  Robert Weinke

IPC分类号： H01L29/24 ,  H01L21/66 ,  H01L21/768

CPC分类号： H01L21/4853 ,  H01L21/0445 ,  H01L21/4846 ,  H01L22/00 ,  H01L22/20 ,  H01L2924/014

摘要： A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

摘要翻译： 用于制造至少一个半导体组件组，特别是SiC半导体组件组的方法包括在衬底上，特别是在晶片上产生多个半导体组件的步骤。 测试各个半导体部件以检测有效的半导体部件。 组装至少一个半导体组件组，其由许多有效的半导体组件形成，并形成一致的平坦结构。 半导体部件组的工作半导体部件并联电连接。

公开(公告)号：US20060248716A1

公开(公告)日：2006-11-09

申请号：US10547174

申请日：2004-01-15

申请人： Karl Weidner ,  Prof. Eckhard Wolfgang ,  Jörg Zapf

发明人： Karl Weidner ,  Prof. Eckhard Wolfgang ,  Jörg Zapf

IPC分类号： H01L21/84

CPC分类号： H01L23/4822 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/2402 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/82001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3025 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

摘要： A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

摘要翻译： 通过将由非导电材料制成的层和由导电材料制成的层施加到组件和支撑件上并随后从其中除去这些层而直接在不具有外壳的部件上产生自支撑接触结构 说支持。

公开(公告)号：US06504104B2

公开(公告)日：2003-01-07

申请号：US09845378

申请日：2001-04-30

申请人： Hans-Juergen Hacke ,  Manfred Wossler ,  Karl Weidner ,  Wolfgang Radlik

发明人： Hans-Juergen Hacke ,  Manfred Wossler ,  Karl Weidner ,  Wolfgang Radlik

IPC分类号： H05K100

CPC分类号： H01L23/4985 ,  H01L23/49816 ,  H01L24/50 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10734 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

摘要： The transformation of An IC substrate with edge contacts into a ball grid array is accomplished using a flexible circuit that has terminals arranged planarly on the underside for receiving meltable solder humps and whose conductors leading outwardly from the terminals have exposed ends. The upper side of the flexible circuit is connected with the lower side of the substrate, whereupon the edge regions of the flexible circuit are bent up and around the substrate and the ends of the conductors are electrically contacted to the edge contacts of the substrate.

摘要翻译： 将具有边缘触点的IC衬底转换成球栅阵列是使用柔性电路来实现的，所述柔性电路具有平面地布置在底面上用于接收可熔化焊料凸起的端子，并且其从端子向外引出的导体具有暴露端。 柔性电路的上侧与基板的下侧连接，于是柔性电路的边缘区域向上弯曲并围绕基板，并且导体的端部与基板的边缘触点电接触。

公开(公告)号：US5321625A

公开(公告)日：1994-06-14

申请号：US802890

申请日：1991-12-06

申请人： Siegfried Humm ,  Gabor Palosi ,  Karl Weidner

发明人： Siegfried Humm ,  Gabor Palosi ,  Karl Weidner

IPC分类号： B65G1/127 ,  B65G1/137 ,  B65G47/10 ,  G07F5/18 ,  G07F11/58 ,  G06F15/20

CPC分类号： G07F11/002 ,  G07F11/58 ,  G07F5/18

摘要： The apparatus is provided for delivering assembly and machining expendable materials or tools. It comprises an internal continuous lift mechanism with different compartment rows arranged in rotary manner to move past a removal door row. An inputting keyboard for the positioning of the particular compartment row in front of the removal door row also controls the unlocking of door in the door row associated with the selected compartment.The delivery unit is connected by means of a long-range transmission means to a data processing unit, which records the removal of materials and optionally initiates reloading, billing, etc.

摘要翻译： 该设备用于提供装配和加工消耗性材料或工具。 它包括具有以旋转方式布置的不同隔间列的内部连续提升机构以移动通过拆卸门排。 用于将特定隔室排定位在拆卸门排前面的输入键盘还控制与所选隔间相关联的门排中的门的解锁。 传送单元通过远程传输装置连接到数据处理单元，该数据处理单元记录材料的去除并可选地启动重新加载，计费等。

公开(公告)号：US09331010B2

公开(公告)日：2016-05-03

申请号：US12996738

申请日：2009-06-03

申请人： Wolfgang Pahl ,  Karl Weidner

发明人： Wolfgang Pahl ,  Karl Weidner

IPC分类号： H01L23/495 ,  H01L23/498 ,  B81B7/00 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L23/4985 ,  B81B7/0048 ,  B81B2207/07 ,  H01L23/498 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/80 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

摘要： A chip (2, 3) is arranged above a top side of a flexible support (1) and mechanically decoupled from the support. Electrical connections (8, 11) of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer (7) composed of a soft or compressible material.

摘要翻译： 芯片（2,3）布置在柔性支撑件（1）的顶侧上方并且与支撑件机械地分离。 使用平面连接技术来实现芯片的电连接（8,11）。 芯片可以通过气隙或由软或可压缩材料构成的基层（7）与支撑体分离。

公开(公告)号：US09105771B2

公开(公告)日：2015-08-11

申请号：US13816839

申请日：2011-08-12

申请人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

发明人： Karl Weidner ,  Hans Wulkesch ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Johann Ramchen

IPC分类号： H01L31/0232 ,  H01L33/00 ,  H01L33/62 ,  H01L23/00 ,  H01L21/768 ,  H01L33/48

CPC分类号： H01L31/0232 ,  H01L21/76804 ,  H01L24/24 ,  H01L24/82 ,  H01L33/0095 ,  H01L33/48 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24226 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of producing an optoelectronic semiconductor component includes providing a carrier having a top side, an underside situated opposite the top side, and a plurality of connection areas arranged at the top side alongside one another in a lateral direction; applying a plurality of optoelectronic components arranged at a distance from one another in a lateral direction at the top side, the components having a contact area facing away from the carrier; applying protective elements to the contact and connection areas; applying an electrically insulating layer to exposed locations of the carrier, contact areas and protective elements; producing openings in the insulating layer by removing protective elements; and arranging an electrically conductive material on the insulating layer and in the openings, wherein the electrically conductive material connects a contact area to an assigned connection area.

摘要翻译： 制造光电子半导体部件的方法包括提供具有顶侧，与顶侧相对设置的下侧以及沿横向彼此并排布置的多个连接区域的载体; 施加在顶侧沿横向彼此一定距离地布置的多个光电子部件，所述部件具有背离载体的接触区域; 将保护元件施加到触点和连接区域; 将电绝缘层施加到载体，接触区域和保护元件的暴露位置; 通过去除保护元件在绝缘层中产生开口; 以及在所述绝缘层和所述开口中布置导电材料，其中所述导电材料将接触区域连接到所分配的连接区域。

公开(公告)号：US08809180B2

公开(公告)日：2014-08-19

申请号：US11816186

申请日：2005-12-21

申请人： Karl Weidner ,  Robert Weinke

发明人： Karl Weidner ,  Robert Weinke

IPC分类号： H01L21/44 ,  H01L21/66 ,  H01L21/00 ,  H01L21/48 ,  H01L21/04

CPC分类号： H01L21/4853 ,  H01L21/0445 ,  H01L21/4846 ,  H01L22/00 ,  H01L22/20 ,  H01L2924/014

摘要： A method for producing at least one semiconductor component group, in particular a SiC semiconductor component group, includes the step of producing a number of semiconductor components on a substrate, particularly on a wafer. The individual semiconductor components are tested for detecting operative semiconductor components. At least one semiconductor component group is assembled, which is formed of a number of operative semiconductor components and which forms a coherent flat structure. The operative semiconductor components of the semiconductor component group are electrically connecting in parallel.

摘要翻译： 用于制造至少一个半导体组件组，特别是SiC半导体组件组的方法包括在衬底上，特别是在晶片上产生多个半导体组件的步骤。 测试各个半导体部件以检测有效的半导体部件。 组装至少一个半导体组件组，其由许多有效的半导体组件形成，并形成一致的平坦结构。 半导体部件组的工作半导体部件并联电连接。

公开(公告)号：US20130307004A1

公开(公告)日：2013-11-21

申请号：US13822367

申请日：2011-08-22

申请人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

发明人： Karl Weidner ,  Johann Ramchen ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann

IPC分类号： H01L33/60 ,  H01L33/62

CPC分类号： H01L33/60 ,  H01L23/055 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/24 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244

摘要： An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.

摘要翻译： 光电子部件包括具有第一连接区域和第二连接区域的载体，具有基底表面和与基底表面相对的辐射出射表面的辐射发射半导体芯片，其中半导体芯片由载体上的基底表面布置 ，具有布置在所述载体上的下壳体部分和所述半导体芯片的相邻侧面的壳体，以及布置在所述下壳体部分上并形成为由所述半导体芯片发射的辐射的反射器的上壳体部分，以及电连接层 其从半导体芯片的辐射出射表面经由下壳体部分和上壳体部分之间的界面的一部分穿过下壳体部分到达载体上的第一连接区域。

公开(公告)号：US08570748B2

公开(公告)日：2013-10-29

申请号：US13002110

申请日：2009-06-16

申请人： Friedrich Lupp ,  Karl Weidner

发明人： Friedrich Lupp ,  Karl Weidner

IPC分类号： H05K7/20 ,  H01L23/48

CPC分类号： H01L23/49861 ,  H01L23/15 ,  H01L23/4985 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/00

摘要： With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component (1) is fastened to an electrically insulating carrier film (3) having at least one first inorganic material and at least one opening (5) in which at least one electrical contact-connection (7) of the component (1) to outside the component (1) is provided. This makes it possible to provide electronic components (1), in particular power modules, for a temperature range of >175 DEG C.

摘要翻译： 对于电子部件，特别是电源模块，以及用于制造或接触所述部件的相应方法中，组件（1）被紧固到具有至少一个第一无机材料的电绝缘载体膜（3） 以及至少一个开口（5），其中提供组件（1）的至少一个电接触连接（7）到组件（1）外部。 这使得可以在> 175℃的温度范围内提供电子部件（1），特别是功率模块。