公开(公告)号：US20050280134A1

公开(公告)日：2005-12-22

申请号：US11154395

申请日：2005-06-16

申请人： David Gibson ,  Andy Stavros ,  Michael Warner

发明人： David Gibson ,  Andy Stavros ,  Michael Warner

IPC分类号： H01L23/02 ,  H01L23/50 ,  H01L23/64

CPC分类号： H01L23/66 ,  H01L23/50 ,  H01L23/642 ,  H01L25/105 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3011 ,  H01L2924/00

摘要： A decoupling device (10) includes a plurality of capacitors having different capacitances (14,16,18) physically mounted in a package (12, 212), and terminals including at least one first terminal (24, 224) and at least one second terminal (26, 226) adapted for mounting the package to a circuit panel. The plural capacitors are connected in parallel between the first and second terminals so as to form plural circuits with different self-resonant frequencies. The device can be mounted as a unit on a circuit board with the first terminals connected to a power conductor and the second terminals connected to a ground conductor, and provides low impedance shunting of noise over a wide frequency spectrum.

摘要翻译： 解耦装置（10）包括具有物理地安装在封装（12,212）中的不同电容（14,16,18）的多个电容器，以及包括至少一个第一端子（24,224）和至少一个第二端子 端子（26,226），适于将封装安装到电路板。 多个电容器并联连接在第一和第二端子之间，以形成具有不同自谐振频率的多个电路。 该装置可以作为单元安装在电路板上，其中第一端子连接到电源导体，并且第二端子连接到接地导体，并且在宽频谱上提供低阻抗的噪声分流。

公开(公告)号：US20050087861A1

公开(公告)日：2005-04-28

申请号：US10949844

申请日：2004-09-24

申请人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

发明人： Robert Burtzlaff ,  Belgacem Haba ,  Giles Humpston ,  David Tuckerman ,  Michael Warner ,  Craig Mitchell

IPC分类号： H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/485 ,  H01L27/146 ,  H03H3/007 ,  H03H3/08 ,  H03H9/10 ,  H01L21/44 ,  H01L23/52

CPC分类号： H01L23/3114 ,  B81B2207/095 ,  B81C1/00293 ,  B81C1/00301 ,  B81C2203/0118 ,  B81C2203/0145 ,  B81C2203/019 ,  H01L21/76898 ,  H01L23/04 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L27/14636 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1401 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16151 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H3/007 ,  H03H9/0547 ,  H03H9/0585 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1064 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A packaged microelectronic device is provided which includes: (a) a unit having a chip with an upwardly-facing front surface and a downwardly-facing rear surface, a lid overlying at least a portion of the front surface of the chip, the lid having a top surface facing upwardly away from the chip and unit connections exposed at the top surface of the lid. At least some of the unit connections are electrically connected to the chip. The packaged microelectronic device also includes a package structure including structure defining package terminals, at least some of the package terminals being electrically connected to the chip. The package structure, the unit or both define a downwardly-facing bottom surface of the package, the terminals being exposed at the bottom surface.

摘要翻译： 提供一种封装的微电子器件，其包括：（a）具有面向上的前表面和面向下的后表面的芯片的单元，覆盖所述芯片的前表面的至少一部分的盖，所述盖具有 面向上远离芯片的顶表面和暴露在盖的顶表面处的单元连接。 至少一些单元连接电连接到芯片。 封装的微电子器件还包括包括限定封装端子的结构的封装结构，至少一些封装端子电连接到芯片。 封装结构，单元或两者限定了封装的向下的底部表面，端子在底部表面露出。

公开(公告)号：US06856007B2

公开(公告)日：2005-02-15

申请号：US10210160

申请日：2002-08-01

申请人： Michael Warner

发明人： Michael Warner

IPC分类号： G06F21/00 ,  H01L23/24 ,  H01L23/31 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/552 ,  H01L23/64 ,  H01L25/065 ,  H03H9/05 ,  H03H9/10 ,  H01L23/02

CPC分类号： G06F21/10 ,  G06F2221/2129 ,  H01F17/0033 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45099 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1064 ,  H03H2009/0019 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.

公开(公告)号：US5253291A

公开(公告)日：1993-10-12

申请号：US599533

申请日：1990-10-18

申请人： Absar Naseer ,  Michael Warner ,  Lalit O. Patel

发明人： Absar Naseer ,  Michael Warner ,  Lalit O. Patel

IPC分类号： H04B1/58 ,  H04M3/00 ,  H04B3/20

CPC分类号： H04B1/586 ,  H04M3/005

摘要： A hybrid balance and combination codec filter circuit used in a subscriber line interface circuit over which a connection is established between a digital switching network and a subscriber instrument. The hybrid balance and combination codec filter circuit in combination includes a transmit section that converts differential voltage audio signals representing voice transmissions transmitted from the subscriber instrument into Pulse Code Modulated (PCM) encoded digital data, for transmission to the digital switching network. A receive section converts PCM encoded digital data representing voice signals switched through the digital switching network into differential voltage audio signals for transmission to the subscriber instrument. An included hybrid balance and echo cancellation section connected between the transmit section and the receive section reshapes the audio band signals output by the receive section. The reshaped audio band signals are applied to the transmit section, where they cancel any reflected audio band signals not completely transferred to the terminating impedance. Finally, an impedance section provides an audio band feedback signal between the transmit section and the receive section for synthesizing a source impedance that is matched to the impedance of the tip and ring leads of the subscriber loop.

摘要翻译： 用于用户线接口电路的混合平衡和组合编解码滤波器电路，在数字交换网络和订户仪器之间建立连接。 混合平衡和组合编解码滤波器电路组合包括发送部分，其将表示从用户工具发送的语音传输的差分电压音频信号转换为脉冲编码调制（PCM）编码数字数据，以传输到数字交换网络。 接收部分将表示通过数字交换网络切换的语音信号的PCM编码的数字数据转换成差分电压音频信号，以传输到订户仪器。 连接在发送部分和接收部分之间的包括的混合平衡和回波消除部分重新形成由接收部分输出的音频信号。 重新形成的音频信号被施加到发射部分，在那里它们取消未完全传送到终端阻抗的反射音频信号。 最后，阻抗部分在发射部分和接收部分之间提供音频带反馈信号，用于合成与用户环路的尖端和环形引线的阻抗匹配的源阻抗。

公开(公告)号：US5175764A

公开(公告)日：1992-12-29

申请号：US599537

申请日：1990-10-18

申请人： Lalit O. Patel ,  Michael Warner ,  Absar Naseer

发明人： Lalit O. Patel ,  Michael Warner ,  Absar Naseer

IPC分类号： H04M19/00 ,  H04Q11/04

CPC分类号： H04M19/005 ,  H04Q11/04

摘要： An enhanced high voltage line interface circuit for a digital switching system over which a connection is established between a digital switching system and a subscriber instrument via a subscriber loop. The high voltage line interface circuit includes in combination circuits that provide power to the subscriber loop and convert received analog voice signals transmitted from the subscriber instrument into differential voltage voice signals for subsequent conversion to digital data for use by the digital switching system. Additionally, differential voltage voice signals from the digital switching system are converted to analog voice signals for transmission along the subscriber loop to the subscriber instrument. The high voltage line interface circuit further includes circuits that detect and monitor the subscriber loop status and develop digital logic output signals that are used to report the status of the loop to a digital switching system controller.

摘要翻译： 一种用于数字交换系统的增强型高压线路接口电路，通过该数字交换系统，经由用户环路在数字交换系统和订户工具之间建立连接。 高压线路接口电路包括向用户环路提供电力并将从用户仪器发送的接收的模拟语音信号转换为差分电压语音信号的组合电路，用于后续转换为数字数据供数字交换系统使用。 此外，来自数字交换系统的差分电压语音信号被转换为模拟语音信号，以沿着用户环路向用户仪器传输。 高电压线路接口电路还包括检测和监视用户环路状态并且开发数字逻辑输出信号的电路，所述数字逻辑输出信号用于将环路的状态报告给数字交换系统控制器。