公开(公告)号：US4724280A

公开(公告)日：1988-02-09

申请号：US894149

申请日：1986-08-07

申请人： Kazuto Tsuji ,  Tsuyoshi Aoki ,  Michio Ono ,  Rikio Sugiura

发明人： Kazuto Tsuji ,  Tsuyoshi Aoki ,  Michio Ono ,  Rikio Sugiura

IPC分类号： H01L23/50 ,  H01L23/28 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H05K3/34

CPC分类号： H01L23/3107 ,  H01L23/49555 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01067 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3421

摘要： PLCC (Plastic Leaded Chip Carrier) for a LSI having protuberances on the bottom along its lateral side, is provided with interconnectors between leg portions of adjacent protuberances. Each interconnector is a swelling from the bottom surface of the main body of PLCC to fill the gap, i.e. a channel, between the protuberances. The height of the filling, namely the height of the interconnector, is lower than that of prior art protuberance to leave some space. This space, a channel, serves as a duct for solvent to flow therein smoothly to and from the narrow gap between the soldered lead and the top of the protuberance and is located adjoining this narrow gap. Therefore, the undesirably remaining flux in this narrow gap is perfectly removed by this smooth flow of the solvent. The leg portion of the protuberance is strengthened by the interconnector so that the occurrence of a crack of the protuberance when the moled PLCC is ejected from the molding cavities is considerably reduced. The structure, using the interconnector, can also avoid using a slanted protuberance having a sharp top which is likely to hurt the fingers of a PLCC handler, or which has too narrow a bottom as a channel for solvent to smoothly flow.

摘要翻译： 用于具有沿着其侧面的底部突起的LSI的PLCC（塑料引线芯片载体）在相邻突起的腿部之间设置有互连器。 每个互连器是从PLCC的主体的底表面膨胀以填充突起之间的间隙，即通道。 填充物的高度，即互连器的高度，低于现有技术的突起以留下一些空间。 这个空间，一个通道，用作溶剂的流通道，平滑地流到和焊接引线与凸起顶部之间的窄间隙，并且位于邻近该窄间隙处。 因此，通过溶剂的这种平滑流动，可以完全去除在该狭窄间隙中不期望的剩余通量。 突起的腿部通过互连器被加强，使得当从模制腔中排出弯曲的PLCC时突起的裂纹的发生显着减少。 使用互连器的结构也可以避免使用具有尖锐顶部的倾斜突起，该倾斜突起可能伤害PLCC处理器的指状物，或者具有太窄的底部作为溶剂平滑流动的通道。

公开(公告)号：US07923835B2

公开(公告)日：2011-04-12

申请号：US12018263

申请日：2008-01-23

申请人： Yoshihiro Kubota ,  Shirou Youda ,  Kazuto Tsuji

发明人： Yoshihiro Kubota ,  Shirou Youda ,  Kazuto Tsuji

IPC分类号： H01L23/04 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/0052 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20753 ,  H05K3/242 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/0909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/92247

摘要： An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.

摘要翻译： 电子设备具有具有第一和第二周边部分的基板。 第一周边部分提供用于分离的剪切位置。 电子器件具有多个布线层，其中一个在基板上形成功能表面布线，安装在基板上的电子元件以及形成在基板和电子元件上的封装元件。 表面布线选择性地设置在封装构件的下方和与第二周边部分相邻的区域中。

公开(公告)号：US07476811B2

公开(公告)日：2009-01-13

申请号：US11078326

申请日：2005-03-14

申请人： Yoshihiro Kubota ,  Kazuto Tsuji ,  Sumikazu Hosoyamada

发明人： Yoshihiro Kubota ,  Kazuto Tsuji ,  Sumikazu Hosoyamada

IPC分类号： H05K1/00

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L23/24 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/181 ,  H05K1/0203 ,  H05K1/182 ,  H05K3/0058 ,  H05K3/284 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device includes: a semiconductor element; a circuit substrate having a cavity at a center thereof; a heat radiating member having the semiconductor element bonded at a central portion thereof; and a sealing resin configured to seal the semiconductor element in the cavity. A configuration is provided such that a bonding resin may be disposed in a gap portion which communicates with the cavity between the circuit substrate and the heat radiating member, and by means of a bonding force of the bonding resin, the heat radiating member is permanently fixed to the circuit substrate.

摘要翻译： 半导体器件包括：半导体元件; 电路基板，其中心具有空腔; 散热构件，其半导体元件在其中心部分接合; 以及密封树脂，其被配置为将所述半导体元件密封在所述空腔中。 提供一种结构，使得接合树脂可以设置在与电路基板和散热构件之间的空腔连通的间隙部分中，并且借助于接合树脂的结合力，散热构件被永久固定 到电路基板。

公开(公告)号：US07193320B2

公开(公告)日：2007-03-20

申请号：US10352074

申请日：2003-01-28

申请人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

发明人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

IPC分类号： H01L23/06

CPC分类号： H01L24/48 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/06135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/4943 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

公开(公告)号：US5637923A

公开(公告)日：1997-06-10

申请号：US455909

申请日：1995-05-31

申请人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

发明人： Junichi Kasai ,  Kazuto Tsuji ,  Norio Taniguchi ,  Takashi Mashiko ,  Masao Sakuma

IPC分类号： G01R1/04 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/58 ,  H01L23/04

CPC分类号： G01R1/0433 ,  G01R1/04 ,  H01L21/565 ,  H01L21/6835 ,  H01L22/32 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49572 ,  H01L2221/68313 ,  H01L2224/16245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3011

摘要： A semiconductor device including a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.

摘要翻译： 一种半导体器件，包括分别由内部引线和外部引线构成的多个引线，与内部引线电连接的半导体芯片，以及至少封装引线和半导体芯片的内部引线的封装， 引线从封装外部延伸。 该包装具有上部和下部，它们具有相互不同的尺寸，使得通过不同的尺寸在上部和下部之间形成阶梯部分，并且每个外部引线具有比其他部分宽的部分 外部引线仅在封装的阶梯部分内延伸到封装的外侧。

公开(公告)号：US5293072A

公开(公告)日：1994-03-08

申请号：US53802

申请日：1993-04-29

申请人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

发明人： Kazuto Tsuji ,  Tetsuya Hiraoka ,  Tsuyoshi Aoki ,  Junichi Kasai

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H05K3/34 ,  H01L23/48 ,  H01L29/44 ,  H01L29/52 ,  H01L29/60

CPC分类号： H01L21/4825 ,  H01L21/565 ,  H01L23/49517 ,  H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49149

摘要： A semiconductor device accommodated in a package includes a semiconductor chip, a package body for accommodating the semiconductor chip, and a plurality of terminal members embedded in the package body in electrical connection to the semiconductor chip and projecting from a bottom surface of the package body, wherein each of said terminal members is of spherical form, and of a substantially identical diameter.

摘要翻译： 容纳在封装中的半导体器件包括半导体芯片，用于容纳半导体芯片的封装体和与半导体芯片电连接并且从封装主体的底表面突出的嵌入封装体的多个端子构件， 其中每个所述端子构件是球形的，并且具有基本相同的直径。

公开(公告)号：US20080174005A1

公开(公告)日：2008-07-24

申请号：US12018263

申请日：2008-01-23

申请人： Yoshihiro Kubota ,  Shirou Youda ,  Kazuto Tsuji

发明人： Yoshihiro Kubota ,  Shirou Youda ,  Kazuto Tsuji

IPC分类号： H01L23/492 ,  H01L21/60

CPC分类号： H05K3/0052 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/28 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48724 ,  H01L2224/48744 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20753 ,  H05K3/242 ,  H05K3/28 ,  H05K3/284 ,  H05K2201/0909 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/92247

摘要： An electronic device has a substrate that has first and second peripheral portions. The first peripheral portion provides a shearing position for separation. The electronic device has a plurality of wiring layers one of which forms a functional surface wiring on the substrate, an electronic element mounted on the substrate, and an encapsulation member formed over the substrate and the electronic element. The surface wiring is selectively disposed under the encapsulation member and in an area adjacent to the second peripheral portion.

摘要翻译： 电子设备具有具有第一和第二周边部分的基板。 第一周边部分提供用于分离的剪切位置。 电子器件具有多个布线层，其中一个在基板上形成功能表面布线，安装在基板上的电子元件以及形成在基板和电子元件上的封装元件。 表面布线选择性地设置在封装构件的下方和与第二周边部分相邻的区域中。

公开(公告)号：US5861669A

公开(公告)日：1999-01-19

申请号：US488673

申请日：1995-06-07

申请人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

发明人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

摘要翻译： 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US5574310A

公开(公告)日：1996-11-12

申请号：US485117

申请日：1995-06-07

申请人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

发明人： Michio Sono ,  Junichi Kasai ,  Masanori Yoshimoto ,  Kazuto Tsuji ,  Kouji Saito

IPC分类号： H01L23/482 ,  H01L23/495 ,  H01L23/58 ,  H05K3/30 ,  H05K3/34 ,  H01L29/41

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K2201/09709 ,  H05K2201/09781 ,  H05K2201/10454 ,  H05K2201/10522 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10696 ,  H05K3/3426 ,  Y02P70/613

摘要： A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

摘要翻译： 具有单列直插式封装的半导体器件包括：半导体芯片;封装体，其容纳半导体芯片并由一对相对的主表面限定;多个互连引线，其由所述封装主体保持，以基本上延伸 垂直于底面。 每个互连引线由位于封装主体内部的内引线部分和位于封装主体外部的外引线部分组成，外引线部分在内部与外部之间的边界处侧向弯曲，在第一 以及彼此相对并且基本上垂直于包装主体的相对主表面的第二方向。 多个支撑腿在包装体的底表面处横向延伸，用于当将半导体器件放置在基底上时支撑包装体直立。

公开(公告)号：US20070114642A1

公开(公告)日：2007-05-24

申请号：US11655253

申请日：2007-01-19

申请人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

发明人： Sumikazu Hosoyamada ,  Yoshitsugu Kato ,  Mitsuo Abe ,  Kazuto Tsuji ,  Masaharu Minamizawa ,  Toshio Hamano ,  Toshiyuki Honda ,  Katsuro Hiraiwa ,  Masashi Takenaka

IPC分类号： H01L23/495

CPC分类号： H01L24/48 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/06135 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/4943 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/1433 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

摘要翻译： 半导体元件具有电路形成面，电极端子在其周边配置有电极端子。 半导体元件由模具树脂封装在基板上，该基板在对应于半导体元件的电极的位置处具有开口。 半导体元件在电路形成表面面向基板并且电极端子位于开口处的状态下安装到基板，并且与半导体元件的电路形成表面相反的后表面从模制树脂露出。 由金属板形成的发热部件设置在与安装有半导体元件的表面相对的基板的表面上。 发泡构件的表面从模制树脂露出。